SG135032A1 - Structure of image sensor module and method for manufacturing of wafer level package - Google Patents

Structure of image sensor module and method for manufacturing of wafer level package

Info

Publication number
SG135032A1
SG135032A1 SG200403032-6A SG2004030326A SG135032A1 SG 135032 A1 SG135032 A1 SG 135032A1 SG 2004030326 A SG2004030326 A SG 2004030326A SG 135032 A1 SG135032 A1 SG 135032A1
Authority
SG
Singapore
Prior art keywords
image sensor
manufacturing
sensor module
wafer level
level package
Prior art date
Application number
SG200403032-6A
Other languages
English (en)
Inventor
Wen-Kun Yang
Wen-Pin Yang
Shih-Li Chen
Original Assignee
Advanced Chip Eng Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Chip Eng Tech Inc filed Critical Advanced Chip Eng Tech Inc
Publication of SG135032A1 publication Critical patent/SG135032A1/en

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    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
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    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
SG200403032-6A 2004-04-28 2004-05-28 Structure of image sensor module and method for manufacturing of wafer level package SG135032A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/833,345 US7061106B2 (en) 2004-04-28 2004-04-28 Structure of image sensor module and a method for manufacturing of wafer level package

Publications (1)

Publication Number Publication Date
SG135032A1 true SG135032A1 (en) 2007-09-28

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Application Number Title Priority Date Filing Date
SG200403032-6A SG135032A1 (en) 2004-04-28 2004-05-28 Structure of image sensor module and method for manufacturing of wafer level package

Country Status (7)

Country Link
US (3) US7061106B2 (de)
JP (1) JP2005317887A (de)
KR (1) KR100600304B1 (de)
CN (1) CN100377361C (de)
DE (2) DE102004064028B4 (de)
SG (1) SG135032A1 (de)
TW (1) TWI240338B (de)

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