ATE287126T1 - Verfahren zum entfernen einer flüssigkeit von einer oberfläche einer substrat - Google Patents
Verfahren zum entfernen einer flüssigkeit von einer oberfläche einer substratInfo
- Publication number
- ATE287126T1 ATE287126T1 AT98944906T AT98944906T ATE287126T1 AT E287126 T1 ATE287126 T1 AT E287126T1 AT 98944906 T AT98944906 T AT 98944906T AT 98944906 T AT98944906 T AT 98944906T AT E287126 T1 ATE287126 T1 AT E287126T1
- Authority
- AT
- Austria
- Prior art keywords
- liquid
- substrate
- removal
- locally
- ambient boundary
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US5992997P | 1997-09-24 | 1997-09-24 | |
EP98870056A EP0905746A1 (de) | 1997-09-24 | 1998-03-20 | Verfahren zum Entfernen einer Flüssigkeit von einer Oberfläche einer umlaufenden Substrat |
US7968898P | 1998-03-27 | 1998-03-27 | |
US9803898P | 1998-08-27 | 1998-08-27 | |
PCT/BE1998/000140 WO1999016109A1 (en) | 1997-09-24 | 1998-09-24 | Method and apparatus for removing a liquid from a surface |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE287126T1 true ATE287126T1 (de) | 2005-01-15 |
Family
ID=27443760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT98944906T ATE287126T1 (de) | 1997-09-24 | 1998-09-24 | Verfahren zum entfernen einer flüssigkeit von einer oberfläche einer substrat |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0970511B1 (de) |
JP (1) | JP4017680B2 (de) |
AT (1) | ATE287126T1 (de) |
DE (1) | DE69828592T8 (de) |
WO (1) | WO1999016109A1 (de) |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7000622B2 (en) * | 2002-09-30 | 2006-02-21 | Lam Research Corporation | Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus |
US7234477B2 (en) | 2000-06-30 | 2007-06-26 | Lam Research Corporation | Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces |
US7584761B1 (en) | 2000-06-30 | 2009-09-08 | Lam Research Corporation | Wafer edge surface treatment with liquid meniscus |
KR100416590B1 (ko) * | 2001-01-13 | 2004-02-05 | 삼성전자주식회사 | 반도체 웨이퍼 세정장치 및 이를 이용한 웨이퍼 세정방법 |
US7100304B2 (en) * | 2001-06-12 | 2006-09-05 | Akrion Technologies, Inc. | Megasonic cleaner and dryer |
US6928751B2 (en) | 2001-06-12 | 2005-08-16 | Goldfinger Technologies, Llc | Megasonic cleaner and dryer system |
DE10200525A1 (de) * | 2002-01-09 | 2003-10-23 | Mattson Wet Products Gmbh | Vorrichtung und Verfahren zum Behandeln von scheibenförmigen Substraten |
US7240679B2 (en) | 2002-09-30 | 2007-07-10 | Lam Research Corporation | System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold |
SG140470A1 (en) * | 2002-09-30 | 2008-03-28 | Lam Res Corp | System for substrate processing with meniscus, vacuum, ipa vapor, drying manifold |
US8236382B2 (en) | 2002-09-30 | 2012-08-07 | Lam Research Corporation | Proximity substrate preparation sequence, and method, apparatus, and system for implementing the same |
US7383843B2 (en) | 2002-09-30 | 2008-06-10 | Lam Research Corporation | Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer |
US7069937B2 (en) | 2002-09-30 | 2006-07-04 | Lam Research Corporation | Vertical proximity processor |
US7997288B2 (en) | 2002-09-30 | 2011-08-16 | Lam Research Corporation | Single phase proximity head having a controlled meniscus for treating a substrate |
US6954993B1 (en) | 2002-09-30 | 2005-10-18 | Lam Research Corporation | Concentric proximity processing head |
US7632376B1 (en) | 2002-09-30 | 2009-12-15 | Lam Research Corporation | Method and apparatus for atomic layer deposition (ALD) in a proximity system |
RU2338296C2 (ru) * | 2002-09-30 | 2008-11-10 | Лам Рисерч Корпорейшн | Способ, система, устройство и головка для обработки подложки для полупроводниковых приборов |
US7045018B2 (en) | 2002-09-30 | 2006-05-16 | Lam Research Corporation | Substrate brush scrubbing and proximity cleaning-drying sequence using compatible chemistries, and method, apparatus, and system for implementing the same |
US7093375B2 (en) | 2002-09-30 | 2006-08-22 | Lam Research Corporation | Apparatus and method for utilizing a meniscus in substrate processing |
US7367345B1 (en) | 2002-09-30 | 2008-05-06 | Lam Research Corporation | Apparatus and method for providing a confined liquid for immersion lithography |
US6988327B2 (en) | 2002-09-30 | 2006-01-24 | Lam Research Corporation | Methods and systems for processing a substrate using a dynamic liquid meniscus |
US7614411B2 (en) | 2002-09-30 | 2009-11-10 | Lam Research Corporation | Controls of ambient environment during wafer drying using proximity head |
US7513262B2 (en) | 2002-09-30 | 2009-04-07 | Lam Research Corporation | Substrate meniscus interface and methods for operation |
US7389783B2 (en) | 2002-09-30 | 2008-06-24 | Lam Research Corporation | Proximity meniscus manifold |
US7293571B2 (en) | 2002-09-30 | 2007-11-13 | Lam Research Corporation | Substrate proximity processing housing and insert for generating a fluid meniscus |
US7153400B2 (en) | 2002-09-30 | 2006-12-26 | Lam Research Corporation | Apparatus and method for depositing and planarizing thin films of semiconductor wafers |
US7329321B2 (en) * | 2002-09-30 | 2008-02-12 | Lam Research Corporation | Enhanced wafer cleaning method |
US7704367B2 (en) | 2004-06-28 | 2010-04-27 | Lam Research Corporation | Method and apparatus for plating semiconductor wafers |
US7675000B2 (en) | 2003-06-24 | 2010-03-09 | Lam Research Corporation | System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology |
US7170190B1 (en) | 2003-12-16 | 2007-01-30 | Lam Research Corporation | Apparatus for oscillating a head and methods for implementing the same |
US7350315B2 (en) | 2003-12-22 | 2008-04-01 | Lam Research Corporation | Edge wheel dry manifold |
US8062471B2 (en) * | 2004-03-31 | 2011-11-22 | Lam Research Corporation | Proximity head heating method and apparatus |
US7089687B2 (en) | 2004-09-30 | 2006-08-15 | Lam Research Corporation | Wafer edge wheel with drying function |
US8480810B2 (en) | 2005-12-30 | 2013-07-09 | Lam Research Corporation | Method and apparatus for particle removal |
US7928366B2 (en) | 2006-10-06 | 2011-04-19 | Lam Research Corporation | Methods of and apparatus for accessing a process chamber using a dual zone gas injector with improved optical access |
US8813764B2 (en) | 2009-05-29 | 2014-08-26 | Lam Research Corporation | Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer |
JP4810411B2 (ja) | 2006-11-30 | 2011-11-09 | 東京応化工業株式会社 | 処理装置 |
US8146902B2 (en) | 2006-12-21 | 2012-04-03 | Lam Research Corporation | Hybrid composite wafer carrier for wet clean equipment |
US7975708B2 (en) | 2007-03-30 | 2011-07-12 | Lam Research Corporation | Proximity head with angled vacuum conduit system, apparatus and method |
US8464736B1 (en) | 2007-03-30 | 2013-06-18 | Lam Research Corporation | Reclaim chemistry |
US8388762B2 (en) | 2007-05-02 | 2013-03-05 | Lam Research Corporation | Substrate cleaning technique employing multi-phase solution |
US8141566B2 (en) | 2007-06-19 | 2012-03-27 | Lam Research Corporation | System, method and apparatus for maintaining separation of liquids in a controlled meniscus |
US20110289795A1 (en) | 2010-02-16 | 2011-12-01 | Tomoatsu Ishibashi | Substrate drying apparatus, substrate drying method and control program |
JP5538102B2 (ja) | 2010-07-07 | 2014-07-02 | 株式会社Sokudo | 基板洗浄方法および基板洗浄装置 |
JP2014130883A (ja) * | 2012-12-28 | 2014-07-10 | Ebara Corp | 基板洗浄装置及び基板洗浄方法 |
JP6376553B2 (ja) * | 2014-03-26 | 2018-08-22 | 株式会社Screenホールディングス | 基板処理装置 |
CN108198748B (zh) | 2014-02-27 | 2022-04-29 | 斯克林集团公司 | 基板处理装置 |
JP6376554B2 (ja) * | 2014-03-26 | 2018-08-22 | 株式会社Screenホールディングス | 基板処理装置 |
KR102308587B1 (ko) * | 2014-03-19 | 2021-10-01 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 처리 방법 |
JP6461621B2 (ja) * | 2015-01-23 | 2019-01-30 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
CN105826219B (zh) | 2015-01-23 | 2019-01-04 | 株式会社思可林集团 | 基板处理方法、基板处理装置和流体喷嘴 |
US10720343B2 (en) | 2016-05-31 | 2020-07-21 | Lam Research Ag | Method and apparatus for processing wafer-shaped articles |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4027686A (en) * | 1973-01-02 | 1977-06-07 | Texas Instruments Incorporated | Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water |
JP3351082B2 (ja) * | 1994-01-14 | 2002-11-25 | ソニー株式会社 | 基板乾燥方法と、基板乾燥槽と、ウェーハ洗浄装置および半導体装置の製造方法 |
DE19522525A1 (de) * | 1994-10-04 | 1996-04-11 | Kunze Concewitz Horst Dipl Phy | Verfahren und Vorrichtung zum Feinstreinigen von Oberflächen |
JPH09162159A (ja) * | 1995-12-05 | 1997-06-20 | Dainippon Screen Mfg Co Ltd | 回転式基板乾燥装置 |
EP0905746A1 (de) * | 1997-09-24 | 1999-03-31 | Interuniversitair Micro-Elektronica Centrum Vzw | Verfahren zum Entfernen einer Flüssigkeit von einer Oberfläche einer umlaufenden Substrat |
EP0905747B1 (de) * | 1997-09-24 | 2005-11-30 | Interuniversitair Micro-Elektronica Centrum Vzw | Verfahren und Vorrichtung zum Entfernen von einer Flüssigkeit von der Oberfläche eines rotierenden Substrats |
-
1998
- 1998-09-24 WO PCT/BE1998/000140 patent/WO1999016109A1/en active IP Right Grant
- 1998-09-24 EP EP98944906A patent/EP0970511B1/de not_active Expired - Lifetime
- 1998-09-24 JP JP51835899A patent/JP4017680B2/ja not_active Expired - Lifetime
- 1998-09-24 AT AT98944906T patent/ATE287126T1/de not_active IP Right Cessation
- 1998-09-24 DE DE69828592T patent/DE69828592T8/de active Active
Also Published As
Publication number | Publication date |
---|---|
JP4017680B2 (ja) | 2007-12-05 |
EP0970511B1 (de) | 2005-01-12 |
EP0970511A1 (de) | 2000-01-12 |
DE69828592T8 (de) | 2006-06-08 |
DE69828592D1 (de) | 2005-02-17 |
DE69828592T2 (de) | 2006-03-23 |
JP2001506061A (ja) | 2001-05-08 |
WO1999016109A1 (en) | 1999-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |