JPS54101275A - One side masking method for plate material - Google Patents

One side masking method for plate material

Info

Publication number
JPS54101275A
JPS54101275A JP727178A JP727178A JPS54101275A JP S54101275 A JPS54101275 A JP S54101275A JP 727178 A JP727178 A JP 727178A JP 727178 A JP727178 A JP 727178A JP S54101275 A JPS54101275 A JP S54101275A
Authority
JP
Japan
Prior art keywords
plate material
adhesives
masking
support plate
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP727178A
Other languages
Japanese (ja)
Inventor
Hiroshi Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP727178A priority Critical patent/JPS54101275A/en
Publication of JPS54101275A publication Critical patent/JPS54101275A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To increase the working efficiency with complete and easy masking, by performing accurate masking for one side only through the utilization of capillary tube phenomenon of adhesives.
CONSTITUTION: In the masking method for one side of plate material by sticking thin and flat plate material 9 via the fluid adhesives 11 on the flat support plate 8, when the plate material 9 is approached to the support plate 8, small gap is caused only at the douthnut region along the circular circumference of the plate material 9 opposed to the support plate, the adhesives 11 is immersed by utilizing capillary tube phenomenon from the center or the external circumference of the plate material 9, and the adhesives is solidified with this condition and the plate material is fixed on the support plate, allowing to perform one side masking for the plate material.
COPYRIGHT: (C)1979,JPO&Japio
JP727178A 1978-01-27 1978-01-27 One side masking method for plate material Pending JPS54101275A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP727178A JPS54101275A (en) 1978-01-27 1978-01-27 One side masking method for plate material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP727178A JPS54101275A (en) 1978-01-27 1978-01-27 One side masking method for plate material

Publications (1)

Publication Number Publication Date
JPS54101275A true JPS54101275A (en) 1979-08-09

Family

ID=11661357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP727178A Pending JPS54101275A (en) 1978-01-27 1978-01-27 One side masking method for plate material

Country Status (1)

Country Link
JP (1) JPS54101275A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1369904A2 (en) * 2000-10-31 2003-12-10 Sez Ag Apparatus for liquid treatment of wafers

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4946375A (en) * 1972-09-05 1974-05-02
JPS51140484A (en) * 1975-05-30 1976-12-03 Hitachi Ltd Method of etching wafer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4946375A (en) * 1972-09-05 1974-05-02
JPS51140484A (en) * 1975-05-30 1976-12-03 Hitachi Ltd Method of etching wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1369904A2 (en) * 2000-10-31 2003-12-10 Sez Ag Apparatus for liquid treatment of wafers
EP1369904A3 (en) * 2000-10-31 2005-10-26 Sez Ag Apparatus for liquid treatment of wafers

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