SG11202105529RA - Probe unit - Google Patents

Probe unit

Info

Publication number
SG11202105529RA
SG11202105529RA SG11202105529RA SG11202105529RA SG11202105529RA SG 11202105529R A SG11202105529R A SG 11202105529RA SG 11202105529R A SG11202105529R A SG 11202105529RA SG 11202105529R A SG11202105529R A SG 11202105529RA SG 11202105529R A SG11202105529R A SG 11202105529RA
Authority
SG
Singapore
Prior art keywords
probe unit
probe
unit
Prior art date
Application number
SG11202105529RA
Other languages
English (en)
Inventor
Tsuyoshi Inuma
Kazuya Soma
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Publication of SG11202105529RA publication Critical patent/SG11202105529RA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
SG11202105529RA 2018-11-27 2019-11-26 Probe unit SG11202105529RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018221430 2018-11-27
PCT/JP2019/046235 WO2020111076A1 (ja) 2018-11-27 2019-11-26 プローブユニット

Publications (1)

Publication Number Publication Date
SG11202105529RA true SG11202105529RA (en) 2021-06-29

Family

ID=70853993

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202105529RA SG11202105529RA (en) 2018-11-27 2019-11-26 Probe unit

Country Status (7)

Country Link
US (1) US11782074B2 (zh)
JP (1) JP6756946B1 (zh)
CN (1) CN113167814B (zh)
PH (1) PH12021551144A1 (zh)
SG (1) SG11202105529RA (zh)
TW (1) TWI717915B (zh)
WO (1) WO2020111076A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7556022B2 (ja) 2020-03-24 2024-09-25 日本発條株式会社 プローブユニット
KR102373067B1 (ko) * 2020-06-30 2022-03-14 리노공업주식회사 검사소켓 및 그의 제조방법
WO2022158032A1 (ja) * 2021-01-19 2022-07-28 日本発條株式会社 プローブユニット
JP2024011702A (ja) * 2022-07-15 2024-01-25 日本発條株式会社 プローブホルダおよびプローブユニット
TWI839053B (zh) * 2022-12-29 2024-04-11 韓商奧金斯電子有限公司 伸縮探針

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6037787A (en) 1998-03-24 2000-03-14 Teradyne, Inc. High performance probe interface for automatic test equipment
TW438980B (en) 1998-03-24 2001-06-07 Teradyne Inc High performance probe interface for automatic test equipment
JP4251855B2 (ja) 2002-11-19 2009-04-08 株式会社ヨコオ 高周波・高速用デバイスの検査治具の製法
JP2005351731A (ja) * 2004-06-10 2005-12-22 Fujitsu Ltd テストソケット
JP4535828B2 (ja) 2004-09-30 2010-09-01 株式会社ヨコオ 検査ユニットの製法
JP4145293B2 (ja) 2004-12-28 2008-09-03 株式会社ルネサステクノロジ 半導体検査装置および半導体装置の製造方法
JP4757531B2 (ja) 2005-04-28 2011-08-24 日本発條株式会社 導電性接触子ホルダおよび導電性接触子ユニット
JP4607004B2 (ja) * 2005-12-27 2011-01-05 株式会社ヨコオ 検査ユニット
JP2007178163A (ja) * 2005-12-27 2007-07-12 Yokowo Co Ltd 検査ユニットおよびそれに用いる検査プローブ用外皮チューブ組立体
WO2009011244A1 (ja) 2007-07-17 2009-01-22 Nhk Spring Co., Ltd. プローブユニット
US7663387B2 (en) * 2007-09-27 2010-02-16 Yokowo Co., Ltd. Test socket
JP2009192419A (ja) 2008-02-15 2009-08-27 Micronics Japan Co Ltd プローブユニット及び検査装置
JP2010038726A (ja) 2008-08-05 2010-02-18 Japan Electronic Materials Corp プローブカード
TWI482973B (zh) 2009-04-03 2015-05-01 Nhk Spring Co Ltd 彈簧用線材、接觸探針及探針單元
JP5427536B2 (ja) 2009-10-01 2014-02-26 東京エレクトロン株式会社 プローブカード
EP2386846A1 (en) 2010-05-14 2011-11-16 Nordson Corporation System and method for testing of bonds of a semiconductor assembly
JP2012098219A (ja) 2010-11-04 2012-05-24 Yamaichi Electronics Co Ltd 半導体装置用ソケット
JP5572066B2 (ja) * 2010-11-08 2014-08-13 ルネサスエレクトロニクス株式会社 テスト用ボード
JP2013127408A (ja) 2011-12-19 2013-06-27 Micronics Japan Co Ltd プローブ構造体ユニットの配線及び製造方法
CN103543304B (zh) 2012-07-13 2016-05-18 旺矽科技股份有限公司 高频探针卡
TW201504631A (zh) 2013-07-23 2015-02-01 Mpi Corp 光電元件檢測用之高頻探針卡
JP6473364B2 (ja) 2015-03-30 2019-02-20 日本発條株式会社 プローブユニット
JP6601138B2 (ja) 2015-10-16 2019-11-06 山一電機株式会社 Ｉｃソケット
CN106771626A (zh) 2017-04-01 2017-05-31 广州市昆德科技有限公司 半绝缘半导体电阻率气控悬浮式探针电容探头及测试方法
US11320461B2 (en) * 2017-07-13 2022-05-03 Nhk Spring Co., Ltd. Probe unit
SG11202002097UA (en) 2017-09-08 2020-04-29 Enplas Corp Electric connection socket

Also Published As

Publication number Publication date
US20220011345A1 (en) 2022-01-13
JP6756946B1 (ja) 2020-09-16
US11782074B2 (en) 2023-10-10
WO2020111076A1 (ja) 2020-06-04
PH12021551144A1 (en) 2021-10-25
TW202022388A (zh) 2020-06-16
JPWO2020111076A1 (ja) 2021-02-15
CN113167814A (zh) 2021-07-23
CN113167814B (zh) 2024-02-27
TWI717915B (zh) 2021-02-01

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