SG151088A1 - Method of manufacturing 3-d spiral stacked inductor on semiconductor material - Google Patents

Method of manufacturing 3-d spiral stacked inductor on semiconductor material

Info

Publication number
SG151088A1
SG151088A1 SG200505168-5A SG2005051685A SG151088A1 SG 151088 A1 SG151088 A1 SG 151088A1 SG 2005051685 A SG2005051685 A SG 2005051685A SG 151088 A1 SG151088 A1 SG 151088A1
Authority
SG
Singapore
Prior art keywords
manufacturing
semiconductor material
stacked inductor
spiral stacked
inductor
Prior art date
Application number
SG200505168-5A
Other languages
English (en)
Inventor
Sia Choon-Beng
Yeo Kiat Seng
Sanford Chu Shao-Fu
Ng Cheng Yeow
Chew Kok Wai
Goh Wang Ling
Original Assignee
Chartered Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chartered Semiconductor Mfg filed Critical Chartered Semiconductor Mfg
Publication of SG151088A1 publication Critical patent/SG151088A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49032—Fabricating head structure or component thereof
    • Y10T29/4906—Providing winding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49073—Electromagnet, transformer or inductor by assembling coil and core
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Resistance Heating (AREA)
SG200505168-5A 2002-09-04 2003-09-02 Method of manufacturing 3-d spiral stacked inductor on semiconductor material SG151088A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/131,336 US6841847B2 (en) 2002-09-04 2002-09-04 3-D spiral stacked inductor on semiconductor material
US10/962,007 US7721414B2 (en) 2002-09-04 2004-10-08 Method of manufacturing 3-D spiral stacked inductor on semiconductor material

Publications (1)

Publication Number Publication Date
SG151088A1 true SG151088A1 (en) 2009-04-30

Family

ID=31713985

Family Applications (2)

Application Number Title Priority Date Filing Date
SG200505168-5A SG151088A1 (en) 2002-09-04 2003-09-02 Method of manufacturing 3-d spiral stacked inductor on semiconductor material
SG200305645A SG109527A1 (en) 2002-09-04 2003-09-02 3-d spiral stacked inductor on semiconductor material

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG200305645A SG109527A1 (en) 2002-09-04 2003-09-02 3-d spiral stacked inductor on semiconductor material

Country Status (6)

Country Link
US (2) US6841847B2 (enExample)
EP (1) EP1396875B1 (enExample)
JP (1) JP4505201B2 (enExample)
AT (1) ATE414990T1 (enExample)
DE (1) DE60324748D1 (enExample)
SG (2) SG151088A1 (enExample)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050104158A1 (en) * 2003-11-19 2005-05-19 Scintera Networks, Inc. Compact, high q inductor for integrated circuit
US7283029B2 (en) * 2004-12-08 2007-10-16 Purdue Research Foundation 3-D transformer for high-frequency applications
US7221251B2 (en) * 2005-03-22 2007-05-22 Acutechnology Semiconductor Air core inductive element on printed circuit board for use in switching power conversion circuitries
US7399696B2 (en) * 2005-08-02 2008-07-15 International Business Machines Corporation Method for high performance inductor fabrication using a triple damascene process with copper BEOL
TWI299556B (en) * 2006-07-07 2008-08-01 Holtek Semiconductor Inc Spiral inductor with high quality factor of integrated circuit
CN101090025B (zh) * 2007-05-25 2012-10-03 威盛电子股份有限公司 一种具有多层结构的螺旋电感元件
JP5578797B2 (ja) 2009-03-13 2014-08-27 ルネサスエレクトロニクス株式会社 半導体装置
TWI385680B (zh) * 2009-05-19 2013-02-11 Realtek Semiconductor Corp 螺旋電感之堆疊結構
US8143952B2 (en) 2009-10-08 2012-03-27 Qualcomm Incorporated Three dimensional inductor and transformer
US8319564B2 (en) * 2010-03-26 2012-11-27 Altera Corporation Integrated circuits with configurable inductors
US8692608B2 (en) 2011-09-19 2014-04-08 United Microelectronics Corp. Charge pump system capable of stabilizing an output voltage
US9030221B2 (en) 2011-09-20 2015-05-12 United Microelectronics Corporation Circuit structure of test-key and test method thereof
US8395455B1 (en) 2011-10-14 2013-03-12 United Microelectronics Corp. Ring oscillator
US8421509B1 (en) 2011-10-25 2013-04-16 United Microelectronics Corp. Charge pump circuit with low clock feed-through
US8588020B2 (en) 2011-11-16 2013-11-19 United Microelectronics Corporation Sense amplifier and method for determining values of voltages on bit-line pair
CN102522388B (zh) * 2011-12-22 2015-11-11 上海华虹宏力半导体制造有限公司 电感及形成方法
US8493806B1 (en) 2012-01-03 2013-07-23 United Microelectronics Corporation Sense-amplifier circuit of memory and calibrating method thereof
US8970197B2 (en) 2012-08-03 2015-03-03 United Microelectronics Corporation Voltage regulating circuit configured to have output voltage thereof modulated digitally
US8724404B2 (en) 2012-10-15 2014-05-13 United Microelectronics Corp. Memory, supply voltage generation circuit, and operation method of a supply voltage generation circuit used for a memory array
US8836460B2 (en) * 2012-10-18 2014-09-16 International Business Machines Corporation Folded conical inductor
US8669897B1 (en) 2012-11-05 2014-03-11 United Microelectronics Corp. Asynchronous successive approximation register analog-to-digital converter and operating method thereof
US8711598B1 (en) 2012-11-21 2014-04-29 United Microelectronics Corp. Memory cell and memory cell array using the same
US8873295B2 (en) 2012-11-27 2014-10-28 United Microelectronics Corporation Memory and operation method thereof
US8643521B1 (en) 2012-11-28 2014-02-04 United Microelectronics Corp. Digital-to-analog converter with greater output resistance
US8953401B2 (en) 2012-12-07 2015-02-10 United Microelectronics Corp. Memory device and method for driving memory array thereof
US9030886B2 (en) 2012-12-07 2015-05-12 United Microelectronics Corp. Memory device and driving method thereof
US8917109B2 (en) 2013-04-03 2014-12-23 United Microelectronics Corporation Method and device for pulse width estimation
US9105355B2 (en) 2013-07-04 2015-08-11 United Microelectronics Corporation Memory cell array operated with multiple operation voltage
US9251948B2 (en) 2013-07-24 2016-02-02 International Business Machines Corporation High efficiency on-chip 3D transformer structure
US9831026B2 (en) * 2013-07-24 2017-11-28 Globalfoundries Inc. High efficiency on-chip 3D transformer structure
US9779869B2 (en) 2013-07-25 2017-10-03 International Business Machines Corporation High efficiency on-chip 3D transformer structure
US9171663B2 (en) 2013-07-25 2015-10-27 Globalfoundries U.S. 2 Llc High efficiency on-chip 3D transformer structure
US8947911B1 (en) 2013-11-07 2015-02-03 United Microelectronics Corp. Method and circuit for optimizing bit line power consumption
US8866536B1 (en) 2013-11-14 2014-10-21 United Microelectronics Corp. Process monitoring circuit and method
US9143143B2 (en) 2014-01-13 2015-09-22 United Microelectronics Corp. VCO restart up circuit and method thereof
KR20160058592A (ko) * 2014-11-17 2016-05-25 에스케이하이닉스 주식회사 알에프 집적회로 및 그 제조방법
US9653204B2 (en) 2015-01-22 2017-05-16 Globalfoundries Inc. Symmetric multi-port inductor for differential multi-band RF circuits
US10249580B2 (en) 2016-06-22 2019-04-02 Qualcomm Incorporated Stacked substrate inductor
US10525690B2 (en) 2016-09-07 2020-01-07 General Electric Company Additive manufacturing-based low-profile inductor
US10199157B2 (en) 2016-09-30 2019-02-05 Intel IP Corporation Stacked metal inductor
TWI723343B (zh) * 2019-02-19 2021-04-01 頎邦科技股份有限公司 具立體電感之半導體結構及其製造方法
US20240321730A1 (en) * 2023-03-24 2024-09-26 Qualcomm Incorporated Integrated device comprising stacked inductors with low or no mutual inductance

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555067A (ja) * 1991-08-28 1993-03-05 Taiyo Yuden Co Ltd 積層セラミツクインダクタの製造方法
US5414402A (en) * 1992-11-19 1995-05-09 Murata Manufacturing Co., Ltd. Multi-layer substrate
US5446311A (en) * 1994-09-16 1995-08-29 International Business Machines Corporation High-Q inductors in silicon technology without expensive metalization
US5831331A (en) * 1996-11-22 1998-11-03 Philips Electronics North America Corporation Self-shielding inductor for multi-layer semiconductor integrated circuits
US6054914A (en) * 1998-07-06 2000-04-25 Midcom, Inc. Multi-layer transformer having electrical connection in a magnetic core
US6355535B2 (en) * 1998-08-07 2002-03-12 Winbond Electronics Corp. Method and structure of manufacturing a high-Q inductor with an air trench
US6395637B1 (en) * 1997-12-03 2002-05-28 Electronics And Telecommunications Research Institute Method for fabricating a inductor of low parasitic resistance and capacitance
US20020067236A1 (en) * 1998-12-11 2002-06-06 Toshiakira Andoh High-Q inductor for high frequency
US6426267B2 (en) * 1998-06-19 2002-07-30 Winbond Electronics Corp. Method for fabricating high-Q inductance device in monolithic technology
JP2002246231A (ja) * 2001-02-14 2002-08-30 Murata Mfg Co Ltd 積層型インダクタ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07106514A (ja) * 1993-10-07 1995-04-21 Toshiba Corp 半導体集積回路装置
JP2904086B2 (ja) * 1995-12-27 1999-06-14 日本電気株式会社 半導体装置およびその製造方法
JP3164025B2 (ja) * 1997-08-04 2001-05-08 日本電気株式会社 半導体集積回路装置及びその製造方法
JPH11224825A (ja) * 1998-02-06 1999-08-17 Murata Mfg Co Ltd 電子部品の製造方法
US6472285B1 (en) * 1999-04-30 2002-10-29 Winbond Electronics Corporation Method for fabricating high-Q inductance device in monolithic technology

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555067A (ja) * 1991-08-28 1993-03-05 Taiyo Yuden Co Ltd 積層セラミツクインダクタの製造方法
US5414402A (en) * 1992-11-19 1995-05-09 Murata Manufacturing Co., Ltd. Multi-layer substrate
US5446311A (en) * 1994-09-16 1995-08-29 International Business Machines Corporation High-Q inductors in silicon technology without expensive metalization
US5831331A (en) * 1996-11-22 1998-11-03 Philips Electronics North America Corporation Self-shielding inductor for multi-layer semiconductor integrated circuits
US6395637B1 (en) * 1997-12-03 2002-05-28 Electronics And Telecommunications Research Institute Method for fabricating a inductor of low parasitic resistance and capacitance
US6426267B2 (en) * 1998-06-19 2002-07-30 Winbond Electronics Corp. Method for fabricating high-Q inductance device in monolithic technology
US6054914A (en) * 1998-07-06 2000-04-25 Midcom, Inc. Multi-layer transformer having electrical connection in a magnetic core
US6355535B2 (en) * 1998-08-07 2002-03-12 Winbond Electronics Corp. Method and structure of manufacturing a high-Q inductor with an air trench
US20020067236A1 (en) * 1998-12-11 2002-06-06 Toshiakira Andoh High-Q inductor for high frequency
JP2002246231A (ja) * 2001-02-14 2002-08-30 Murata Mfg Co Ltd 積層型インダクタ

Also Published As

Publication number Publication date
US7721414B2 (en) 2010-05-25
JP2004104129A (ja) 2004-04-02
DE60324748D1 (de) 2009-01-02
US20040041234A1 (en) 2004-03-04
EP1396875B1 (en) 2008-11-19
EP1396875A3 (en) 2006-06-07
ATE414990T1 (de) 2008-12-15
EP1396875A2 (en) 2004-03-10
US20050057335A1 (en) 2005-03-17
US6841847B2 (en) 2005-01-11
JP4505201B2 (ja) 2010-07-21
SG109527A1 (en) 2005-03-30

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