SG143236A1 - Multi-chips package and method of forming the same - Google Patents

Multi-chips package and method of forming the same

Info

Publication number
SG143236A1
SG143236A1 SG200718396-5A SG2007183965A SG143236A1 SG 143236 A1 SG143236 A1 SG 143236A1 SG 2007183965 A SG2007183965 A SG 2007183965A SG 143236 A1 SG143236 A1 SG 143236A1
Authority
SG
Singapore
Prior art keywords
die
dielectric layer
rdl
forming
substrate
Prior art date
Application number
SG200718396-5A
Other languages
English (en)
Inventor
Wen-Kun Yang
Original Assignee
Advanced Chip Eng Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Chip Eng Tech Inc filed Critical Advanced Chip Eng Tech Inc
Publication of SG143236A1 publication Critical patent/SG143236A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
SG200718396-5A 2006-12-07 2007-12-06 Multi-chips package and method of forming the same SG143236A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/567,767 US20080136002A1 (en) 2006-12-07 2006-12-07 Multi-chips package and method of forming the same

Publications (1)

Publication Number Publication Date
SG143236A1 true SG143236A1 (en) 2008-06-27

Family

ID=39493494

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200718396-5A SG143236A1 (en) 2006-12-07 2007-12-06 Multi-chips package and method of forming the same

Country Status (7)

Country Link
US (1) US20080136002A1 (ko)
JP (1) JP2008153654A (ko)
KR (1) KR20080052491A (ko)
CN (1) CN101197360A (ko)
DE (1) DE102007059162A1 (ko)
SG (1) SG143236A1 (ko)
TW (1) TW200832666A (ko)

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TWI453877B (zh) * 2008-11-07 2014-09-21 Advanced Semiconductor Eng 內埋晶片封裝的結構及製程
TWI501359B (zh) * 2009-03-13 2015-09-21 Xintec Inc 電子元件封裝體及其形成方法
TWI460844B (zh) * 2009-04-06 2014-11-11 King Dragon Internat Inc 具有內嵌式晶片及矽導通孔晶粒之堆疊封裝結構及其製造方法
US8612809B2 (en) * 2009-12-31 2013-12-17 Intel Corporation Systems, methods, and apparatuses for stacked memory
US8569894B2 (en) 2010-01-13 2013-10-29 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
US8320134B2 (en) 2010-02-05 2012-11-27 Advanced Semiconductor Engineering, Inc. Embedded component substrate and manufacturing methods thereof
CN102194706B (zh) * 2010-03-02 2013-08-21 日月光半导体制造股份有限公司 封装工艺
TW201131705A (en) * 2010-03-03 2011-09-16 Advanced Chip Eng Tech Inc Conductor package structure and method of the same
TWI411075B (zh) 2010-03-22 2013-10-01 Advanced Semiconductor Eng 半導體封裝件及其製造方法
US8518746B2 (en) * 2010-09-02 2013-08-27 Stats Chippac, Ltd. Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die
TWI501365B (zh) * 2010-10-13 2015-09-21 Ind Tech Res Inst 封裝單元及其堆疊結構與製造方法
US9337116B2 (en) * 2010-10-28 2016-05-10 Stats Chippac, Ltd. Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor die
TWI416679B (zh) 2010-12-06 2013-11-21 Ind Tech Res Inst 半導體結構及其製造方法
US9406658B2 (en) 2010-12-17 2016-08-02 Advanced Semiconductor Engineering, Inc. Embedded component device and manufacturing methods thereof
US8487426B2 (en) 2011-03-15 2013-07-16 Advanced Semiconductor Engineering, Inc. Semiconductor package with embedded die and manufacturing methods thereof
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