SG121779A1 - Curing accelerator, epoxy resin composition, and semiconductor device - Google Patents

Curing accelerator, epoxy resin composition, and semiconductor device

Info

Publication number
SG121779A1
SG121779A1 SG200303680A SG200303680A SG121779A1 SG 121779 A1 SG121779 A1 SG 121779A1 SG 200303680 A SG200303680 A SG 200303680A SG 200303680 A SG200303680 A SG 200303680A SG 121779 A1 SG121779 A1 SG 121779A1
Authority
SG
Singapore
Prior art keywords
semiconductor device
resin composition
epoxy resin
curing accelerator
accelerator
Prior art date
Application number
SG200303680A
Other languages
English (en)
Inventor
Akiko Okubo
Yoshiyuki Goh
Yoshihito Akiyama
Hiroshi Hirose
Hirotaka Nonaka
Maki Sugawara
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of SG121779A1 publication Critical patent/SG121779A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02—Phosphorus compounds
    • C07F9/28—Phosphorus compounds with one or more P—C bonds
    • C07F9/54—Quaternary phosphonium compounds
    • C07F9/5442—Aromatic phosphonium compounds (P-C aromatic linkage)
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/50—Phosphorus bound to carbon only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L85/00—Compositions of macromolecular compounds obtained by reactions forming a linkage in the main chain of the macromolecule containing atoms other than silicon, sulfur, nitrogen, oxygen and carbon; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Molecular Biology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG200303680A 2002-06-05 2003-06-05 Curing accelerator, epoxy resin composition, and semiconductor device SG121779A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002164842 2002-06-05
JP2002287225 2002-09-30

Publications (1)

Publication Number Publication Date
SG121779A1 true SG121779A1 (en) 2006-05-26

Family

ID=29552393

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200303680A SG121779A1 (en) 2002-06-05 2003-06-05 Curing accelerator, epoxy resin composition, and semiconductor device

Country Status (8)

Country Link
US (2) US7074738B2 (ko)
EP (1) EP1369445A1 (ko)
JP (1) JP4569076B2 (ko)
KR (1) KR100948462B1 (ko)
CN (1) CN1318490C (ko)
MY (2) MY143183A (ko)
SG (1) SG121779A1 (ko)
TW (1) TWI317743B (ko)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4128420B2 (ja) * 2002-09-27 2008-07-30 住友ベークライト株式会社 エポキシ樹脂用硬化剤組成物、該硬化剤組成物を用いたエポキシ樹脂組成物および半導体装置
JP4152161B2 (ja) * 2002-10-07 2008-09-17 住友ベークライト株式会社 エポキシ樹脂用硬化剤組成物、該硬化剤組成物を用いたエポキシ樹脂組成物および半導体装置
JP4244777B2 (ja) * 2002-10-18 2009-03-25 日立化成工業株式会社 硬化性樹脂の硬化促進剤、硬化性樹脂組成物、電子部品装置、及びホスフィン誘導体の製造方法
JP2005256009A (ja) * 2002-10-18 2005-09-22 Hitachi Chem Co Ltd 硬化性樹脂組成物及び電子部品装置
JP2005240046A (ja) * 2002-10-18 2005-09-08 Hitachi Chem Co Ltd 硬化性樹脂組成物及び電子部品装置
JP2004156035A (ja) * 2002-10-18 2004-06-03 Hitachi Chem Co Ltd 硬化性樹脂の硬化促進剤、硬化性樹脂組成物及び電子部品装置
JP4752332B2 (ja) * 2002-10-18 2011-08-17 日立化成工業株式会社 硬化性樹脂組成物及び電子部品装置
JP4752333B2 (ja) * 2002-10-18 2011-08-17 日立化成工業株式会社 硬化性樹脂組成物及び電子部品装置
JP4128430B2 (ja) * 2002-11-21 2008-07-30 住友ベークライト株式会社 硬化促進剤、エポキシ樹脂組成物および半導体装置
JP4341247B2 (ja) * 2003-01-07 2009-10-07 住友ベークライト株式会社 エポキシ樹脂組成物用硬化促進剤、エポキシ樹脂組成物および半導体装置
JP4341251B2 (ja) * 2003-01-22 2009-10-07 住友ベークライト株式会社 エポキシ樹脂用硬化促進剤、エポキシ樹脂組成物および半導体装置
JP2004231800A (ja) * 2003-01-30 2004-08-19 Sumitomo Bakelite Co Ltd アニオン触媒、エポキシ樹脂組成物および半導体装置
JP4341254B2 (ja) * 2003-02-06 2009-10-07 住友ベークライト株式会社 エポキシ樹脂組成物用硬化促進剤、エポキシ樹脂組成物および半導体装置
JP4341261B2 (ja) * 2003-03-05 2009-10-07 住友ベークライト株式会社 エポキシ樹脂用硬化促進剤、エポキシ樹脂組成物および半導体装置
JP2004300256A (ja) * 2003-03-31 2004-10-28 Sumitomo Bakelite Co Ltd 硬化促進剤、エポキシ樹脂組成物および半導体装置
JP4360821B2 (ja) * 2003-03-31 2009-11-11 エア・ウォーター株式会社 ヒドロキシフェニルトリアリールホスホニウムアイオダイド及びその誘導体の製造方法
JP4496739B2 (ja) * 2003-09-09 2010-07-07 住友ベークライト株式会社 硬化促進剤、エポキシ樹脂組成物および半導体装置
JP4385696B2 (ja) * 2003-09-19 2009-12-16 住友ベークライト株式会社 硬化促進剤、エポキシ樹脂組成物および半導体装置
US20050165202A1 (en) * 2003-10-20 2005-07-28 Shinya Nakamura Curing accelerator for curing resin, curing resin composition and electronic component device
US20050267286A1 (en) 2003-10-20 2005-12-01 Shinya Nakamura Curing accelerator for curing resin, curing resin composition, electronic component device and method for producing phosphine derivative
JP4496778B2 (ja) * 2004-01-08 2010-07-07 住友ベークライト株式会社 硬化促進剤、エポキシ樹脂組成物および半導体装置
JP4747584B2 (ja) * 2005-01-18 2011-08-17 住友ベークライト株式会社 半導体用液状封止樹脂組成物及びそれを用いて封止される半導体装置
CN101107285B (zh) * 2005-01-20 2011-01-12 住友电木株式会社 环氧树脂组合物及该组合物潜伏化的方法和半导体装置
WO2006080270A1 (ja) * 2005-01-26 2006-08-03 Hitachi Chemical Co., Ltd. 硬化促進剤、硬化性樹脂組成物及び電子部品装置
JP5326184B2 (ja) * 2005-01-26 2013-10-30 日立化成株式会社 新規化合物及びその製造方法
JP2012052123A (ja) * 2005-02-18 2012-03-15 Hitachi Chem Co Ltd エポキシ樹脂組成物、電子部品装置
JP2006233053A (ja) * 2005-02-25 2006-09-07 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置
JP4793565B2 (ja) * 2005-03-24 2011-10-12 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
TW200643100A (en) 2005-04-15 2006-12-16 Hitachi Chemical Co Ltd Curing accelerating compound-silica composite material, method for producing curing accelerating compound-silica composite material, curing accelerator, curable resin composition, and electronic component
WO2007041200A1 (en) * 2005-09-29 2007-04-12 Goodrich Corporation Electric brake system with flexible force transfer member
KR101288703B1 (ko) 2005-09-30 2013-07-22 스미토모 베이클리트 컴퍼니 리미티드 반도체 봉지용 에폭시 수지 조성물 및 반도체 장치
JP4880275B2 (ja) 2005-10-03 2012-02-22 オリンパスメディカルシステムズ株式会社 静電容量型超音波振動子装置
JP5502268B2 (ja) * 2006-09-14 2014-05-28 信越化学工業株式会社 システムインパッケージ型半導体装置用の樹脂組成物セット
JP5585760B2 (ja) * 2007-07-31 2014-09-10 住友ベークライト株式会社 接着剤用液状樹脂組成物、半導体装置及び半導体装置の製造方法
CN101967266A (zh) * 2010-09-25 2011-02-09 江苏中鹏新材料股份有限公司 无卤阻燃环氧树脂组合物
JP2013023661A (ja) * 2011-07-25 2013-02-04 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
CN103087664A (zh) * 2013-01-29 2013-05-08 深圳市宝力科技有限公司 继电器液态环氧树脂灌封胶及其制备方法
JP6291729B2 (ja) * 2013-06-14 2018-03-14 日立化成株式会社 エポキシ樹脂用硬化促進剤、エポキシ樹脂組成物及び電子部品装置
JP6174385B2 (ja) * 2013-06-14 2017-08-02 日立化成株式会社 ホスホニウム化合物又はその分子間塩、及びその製造方法
JP6437203B2 (ja) * 2014-02-10 2018-12-12 日立化成株式会社 希土類ボンド磁石用コンパウンド、希土類ボンド磁石及び希土類ボンド磁石の製造方法
KR20160038248A (ko) * 2014-09-30 2016-04-07 삼성에스디아이 주식회사 에폭시 수지 조성물, 이방성 도전 필름용 조성물 및 반도체 장치
US9868751B2 (en) 2014-10-22 2018-01-16 Samsung Sdi Co., Ltd. Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared from the same
KR101802583B1 (ko) 2015-06-23 2017-12-29 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물, 및 이를 사용하여 제조된 반도체 소자
KR101835937B1 (ko) 2015-07-03 2018-04-20 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물, 및 이를 사용하여 제조된 반도체 소자
JP7013643B2 (ja) * 2016-10-18 2022-02-01 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物
JP7087797B2 (ja) * 2018-08-01 2022-06-21 Dic株式会社 インク組成物、光変換層及びカラーフィルタ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1492869A (en) * 1974-06-21 1977-11-23 Dow Chemical Co Process of reacting epoxides with phenols and/or carboxylic acids and epoxy resin composition
CS237035B1 (cs) * 1983-09-19 1985-06-13 Jiri Varhanik Ztlftsoh přípravy strukturně rigidního termossttckéhtt adhezíva
JPH09157497A (ja) * 1995-12-06 1997-06-17 Hitachi Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び該樹脂組成物で封止した半導体装置
JPH10287793A (ja) * 1997-04-16 1998-10-27 Hitachi Chem Co Ltd 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3674854A (en) 1971-01-25 1972-07-04 Exxon Research Engineering Co (3,5 dialkyl-4-hydroxy benzyl-)trialkyl phosphonium chlorides and corresponding zwitterions
US4171420A (en) 1974-06-21 1979-10-16 The Dow Chemical Company Latent catalysts for promoting reaction of epoxides with phenols and/or carboxylic acids
CA1147741A (en) 1979-05-23 1983-06-07 George A. Doorakian Phosphonium phenoxide catalysts for promoting reaction of epoxides with phenols and/or carboxylic acids
US4302574A (en) 1979-05-23 1981-11-24 The Dow Chemical Company Phosphonium phenoxide catalysts for promoting reacting of epoxides with phenols and/or carboxylic acids
US4395574A (en) 1980-05-12 1983-07-26 The Dow Chemical Co. Phosphonium phenoxide catalysts for promoting reaction of epoxides with phenols and/or carboxylic acids
US4477645A (en) 1983-07-21 1984-10-16 The Dow Chemical Company Immobilized epoxy advancement initiators
US4540823A (en) 1983-07-21 1985-09-10 The Dow Chemical Company Tetrahydrocarbyl phosphonium salts
US4939112A (en) 1988-10-06 1990-07-03 James River Paper Company, Inc. Catalyst for synthesis of vesicular phenoxy resins
JP3603483B2 (ja) 1996-07-11 2004-12-22 日立化成工業株式会社 半導体素子用封止材及びそれを用いた半導体装置
JP3206449B2 (ja) * 1996-09-20 2001-09-10 株式会社日立製作所 樹脂封止型半導体装置
JPH111541A (ja) * 1997-06-11 1999-01-06 Hitachi Chem Co Ltd 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置
SG73590A1 (en) 1997-12-03 2000-06-20 Sumitomo Bakelite Co Latent catalyst thermosetting resin composition comprising the catalyst epoxy resin molding material comprising the catalyst and semiconductor device
JP3388538B2 (ja) * 1998-06-29 2003-03-24 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
MY123645A (en) 1999-07-22 2006-05-31 Sumitomo Bakelite Co Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product
JP3672225B2 (ja) * 1999-09-30 2005-07-20 住友ベークライト株式会社 熱硬化性樹脂組成物およびそれを用いたエポキシ樹脂成形材料ならびに半導体装置
JP3659116B2 (ja) * 2000-02-22 2005-06-15 日立化成工業株式会社 封止用エポキシ樹脂成形材料及び電子部品装置
JP2001233944A (ja) * 2000-02-23 2001-08-28 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP4622030B2 (ja) * 2000-04-03 2011-02-02 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1492869A (en) * 1974-06-21 1977-11-23 Dow Chemical Co Process of reacting epoxides with phenols and/or carboxylic acids and epoxy resin composition
CS237035B1 (cs) * 1983-09-19 1985-06-13 Jiri Varhanik Ztlftsoh přípravy strukturně rigidního termossttckéhtt adhezíva
JPH09157497A (ja) * 1995-12-06 1997-06-17 Hitachi Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び該樹脂組成物で封止した半導体装置
JPH10287793A (ja) * 1997-04-16 1998-10-27 Hitachi Chem Co Ltd 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置

Also Published As

Publication number Publication date
JP2004176039A (ja) 2004-06-24
KR100948462B1 (ko) 2010-03-17
CN1470550A (zh) 2004-01-28
JP4569076B2 (ja) 2010-10-27
MY142243A (en) 2010-11-15
US20060258822A1 (en) 2006-11-16
TW200409790A (en) 2004-06-16
US7074738B2 (en) 2006-07-11
MY143183A (en) 2011-03-31
US20040039154A1 (en) 2004-02-26
TWI317743B (en) 2009-12-01
KR20030094125A (ko) 2003-12-11
EP1369445A1 (en) 2003-12-10
CN1318490C (zh) 2007-05-30
US7442729B2 (en) 2008-10-28

Similar Documents

Publication Publication Date Title
TWI317743B (en) Curing accelerator, epoxy resin composition, and semiconductor device
SG109590A1 (en) Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device
AU2003202139A1 (en) Encapsulating epoxy resin composition, and electronic parts device using the same
SG10201406279UA (en) Epoxy resin composition and semiconductor device
TWI320422B (en) Epoxy resin composition and semiconductor device
TWI369370B (en) Epoxy resin composition and semiconductor device
AU2003202138A1 (en) Encapsulating epoxy resin composition, and electronic parts device using the same
SG111042A1 (en) Thermosetting resin composition and semiconductor device using the same
EP1736520A4 (en) RESIN COMPOSITION AND SEMICONDUCTOR EQUIPMENT MANUFACTURED THEREFOR
TWI369368B (en) Epoxy resin, epoxy resin composition and cured object thereof
TWI367899B (en) Epoxy resin curing agent and epoxy resin composition
TWI365896B (en) Epoxy resin composition for semiconductor encapsulating use, and semiconductor device
EP1621562A4 (en) CURABLE RESIN COMPOSITION
GB2405875B (en) Photosensitive resin, resin composition and cured product thereof
DE60044993D1 (de) Epoxydharzzusammensetzung zur Einkapselung von Halbleitern und Halbleiterbauelement
AU2003284462A1 (en) Flame-retardant epoxy resin composition and cured object obtained therefrom
GB0213523D0 (en) Epoxy resin composition
EP1584634A4 (en) POLYMER CONNECTION FOR PHOTOLACK AND RESIN COMPOSITION FOR PHOTOLACK
EP1440991A4 (en) HARDENING COMPOSITION FOR EPOXY RESINS, EPOXY RESIN COMPOSITION AND USE THEREOF
HK1046012A1 (zh) 用於半導體封鑄的樹脂組合物、由所述材料獲得的半導體設備以及製造所述半導體設備的方法
EP1642917A4 (en) epoxy resin
SG115586A1 (en) Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
SG117572A1 (en) Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
EP1130041A4 (en) EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
SG89408A1 (en) Epoxy resin composition for encapsulating semiconductor, and resin-encapsulated type semiconductor apparatus