DE69934326D1 - Verfahren zur entfernung organischen materials von trägern - Google Patents

Verfahren zur entfernung organischen materials von trägern

Info

Publication number
DE69934326D1
DE69934326D1 DE69934326T DE69934326T DE69934326D1 DE 69934326 D1 DE69934326 D1 DE 69934326D1 DE 69934326 T DE69934326 T DE 69934326T DE 69934326 T DE69934326 T DE 69934326T DE 69934326 D1 DE69934326 D1 DE 69934326D1
Authority
DE
Germany
Prior art keywords
support
organic material
removing organic
residues
films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69934326T
Other languages
English (en)
Other versions
DE69934326T2 (de
Inventor
Ahmad Waleh
O Levenson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Best Label Co Inc
Original Assignee
Best Label Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Best Label Co Inc filed Critical Best Label Co Inc
Publication of DE69934326D1 publication Critical patent/DE69934326D1/de
Application granted granted Critical
Publication of DE69934326T2 publication Critical patent/DE69934326T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02054—Cleaning before device manufacture, i.e. Begin-Of-Line process combining dry and wet cleaning steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/427—Stripping or agents therefor using plasma means only

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Treating Waste Gases (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Magnetic Heads (AREA)
  • Drying Of Semiconductors (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
DE69934326T 1998-08-27 1999-08-20 Verfahren zur entfernung organischen materials von trägern Expired - Lifetime DE69934326T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US141443 1988-01-07
US14144398A 1998-08-27 1998-08-27
PCT/US1999/019018 WO2000012231A1 (en) 1998-08-27 1999-08-20 Method of removing organic materials from substrates

Publications (2)

Publication Number Publication Date
DE69934326D1 true DE69934326D1 (de) 2007-01-18
DE69934326T2 DE69934326T2 (de) 2007-06-21

Family

ID=22495715

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69934326T Expired - Lifetime DE69934326T2 (de) 1998-08-27 1999-08-20 Verfahren zur entfernung organischen materials von trägern

Country Status (10)

Country Link
EP (1) EP1123166B1 (de)
JP (1) JP3611196B2 (de)
KR (1) KR100391526B1 (de)
CN (1) CN1234472C (de)
AT (1) ATE347454T1 (de)
CA (1) CA2341548C (de)
DE (1) DE69934326T2 (de)
IL (1) IL141595A0 (de)
MY (1) MY125913A (de)
WO (1) WO2000012231A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6554004B1 (en) 2000-11-07 2003-04-29 Motorola, Inc. Method for removing etch residue resulting from a process for forming a via
US6756187B2 (en) 2002-01-04 2004-06-29 Nec Lcd Technologies, Ltd. Method for removing patterned layer from lower layer through reflow
JP4979941B2 (ja) * 2005-03-30 2012-07-18 Ｈｏｙａ株式会社 マスクブランクス用ガラス基板の製造方法、マスクブランクスの製造方法
US8034189B2 (en) * 2005-05-02 2011-10-11 Nalco Company Processes for surface cleaning
KR20080051961A (ko) 2006-12-07 2008-06-11 한국전자통신연구원 플렉시블 기판의 세정 방법
JP5151297B2 (ja) * 2007-07-27 2013-02-27 宇部興産株式会社 樹脂フィルムの製造方法、導電層積層樹脂フィルムの製造方法
EP2185298B1 (de) * 2007-07-31 2012-07-04 Corning Incorporated Reinigungsverfahren für optische duv-elemente zur verlängerung ihrer lebenszeit
KR100912704B1 (ko) * 2008-04-22 2009-08-19 세메스 주식회사 기판 처리 장치 및 그의 포토레지스트 제거 방법
CN104779178B (zh) * 2014-01-13 2018-10-16 中芯国际集成电路制造(上海)有限公司 底部防反射层形成方法
TWI528070B (zh) * 2014-04-18 2016-04-01 遠東科技大學 微波加熱分離液晶玻璃的高分子膜之方法
CN104117501A (zh) * 2014-06-26 2014-10-29 苏州一合光学有限公司 超声波清洗机的槽体布局结构
KR102134261B1 (ko) * 2018-10-25 2020-07-16 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
CN109898089A (zh) * 2019-04-26 2019-06-18 宁德阿李科技有限公司 一种铝板表面处理方法
WO2021178302A1 (en) * 2020-03-02 2021-09-10 Inpria Corporation Process environment for inorganic resist patterning
CN115846310A (zh) * 2022-12-23 2023-03-28 上海华源磁业股份有限公司 一种磁性铁氧体磁芯表面涂层清理工艺

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4363673A (en) * 1981-05-22 1982-12-14 The Dow Chemical Company Process for the removal of carbon from solid surfaces
WO1989000895A1 (en) * 1987-07-29 1989-02-09 Purusar Corporation Surface treatment to remove impurities in microrecesses
US5037506A (en) * 1990-09-06 1991-08-06 Subhash Gupta Method of stripping layers of organic materials
US5227001A (en) * 1990-10-19 1993-07-13 Integrated Process Equipment Corporation Integrated dry-wet semiconductor layer removal apparatus and method
US5763016A (en) * 1996-12-19 1998-06-09 Anon, Incorporated Method of forming patterns in organic coatings films and layers

Also Published As

Publication number Publication date
IL141595A0 (en) 2002-03-10
ATE347454T1 (de) 2006-12-15
CA2341548C (en) 2006-12-19
EP1123166A1 (de) 2001-08-16
WO2000012231A1 (en) 2000-03-09
MY125913A (en) 2006-08-30
KR20010109267A (ko) 2001-12-08
CN1234472C (zh) 2006-01-04
CN1359316A (zh) 2002-07-17
DE69934326T2 (de) 2007-06-21
EP1123166B1 (de) 2006-12-06
EP1123166A4 (de) 2003-08-06
JP2002523906A (ja) 2002-07-30
JP3611196B2 (ja) 2005-01-19
KR100391526B1 (ko) 2003-07-12
CA2341548A1 (en) 2000-03-09

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