|
JP4017680B2
(ja)
*
|
1997-09-24 |
2007-12-05 |
アンテルユニヴェルシテール・ミクロ―エレクトロニカ・サントリュム・ヴェー・ゼッド・ドゥブルヴェ |
表面から液体を除去する方法及び装置
|
|
AT407680B
(de)
|
1999-06-04 |
2001-05-25 |
Sez Semiconduct Equip Zubehoer |
Verfahren und vorrichtung zum trocknen von scheibenförmigen gegenständen
|
|
JP4931285B2
(ja)
*
|
2000-04-20 |
2012-05-16 |
アイメック |
基板の表面の局所化された液体処理のための方法及び装置
|
|
US7021319B2
(en)
*
|
2000-06-26 |
2006-04-04 |
Applied Materials Inc. |
Assisted rinsing in a single wafer cleaning process
|
|
US7000622B2
(en)
|
2002-09-30 |
2006-02-21 |
Lam Research Corporation |
Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus
|
|
US7234477B2
(en)
|
2000-06-30 |
2007-06-26 |
Lam Research Corporation |
Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
|
|
DE10052762A1
(de)
|
2000-10-25 |
2002-05-16 |
Infineon Technologies Ag |
Verfahren und Vorrichtung zum Reinigen einer Halbleiterscheibe
|
|
WO2002095809A2
(en)
*
|
2001-05-18 |
2002-11-28 |
Lam Research Corporation |
Apparatus and method for substrate preparation implementing a surface tension reducing process
|
|
JP4114188B2
(ja)
|
2001-06-12 |
2008-07-09 |
アクリオン テクノロジーズ, インコーポレイテッド |
メガソニック洗浄乾燥システム
|
|
US7100304B2
(en)
*
|
2001-06-12 |
2006-09-05 |
Akrion Technologies, Inc. |
Megasonic cleaner and dryer
|
|
US6770151B1
(en)
|
2001-07-13 |
2004-08-03 |
Lam Research Corporation |
Drying a substrate using a combination of substrate processing technologies
|
|
JP3993048B2
(ja)
|
2002-08-30 |
2007-10-17 |
大日本スクリーン製造株式会社 |
基板処理装置
|
|
US7240679B2
(en)
|
2002-09-30 |
2007-07-10 |
Lam Research Corporation |
System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
|
|
US7614411B2
(en)
|
2002-09-30 |
2009-11-10 |
Lam Research Corporation |
Controls of ambient environment during wafer drying using proximity head
|
|
US7513262B2
(en)
|
2002-09-30 |
2009-04-07 |
Lam Research Corporation |
Substrate meniscus interface and methods for operation
|
|
CN100431092C
(zh)
*
|
2002-09-30 |
2008-11-05 |
拉姆研究公司 |
利用接近晶片表面的多个入口和出口干燥半导体晶片表面的方法和设备
|
|
US6954993B1
(en)
|
2002-09-30 |
2005-10-18 |
Lam Research Corporation |
Concentric proximity processing head
|
|
US6988327B2
(en)
|
2002-09-30 |
2006-01-24 |
Lam Research Corporation |
Methods and systems for processing a substrate using a dynamic liquid meniscus
|
|
US8236382B2
(en)
|
2002-09-30 |
2012-08-07 |
Lam Research Corporation |
Proximity substrate preparation sequence, and method, apparatus, and system for implementing the same
|
|
US7997288B2
(en)
|
2002-09-30 |
2011-08-16 |
Lam Research Corporation |
Single phase proximity head having a controlled meniscus for treating a substrate
|
|
CN100350552C
(zh)
*
|
2002-09-30 |
2007-11-21 |
拉姆研究公司 |
使用弯液面、负压、ipa蒸汽、干燥歧管进行基板处理的系统
|
|
US7069937B2
(en)
|
2002-09-30 |
2006-07-04 |
Lam Research Corporation |
Vertical proximity processor
|
|
US7153400B2
(en)
|
2002-09-30 |
2006-12-26 |
Lam Research Corporation |
Apparatus and method for depositing and planarizing thin films of semiconductor wafers
|
|
US7367345B1
(en)
|
2002-09-30 |
2008-05-06 |
Lam Research Corporation |
Apparatus and method for providing a confined liquid for immersion lithography
|
|
US7293571B2
(en)
|
2002-09-30 |
2007-11-13 |
Lam Research Corporation |
Substrate proximity processing housing and insert for generating a fluid meniscus
|
|
US7632376B1
(en)
|
2002-09-30 |
2009-12-15 |
Lam Research Corporation |
Method and apparatus for atomic layer deposition (ALD) in a proximity system
|
|
US7389783B2
(en)
|
2002-09-30 |
2008-06-24 |
Lam Research Corporation |
Proximity meniscus manifold
|
|
US7045018B2
(en)
|
2002-09-30 |
2006-05-16 |
Lam Research Corporation |
Substrate brush scrubbing and proximity cleaning-drying sequence using compatible chemistries, and method, apparatus, and system for implementing the same
|
|
US7383843B2
(en)
|
2002-09-30 |
2008-06-10 |
Lam Research Corporation |
Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
|
|
US7093375B2
(en)
|
2002-09-30 |
2006-08-22 |
Lam Research Corporation |
Apparatus and method for utilizing a meniscus in substrate processing
|
|
US7675000B2
(en)
|
2003-06-24 |
2010-03-09 |
Lam Research Corporation |
System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology
|
|
US7170190B1
(en)
|
2003-12-16 |
2007-01-30 |
Lam Research Corporation |
Apparatus for oscillating a head and methods for implementing the same
|
|
US8062471B2
(en)
|
2004-03-31 |
2011-11-22 |
Lam Research Corporation |
Proximity head heating method and apparatus
|
|
TWI286353B
(en)
|
2004-10-12 |
2007-09-01 |
Tokyo Electron Ltd |
Substrate processing method and substrate processing apparatus
|
|
JP4527660B2
(ja)
|
2005-06-23 |
2010-08-18 |
東京エレクトロン株式会社 |
基板処理方法及び基板処理装置
|
|
US7928366B2
(en)
|
2006-10-06 |
2011-04-19 |
Lam Research Corporation |
Methods of and apparatus for accessing a process chamber using a dual zone gas injector with improved optical access
|
|
US8813764B2
(en)
|
2009-05-29 |
2014-08-26 |
Lam Research Corporation |
Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer
|
|
JP5143498B2
(ja)
|
2006-10-06 |
2013-02-13 |
東京エレクトロン株式会社 |
基板処理方法、基板処理装置、プログラムならびに記録媒体
|
|
JP4912916B2
(ja)
*
|
2006-10-10 |
2012-04-11 |
大日本スクリーン製造株式会社 |
基板処理装置
|
|
JP4810411B2
(ja)
*
|
2006-11-30 |
2011-11-09 |
東京応化工業株式会社 |
処理装置
|
|
US8146902B2
(en)
|
2006-12-21 |
2012-04-03 |
Lam Research Corporation |
Hybrid composite wafer carrier for wet clean equipment
|
|
US8464736B1
(en)
|
2007-03-30 |
2013-06-18 |
Lam Research Corporation |
Reclaim chemistry
|
|
US7975708B2
(en)
|
2007-03-30 |
2011-07-12 |
Lam Research Corporation |
Proximity head with angled vacuum conduit system, apparatus and method
|
|
DE102007027112B4
(de)
|
2007-06-13 |
2011-06-22 |
Siltronic AG, 81737 |
Verfahren zur Reinigung, Trocknung und Hydrophilierung einer Halbleiterscheibe
|
|
US8141566B2
(en)
|
2007-06-19 |
2012-03-27 |
Lam Research Corporation |
System, method and apparatus for maintaining separation of liquids in a controlled meniscus
|
|
US20110289795A1
(en)
|
2010-02-16 |
2011-12-01 |
Tomoatsu Ishibashi |
Substrate drying apparatus, substrate drying method and control program
|
|
KR101806191B1
(ko)
|
2010-06-17 |
2017-12-07 |
도쿄엘렉트론가부시키가이샤 |
기판 처리 방법, 이 기판 처리 방법을 실행하기 위한 컴퓨터 프로그램이 기록된 기록 매체 및 기판 처리 장치
|
|
KR101596750B1
(ko)
|
2010-06-23 |
2016-02-23 |
도쿄엘렉트론가부시키가이샤 |
기판 처리 방법, 이 기판 처리 방법을 실행하기 위한 컴퓨터 프로그램이 기록된 기록 매체 및 기판 처리 장치
|
|
JP5538102B2
(ja)
|
2010-07-07 |
2014-07-02 |
株式会社Sokudo |
基板洗浄方法および基板洗浄装置
|
|
US9421617B2
(en)
|
2011-06-22 |
2016-08-23 |
Tel Nexx, Inc. |
Substrate holder
|
|
US8613474B2
(en)
|
2011-07-06 |
2013-12-24 |
Tel Nexx, Inc. |
Substrate loader and unloader having a Bernoulli support
|
|
JP5941023B2
(ja)
*
|
2013-08-21 |
2016-06-29 |
東京エレクトロン株式会社 |
基板洗浄装置、基板洗浄方法、及びコンピュータ読み取り可能な記録媒体
|
|
US10962285B2
(en)
*
|
2018-07-13 |
2021-03-30 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Wafer drying system
|
|
CN115287661B
(zh)
*
|
2022-08-23 |
2023-07-07 |
广州安博新能源科技有限公司 |
一种大功率模组生产焊接用酸洗装置
|