SG128415A1 - Device for liquid treatment of wafer-shaped articles - Google Patents

Device for liquid treatment of wafer-shaped articles

Info

Publication number
SG128415A1
SG128415A1 SG200106579A SG200106579A SG128415A1 SG 128415 A1 SG128415 A1 SG 128415A1 SG 200106579 A SG200106579 A SG 200106579A SG 200106579 A SG200106579 A SG 200106579A SG 128415 A1 SG128415 A1 SG 128415A1
Authority
SG
Singapore
Prior art keywords
wafer
liquid treatment
shaped articles
articles
treatment
Prior art date
Application number
SG200106579A
Other languages
English (en)
Inventor
Philipp Gesser
Original Assignee
Sez Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sez Ag filed Critical Sez Ag
Publication of SG128415A1 publication Critical patent/SG128415A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • ing And Chemical Polishing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemically Coating (AREA)
  • Photographic Processing Devices Using Wet Methods (AREA)
SG200106579A 2000-10-31 2001-10-24 Device for liquid treatment of wafer-shaped articles SG128415A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP00123714A EP1202326B1 (de) 2000-10-31 2000-10-31 Vorrichtung zur Flüssigkeitsbehandlung von scheibenförmigen Gegenständen

Publications (1)

Publication Number Publication Date
SG128415A1 true SG128415A1 (en) 2007-01-30

Family

ID=8170251

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200106579A SG128415A1 (en) 2000-10-31 2001-10-24 Device for liquid treatment of wafer-shaped articles

Country Status (8)

Country Link
US (3) US7172674B2 (ko)
EP (3) EP1372186B1 (ko)
JP (2) JP4911849B2 (ko)
KR (2) KR100796709B1 (ko)
CN (1) CN1175476C (ko)
AT (2) ATE417356T1 (ko)
DE (2) DE50015481D1 (ko)
SG (1) SG128415A1 (ko)

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US9685707B2 (en) * 2012-05-30 2017-06-20 Raytheon Company Active electronically scanned array antenna
US20140041803A1 (en) * 2012-08-08 2014-02-13 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
US9147593B2 (en) * 2012-10-10 2015-09-29 Lam Research Ag Apparatus for liquid treatment of wafer shaped articles
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US9589818B2 (en) * 2012-12-20 2017-03-07 Lam Research Ag Apparatus for liquid treatment of wafer shaped articles and liquid control ring for use in same
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JP2014030045A (ja) * 2013-09-24 2014-02-13 Dainippon Screen Mfg Co Ltd 基板周縁処理装置および基板周縁処理方法
JP6090113B2 (ja) * 2013-10-30 2017-03-08 東京エレクトロン株式会社 液処理装置
JP6121962B2 (ja) * 2014-09-22 2017-04-26 株式会社Ｓｃｒｅｅｎホールディングス 基板周縁処理方法
KR102490886B1 (ko) * 2015-10-16 2023-01-25 삼성디스플레이 주식회사 박막 증착용 마스크 인장 용접 장치
US11342215B2 (en) 2017-04-25 2022-05-24 Veeco Instruments Inc. Semiconductor wafer processing chamber
CN109411402B (zh) * 2018-08-08 2021-03-30 中芯集成电路（宁波）有限公司 湿法清洗设备
CN109887871B (zh) * 2019-03-26 2021-02-02 上海华力集成电路制造有限公司 晶圆洗边装置其使用方法及一保护罩
TWI748560B (zh) * 2020-07-15 2021-12-01 弘塑科技股份有限公司 自動晶圓定位總成
JP2024506122A (ja) * 2020-12-16 2024-02-09 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 基板支持装置
CN116264153A (zh) * 2021-12-14 2023-06-16 盛美半导体设备(上海)股份有限公司 晶圆背面清洗方法
KR102656188B1 (ko) * 2022-02-21 2024-04-11 (주)디바이스이엔지 기판 식각 처리장치 및 기판 가장자리의 식각 제어 방법

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Also Published As

Publication number Publication date
EP1369904B1 (de) 2009-01-21
DE50004935D1 (de) 2004-02-05
JP4911849B2 (ja) 2012-04-04
US20020050244A1 (en) 2002-05-02
EP1202326B1 (de) 2004-01-02
JP2012080113A (ja) 2012-04-19
KR100789337B1 (ko) 2007-12-28
US7799695B2 (en) 2010-09-21
ATE257277T1 (de) 2004-01-15
EP1202326A1 (de) 2002-05-02
KR100796709B1 (ko) 2008-01-21
JP2002246364A (ja) 2002-08-30
EP1369904A3 (de) 2005-10-26
US7172674B2 (en) 2007-02-06
CN1175476C (zh) 2004-11-10
EP1369904A2 (de) 2003-12-10
JP5396456B2 (ja) 2014-01-22
CN1351368A (zh) 2002-05-29
KR20020033527A (ko) 2002-05-07
US7988818B2 (en) 2011-08-02
KR20070100210A (ko) 2007-10-10
ATE417356T1 (de) 2008-12-15
DE50015481D1 (de) 2009-01-22
EP1372186B1 (de) 2008-12-10
EP1372186A2 (de) 2003-12-17
US20070084561A1 (en) 2007-04-19
EP1372186A3 (de) 2005-10-26
US20050026448A1 (en) 2005-02-03

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