SG120163A1 - Wired circuit board - Google Patents

Wired circuit board

Info

Publication number
SG120163A1
SG120163A1 SG200403102A SG200403102A SG120163A1 SG 120163 A1 SG120163 A1 SG 120163A1 SG 200403102 A SG200403102 A SG 200403102A SG 200403102 A SG200403102 A SG 200403102A SG 120163 A1 SG120163 A1 SG 120163A1
Authority
SG
Singapore
Prior art keywords
circuit board
wired circuit
wired
board
circuit
Prior art date
Application number
SG200403102A
Other languages
English (en)
Inventor
Yoshimi Takeshi
Osawa Tetsuya
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG120163A1 publication Critical patent/SG120163A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
SG200403102A 2003-06-04 2004-06-01 Wired circuit board SG120163A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003159134A JP4178077B2 (ja) 2003-06-04 2003-06-04 配線回路基板

Publications (1)

Publication Number Publication Date
SG120163A1 true SG120163A1 (en) 2006-03-28

Family

ID=33487459

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200403102A SG120163A1 (en) 2003-06-04 2004-06-01 Wired circuit board

Country Status (4)

Country Link
US (1) US7132607B2 (zh)
JP (1) JP4178077B2 (zh)
CN (1) CN100455159C (zh)
SG (1) SG120163A1 (zh)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006190767A (ja) * 2005-01-05 2006-07-20 Shinko Electric Ind Co Ltd 半導体装置
JP4403090B2 (ja) * 2005-03-02 2010-01-20 日東電工株式会社 配線回路基板
US7414337B2 (en) 2005-03-14 2008-08-19 Black & Decker Inc. Scrubber
JP4640802B2 (ja) * 2005-07-07 2011-03-02 日東電工株式会社 回路付サスペンション基板
JP4615427B2 (ja) * 2005-12-01 2011-01-19 日東電工株式会社 配線回路基板
JP4845514B2 (ja) * 2006-01-11 2011-12-28 日東電工株式会社 配線回路基板およびその製造方法
JP4749166B2 (ja) * 2006-01-30 2011-08-17 日東電工株式会社 配線回路基板
KR100762395B1 (ko) * 2006-04-10 2007-10-02 엘지전자 주식회사 고주파 임피던스 매칭이 가능한 인쇄회로기판 및 그 제조방법
JP2008034639A (ja) * 2006-07-28 2008-02-14 Nitto Denko Corp 配線回路基板
JP4865453B2 (ja) * 2006-08-30 2012-02-01 日東電工株式会社 配線回路基板およびその製造方法
US8097811B2 (en) * 2007-04-04 2012-01-17 Dai Nippon Printing Co., Ltd. Substrate for suspension
JP2008282995A (ja) * 2007-05-10 2008-11-20 Nitto Denko Corp 配線回路基板
US8169746B1 (en) 2008-04-08 2012-05-01 Hutchinson Technology Incorporated Integrated lead suspension with multiple trace configurations
JP5387992B2 (ja) 2010-03-30 2014-01-15 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ、並びにサスペンション用基板の製造方法
JP5484176B2 (ja) 2010-04-26 2014-05-07 日東電工株式会社 配線回路基板およびその製造方法
US8885299B1 (en) 2010-05-24 2014-11-11 Hutchinson Technology Incorporated Low resistance ground joints for dual stage actuation disk drive suspensions
TWM395240U (en) * 2010-05-28 2010-12-21 Tennrich Internat Crop Flexible flat cable
CN102404930B (zh) * 2011-11-10 2015-06-03 广东步步高电子工业有限公司 一种多层柔性印刷电路板的改进结构
WO2013138619A1 (en) 2012-03-16 2013-09-19 Hutchinson Technology Incorporated Mid-loadbeam dual stage actuated (dsa) disk drive head suspension
CN103515815B (zh) * 2012-06-28 2016-03-02 联想(北京)有限公司 基于柔性电路板的mhl连接装置、连接器、转换器和系统
CN103582280B (zh) * 2012-07-20 2017-10-03 鸿富锦精密工业（深圳）有限公司 电路板装置
CN103582284B (zh) * 2012-07-30 2017-12-01 鸿富锦精密工业（深圳）有限公司 相机模组用的电路板装置
WO2014035591A1 (en) 2012-08-31 2014-03-06 Hutchinson Technology Incorporated Damped dual stage actuation disk drive suspensions
US8681456B1 (en) 2012-09-14 2014-03-25 Hutchinson Technology Incorporated Co-located gimbal-based dual stage actuation disk drive suspensions
US8896968B2 (en) 2012-10-10 2014-11-25 Hutchinson Technology Incorporated Co-located gimbal-based dual stage actuation disk drive suspensions with dampers
US8941951B2 (en) 2012-11-28 2015-01-27 Hutchinson Technology Incorporated Head suspension flexure with integrated strain sensor and sputtered traces
US8891206B2 (en) 2012-12-17 2014-11-18 Hutchinson Technology Incorporated Co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffener
US8896969B1 (en) 2013-05-23 2014-11-25 Hutchinson Technology Incorporated Two-motor co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffeners
US8717712B1 (en) 2013-07-15 2014-05-06 Hutchinson Technology Incorporated Disk drive suspension assembly having a partially flangeless load point dimple
US8792214B1 (en) 2013-07-23 2014-07-29 Hutchinson Technology Incorporated Electrical contacts to motors in dual stage actuated suspensions
US8675314B1 (en) 2013-08-21 2014-03-18 Hutchinson Technology Incorporated Co-located gimbal-based dual stage actuation disk drive suspensions with offset motors
US8896970B1 (en) 2013-12-31 2014-11-25 Hutchinson Technology Incorporated Balanced co-located gimbal-based dual stage actuation disk drive suspensions
US8867173B1 (en) 2014-01-03 2014-10-21 Hutchinson Technology Incorporated Balanced multi-trace transmission in a hard disk drive flexure
US9070392B1 (en) 2014-12-16 2015-06-30 Hutchinson Technology Incorporated Piezoelectric disk drive suspension motors having plated stiffeners
US9318136B1 (en) 2014-12-22 2016-04-19 Hutchinson Technology Incorporated Multilayer disk drive motors having out-of-plane bending
US9296188B1 (en) 2015-02-17 2016-03-29 Hutchinson Technology Incorporated Partial curing of a microactuator mounting adhesive in a disk drive suspension
JP6689294B2 (ja) 2015-06-30 2020-04-28 ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ 金誘電体接合部の信頼性を向上させたディスクドライブヘッドサスペンション構造
CN105578733B (zh) * 2016-02-26 2019-03-05 青岛海信移动通信技术股份有限公司 一种pcb及其制作方法
US9646638B1 (en) 2016-05-12 2017-05-09 Hutchinson Technology Incorporated Co-located gimbal-based DSA disk drive suspension with traces routed around slider pad
KR102081078B1 (ko) * 2018-07-02 2020-02-25 도레이첨단소재 주식회사 연성동박적층필름 및 이의 제조방법
JP6965315B2 (ja) * 2019-08-21 2021-11-10 日東電工株式会社 配線回路基板、容器および基板収容セット
WO2022033664A1 (fr) * 2020-08-11 2022-02-17 Arcelormittal Piece de tolerie revetue de plusieurs couches comprenant une fonction electrique et procede de fabrication de ladite piece

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001044581A (ja) * 1999-05-24 2001-02-16 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
JP2003069170A (ja) * 2001-08-28 2003-03-07 Murata Mach Ltd プリント基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10261212A (ja) * 1996-09-27 1998-09-29 Nippon Mektron Ltd 回路配線付き磁気ヘッド用サスペンションの製造法
US6846991B2 (en) * 1999-01-13 2005-01-25 Applied Kinetics, Inc. Electrical component and a shuntable/shunted electrical component and method for shunting and deshunting
JP2001209918A (ja) * 1999-11-19 2001-08-03 Nitto Denko Corp 回路付サスペンション基板
US6515310B2 (en) * 2000-05-06 2003-02-04 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and electric apparatus
JP4019034B2 (ja) * 2003-09-22 2007-12-05 日東電工株式会社 回路付サスペンション基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001044581A (ja) * 1999-05-24 2001-02-16 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
JP2003069170A (ja) * 2001-08-28 2003-03-07 Murata Mach Ltd プリント基板

Also Published As

Publication number Publication date
CN1575091A (zh) 2005-02-02
CN100455159C (zh) 2009-01-21
US20040245015A1 (en) 2004-12-09
JP2004363281A (ja) 2004-12-24
US7132607B2 (en) 2006-11-07
JP4178077B2 (ja) 2008-11-12

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