SG115838A1 - Proximity meniscus manifold - Google Patents
Proximity meniscus manifoldInfo
- Publication number
- SG115838A1 SG115838A1 SG200502522A SG200502522A SG115838A1 SG 115838 A1 SG115838 A1 SG 115838A1 SG 200502522 A SG200502522 A SG 200502522A SG 200502522 A SG200502522 A SG 200502522A SG 115838 A1 SG115838 A1 SG 115838A1
- Authority
- SG
- Singapore
- Prior art keywords
- manifold
- proximity
- proximity meniscus
- meniscus manifold
- meniscus
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
-
- A—HUMAN NECESSITIES
- A45—HAND OR TRAVELLING ARTICLES
- A45D—HAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
- A45D8/00—Hair-holding devices; Accessories therefor
- A45D8/14—Hair grips, i.e. elastic single-piece two-limbed grips
- A45D8/16—Hair grips, i.e. elastic single-piece two-limbed grips with additional fastener
-
- A—HUMAN NECESSITIES
- A45—HAND OR TRAVELLING ARTICLES
- A45D—HAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
- A45D8/00—Hair-holding devices; Accessories therefor
- A45D8/002—Accessories therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/02—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/817,133 US7389783B2 (en) | 2002-09-30 | 2004-04-01 | Proximity meniscus manifold |
Publications (1)
Publication Number | Publication Date |
---|---|
SG115838A1 true SG115838A1 (en) | 2005-10-28 |
Family
ID=34887777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200502522A SG115838A1 (en) | 2004-04-01 | 2005-03-23 | Proximity meniscus manifold |
Country Status (9)
Country | Link |
---|---|
US (1) | US7389783B2 (ja) |
EP (1) | EP1582269B1 (ja) |
JP (1) | JP4676230B2 (ja) |
KR (1) | KR101136772B1 (ja) |
CN (1) | CN100481338C (ja) |
DE (1) | DE602005000450T2 (ja) |
MY (1) | MY137975A (ja) |
SG (1) | SG115838A1 (ja) |
TW (1) | TWI299878B (ja) |
Families Citing this family (37)
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US7234477B2 (en) * | 2000-06-30 | 2007-06-26 | Lam Research Corporation | Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces |
US20040031167A1 (en) | 2002-06-13 | 2004-02-19 | Stein Nathan D. | Single wafer method and apparatus for drying semiconductor substrates using an inert gas air-knife |
US7293571B2 (en) | 2002-09-30 | 2007-11-13 | Lam Research Corporation | Substrate proximity processing housing and insert for generating a fluid meniscus |
US7632376B1 (en) * | 2002-09-30 | 2009-12-15 | Lam Research Corporation | Method and apparatus for atomic layer deposition (ALD) in a proximity system |
US7806126B1 (en) * | 2002-09-30 | 2010-10-05 | Lam Research Corporation | Substrate proximity drying using in-situ local heating of substrate and substrate carrier point of contact, and methods, apparatus, and systems for implementing the same |
US7240679B2 (en) * | 2002-09-30 | 2007-07-10 | Lam Research Corporation | System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold |
US7389783B2 (en) * | 2002-09-30 | 2008-06-24 | Lam Research Corporation | Proximity meniscus manifold |
US7614411B2 (en) | 2002-09-30 | 2009-11-10 | Lam Research Corporation | Controls of ambient environment during wafer drying using proximity head |
US7153400B2 (en) * | 2002-09-30 | 2006-12-26 | Lam Research Corporation | Apparatus and method for depositing and planarizing thin films of semiconductor wafers |
US8236382B2 (en) * | 2002-09-30 | 2012-08-07 | Lam Research Corporation | Proximity substrate preparation sequence, and method, apparatus, and system for implementing the same |
US7997288B2 (en) * | 2002-09-30 | 2011-08-16 | Lam Research Corporation | Single phase proximity head having a controlled meniscus for treating a substrate |
US7513262B2 (en) | 2002-09-30 | 2009-04-07 | Lam Research Corporation | Substrate meniscus interface and methods for operation |
US7383843B2 (en) * | 2002-09-30 | 2008-06-10 | Lam Research Corporation | Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer |
US7367345B1 (en) | 2002-09-30 | 2008-05-06 | Lam Research Corporation | Apparatus and method for providing a confined liquid for immersion lithography |
US7093375B2 (en) * | 2002-09-30 | 2006-08-22 | Lam Research Corporation | Apparatus and method for utilizing a meniscus in substrate processing |
US7675000B2 (en) * | 2003-06-24 | 2010-03-09 | Lam Research Corporation | System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology |
US8062471B2 (en) * | 2004-03-31 | 2011-11-22 | Lam Research Corporation | Proximity head heating method and apparatus |
KR101255048B1 (ko) | 2005-04-01 | 2013-04-16 | 에프에스아이 인터내쇼날 인크. | 하나 이상의 처리 유체를 이용하여 마이크로일렉트로닉 워크피이스를 처리하는데 이용되는 장치용 배리어 구조 및 노즐 장치 |
US7928366B2 (en) * | 2006-10-06 | 2011-04-19 | Lam Research Corporation | Methods of and apparatus for accessing a process chamber using a dual zone gas injector with improved optical access |
CN104319249B (zh) * | 2006-07-07 | 2017-11-07 | Tel Fsi股份有限公司 | 用于处理微电子工件的设备 |
US8813764B2 (en) * | 2009-05-29 | 2014-08-26 | Lam Research Corporation | Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer |
JP4755573B2 (ja) * | 2006-11-30 | 2011-08-24 | 東京応化工業株式会社 | 処理装置および処理方法、ならびに表面処理治具 |
US8146902B2 (en) * | 2006-12-21 | 2012-04-03 | Lam Research Corporation | Hybrid composite wafer carrier for wet clean equipment |
US7975708B2 (en) * | 2007-03-30 | 2011-07-12 | Lam Research Corporation | Proximity head with angled vacuum conduit system, apparatus and method |
US8464736B1 (en) | 2007-03-30 | 2013-06-18 | Lam Research Corporation | Reclaim chemistry |
US8141566B2 (en) * | 2007-06-19 | 2012-03-27 | Lam Research Corporation | System, method and apparatus for maintaining separation of liquids in a controlled meniscus |
KR101060664B1 (ko) * | 2007-08-07 | 2011-08-31 | 에프에스아이 인터내쇼날 인크. | 하나 이상의 처리유체로 전자소자를 처리하는 장비의 배리어 판 및 벤튜리 시스템의 세정방법 및 관련 장치 |
JP4971078B2 (ja) * | 2007-08-30 | 2012-07-11 | 東京応化工業株式会社 | 表面処理装置 |
US8051863B2 (en) | 2007-10-18 | 2011-11-08 | Lam Research Corporation | Methods of and apparatus for correlating gap value to meniscus stability in processing of a wafer surface by a recipe-controlled meniscus |
US20090101166A1 (en) * | 2007-10-18 | 2009-04-23 | Lam Research Corporation | Apparatus and methods for optimizing cleaning of patterned substrates |
KR20110005699A (ko) | 2008-05-09 | 2011-01-18 | 에프에스아이 인터내쇼날 인크. | 개방 동작 모드와 폐쇄 동작 모드사이를 용이하게 변경하는 처리실 설계를 이용하여 마이크로일렉트로닉 워크피이스를 처리하는 공구 및 방법 |
JP5140641B2 (ja) * | 2009-06-29 | 2013-02-06 | 株式会社荏原製作所 | 基板処理方法及び基板処理装置 |
US8324114B2 (en) | 2010-05-26 | 2012-12-04 | Lam Research Corporation | Method and apparatus for silicon oxide residue removal |
US8539969B2 (en) * | 2010-07-30 | 2013-09-24 | Sematech, Inc. | Gigasonic brush for cleaning surfaces |
JP6352230B2 (ja) * | 2015-10-09 | 2018-07-04 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置及び記録媒体 |
JP6538239B2 (ja) * | 2018-06-06 | 2019-07-03 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置及び記録媒体 |
KR102116534B1 (ko) * | 2018-06-25 | 2020-05-28 | 주식회사 에이치에스하이테크 | 기판 세정용 노즐 및 그 제조 방법 |
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-
2004
- 2004-04-01 US US10/817,133 patent/US7389783B2/en not_active Expired - Fee Related
-
2005
- 2005-03-23 SG SG200502522A patent/SG115838A1/en unknown
- 2005-03-29 DE DE602005000450T patent/DE602005000450T2/de active Active
- 2005-03-29 EP EP05251902A patent/EP1582269B1/en not_active Not-in-force
- 2005-03-31 TW TW094110231A patent/TWI299878B/zh not_active IP Right Cessation
- 2005-03-31 JP JP2005100378A patent/JP4676230B2/ja not_active Expired - Fee Related
- 2005-04-01 KR KR1020050027766A patent/KR101136772B1/ko not_active IP Right Cessation
- 2005-04-01 MY MYPI20051477A patent/MY137975A/en unknown
- 2005-04-01 CN CNB2005100626247A patent/CN100481338C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7389783B2 (en) | 2008-06-24 |
EP1582269A1 (en) | 2005-10-05 |
CN1684231A (zh) | 2005-10-19 |
DE602005000450D1 (de) | 2007-03-08 |
DE602005000450T2 (de) | 2007-12-06 |
TWI299878B (en) | 2008-08-11 |
MY137975A (en) | 2009-04-30 |
EP1582269B1 (en) | 2007-01-17 |
CN100481338C (zh) | 2009-04-22 |
TW200603218A (en) | 2006-01-16 |
JP2005340781A (ja) | 2005-12-08 |
KR101136772B1 (ko) | 2012-04-19 |
US20050139318A1 (en) | 2005-06-30 |
KR20060045448A (ko) | 2006-05-17 |
JP4676230B2 (ja) | 2011-04-27 |
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