SG132625A1 - Dicing tape attaching apparatus and dicing tape attaching method - Google Patents

Dicing tape attaching apparatus and dicing tape attaching method

Info

Publication number
SG132625A1
SG132625A1 SG200607949-5A SG2006079495A SG132625A1 SG 132625 A1 SG132625 A1 SG 132625A1 SG 2006079495 A SG2006079495 A SG 2006079495A SG 132625 A1 SG132625 A1 SG 132625A1
Authority
SG
Singapore
Prior art keywords
dicing tape
tape attaching
height
wafer
mount frame
Prior art date
Application number
SG200607949-5A
Other languages
English (en)
Inventor
Minoru Ametani
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of SG132625A1 publication Critical patent/SG132625A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/06—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
    • H01L21/08—Preparation of the foundation plate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG200607949-5A 2005-11-25 2006-11-13 Dicing tape attaching apparatus and dicing tape attaching method SG132625A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005340145A JP4836557B2 (ja) 2005-11-25 2005-11-25 ダイシングテープ貼付装置およびダイシングテープ貼付方法

Publications (1)

Publication Number Publication Date
SG132625A1 true SG132625A1 (en) 2007-06-28

Family

ID=37865739

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200607949-5A SG132625A1 (en) 2005-11-25 2006-11-13 Dicing tape attaching apparatus and dicing tape attaching method

Country Status (8)

Country Link
US (1) US7503365B2 (zh)
EP (1) EP1791162B1 (zh)
JP (1) JP4836557B2 (zh)
KR (1) KR100855749B1 (zh)
DE (1) DE602006005129D1 (zh)
MY (1) MY138786A (zh)
SG (1) SG132625A1 (zh)
TW (1) TWI331774B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200539357A (en) * 2004-04-28 2005-12-01 Lintec Corp Adhering apparatus and adhering method
JP2007043057A (ja) * 2005-07-07 2007-02-15 Lintec Corp シート貼付用テーブル
JP4953764B2 (ja) * 2005-11-29 2012-06-13 株式会社東京精密 剥離テープ貼付方法および剥離テープ貼付装置
JP4906518B2 (ja) * 2007-01-15 2012-03-28 日東電工株式会社 粘着テープ貼付け方法およびこれを用いた粘着テープ貼付け装置
JP4693817B2 (ja) * 2007-07-02 2011-06-01 日東電工株式会社 半導体ウエハへの粘着テープ貼付け方法および保護テープの剥離方法
JP2009246004A (ja) * 2008-03-28 2009-10-22 Tokyo Seimitsu Co Ltd ダイシングテープ貼付装置
JP2010073955A (ja) * 2008-09-19 2010-04-02 Lintec Corp シート貼付装置及び貼付方法
JP2014011241A (ja) * 2012-06-28 2014-01-20 Nitto Denko Corp Ｌｅｄの製造方法
JP6587462B2 (ja) * 2015-09-04 2019-10-09 リンテック株式会社 シート貼付装置およびシート貼付方法
JP6879840B2 (ja) * 2017-06-28 2021-06-02 株式会社ディスコ テープ貼り機及びテープ外し方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5930654A (en) * 1996-02-13 1999-07-27 Fujitsu Limited Method of producing semiconductor devices including a step of dicing a semiconductor wafer while covering the semiconductor wafer by a tape
US6767426B1 (en) * 2002-01-17 2004-07-27 Nitto Denko Corporation Method of cutting a protective tape and protective tape applying apparatus using the same method

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01143211A (ja) 1987-11-27 1989-06-05 Takatori Haitetsuku:Kk ウエハーに対する保護テープの貼付け切り抜き方法および装置
JPH0251248A (ja) * 1988-08-15 1990-02-21 Nitto Denko Corp 半導体ウエハの自動貼付け装置
JPH0724780A (ja) 1993-07-12 1995-01-27 Hitachi Ltd 接着テープ剥離装置
JPH07183365A (ja) 1993-12-24 1995-07-21 Fujitsu Ltd ウエハーマウンタ
JPH1027836A (ja) 1996-07-11 1998-01-27 Sony Corp 半導体装置の製造方法および半導体製造装置
JP3447518B2 (ja) 1996-08-09 2003-09-16 リンテック株式会社 接着シート貼付装置および方法
JPH10284564A (ja) 1997-04-08 1998-10-23 Miyagi Oki Denki Kk 半導体製造方法および半導体製造装置
JP3956084B2 (ja) 2000-10-24 2007-08-08 株式会社タカトリ 半導体ウェーハへのダイボンドテープ貼り付け方法及び装置
JP2002222779A (ja) 2001-01-29 2002-08-09 Nec Yamagata Ltd テープ貼付装置及びテープ貼付方法
JP2002343756A (ja) 2001-05-21 2002-11-29 Tokyo Seimitsu Co Ltd ウェーハ平面加工装置
JP4480926B2 (ja) 2001-09-11 2010-06-16 テイコクテーピングシステム株式会社 シリコンウエハに対する保護フィルムの貼着方法及び貼着装置
JP3770820B2 (ja) 2001-10-03 2006-04-26 日東電工株式会社 保護テープの貼付け方法
JP2003209082A (ja) 2002-01-15 2003-07-25 Nitto Denko Corp 保護テープの貼付方法およびその装置並びに保護テープの剥離方法
JP2004047976A (ja) * 2002-05-21 2004-02-12 Nitto Denko Corp 保護テープ貼付方法およびその装置
JP2004047823A (ja) 2002-07-12 2004-02-12 Tokyo Seimitsu Co Ltd ダイシングテープ貼付装置およびバックグラインド・ダイシングテープ貼付システム
JP4274902B2 (ja) * 2003-10-31 2009-06-10 リンテック株式会社 貼合装置用テーブル
JP4326363B2 (ja) * 2004-02-06 2009-09-02 日東電工株式会社 粘着シート貼付け方法およびこれを用いた装置
JP4505789B2 (ja) * 2004-02-10 2010-07-21 株式会社東京精密 チップ製造方法
TW200539331A (en) 2004-04-14 2005-12-01 Lintec Corp Wafer processing apparatus and wafer processing method
JP4540403B2 (ja) * 2004-06-16 2010-09-08 株式会社東京精密 テープ貼付方法およびテープ貼付装置
JP4549172B2 (ja) * 2004-12-09 2010-09-22 日東電工株式会社 ウエハマウント方法およびこれを用いたウエハマウント装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5930654A (en) * 1996-02-13 1999-07-27 Fujitsu Limited Method of producing semiconductor devices including a step of dicing a semiconductor wafer while covering the semiconductor wafer by a tape
US6767426B1 (en) * 2002-01-17 2004-07-27 Nitto Denko Corporation Method of cutting a protective tape and protective tape applying apparatus using the same method

Also Published As

Publication number Publication date
KR100855749B1 (ko) 2008-09-03
EP1791162B1 (en) 2009-02-11
KR20070055407A (ko) 2007-05-30
TW200729323A (en) 2007-08-01
JP4836557B2 (ja) 2011-12-14
TWI331774B (en) 2010-10-11
EP1791162A1 (en) 2007-05-30
DE602006005129D1 (de) 2009-03-26
MY138786A (en) 2009-07-31
US7503365B2 (en) 2009-03-17
US20070123000A1 (en) 2007-05-31
JP2007149830A (ja) 2007-06-14

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