WO2009011244A1 - プローブユニット - Google Patents

プローブユニット Download PDF

Info

Publication number
WO2009011244A1
WO2009011244A1 PCT/JP2008/062290 JP2008062290W WO2009011244A1 WO 2009011244 A1 WO2009011244 A1 WO 2009011244A1 JP 2008062290 W JP2008062290 W JP 2008062290W WO 2009011244 A1 WO2009011244 A1 WO 2009011244A1
Authority
WO
WIPO (PCT)
Prior art keywords
probe
wiring
insertion hole
end section
probes
Prior art date
Application number
PCT/JP2008/062290
Other languages
English (en)
French (fr)
Inventor
Shigeki Ishikawa
Shogo Imuta
Takashi Nidaira
Original Assignee
Nhk Spring Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co., Ltd. filed Critical Nhk Spring Co., Ltd.
Priority to JP2009523602A priority Critical patent/JP5651333B2/ja
Priority to TW097126725A priority patent/TWI394952B/zh
Publication of WO2009011244A1 publication Critical patent/WO2009011244A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

　プローブの撓み方向を揃えつつも、プローブの端部と配線との確実な接触を実現することができるプローブユニットを提供する。この目的のため、導電性材料を用いて形成され、一方の端部が検査対象と接触するワイヤ状のプローブと、前記プローブの端部のうち前記検査対象と接触する端部を挿通する第１挿通孔と、第１挿通孔の中心軸と平行であって異なる中心軸を有し、プローブの端部のうち検査対象に検査用の信号を供給する配線と接触する端部を挿通する第２挿通孔とが対をなして複数個ずつ設けられ、複数のプローブを保持するプローブホルダと、プローブホルダが収容する複数のプローブのいずれかの端部と接触する複数の配線を個別に挿通する複数の配線用挿通孔が設けられた配線基板と、を備え、同一の前記プローブが挿通される第２挿通孔および配線用挿通孔の中心軸は互いに平行であり、かつ異なることとする。
PCT/JP2008/062290 2007-07-17 2008-07-07 プローブユニット WO2009011244A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009523602A JP5651333B2 (ja) 2007-07-17 2008-07-07 プローブユニット
TW097126725A TWI394952B (zh) 2007-07-17 2008-07-15 探針單元

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007186168 2007-07-17
JP2007-186168 2007-07-17

Publications (1)

Publication Number Publication Date
WO2009011244A1 true WO2009011244A1 (ja) 2009-01-22

Family

ID=40259582

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062290 WO2009011244A1 (ja) 2007-07-17 2008-07-07 プローブユニット

Country Status (3)

Country Link
JP (1) JP5651333B2 (ja)
TW (1) TWI394952B (ja)
WO (1) WO2009011244A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109661583A (zh) * 2016-07-27 2019-04-19 日本麦可罗尼克斯股份有限公司 电连接装置
CN113167814A (zh) * 2018-11-27 2021-07-23 日本发条株式会社 探针单元

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112424615A (zh) * 2018-07-13 2021-02-26 日本电产理德股份有限公司 检查治具以及检查装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09304431A (ja) * 1996-05-13 1997-11-28 I C T:Kk プローブ針
JP2005338065A (ja) * 2004-04-26 2005-12-08 Koyo Technos:Kk 検査冶具および検査装置
JP2006258687A (ja) * 2005-03-18 2006-09-28 Koyo Technos:Kk 検査装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001356136A (ja) * 2000-06-15 2001-12-26 Advantest Corp 集積化マイクロコンタクトピン及びその製造方法
JP3505495B2 (ja) * 2000-09-13 2004-03-08 日本電産リード株式会社 基板検査用検査治具、該検査治具を備えた基板検査装置および基板検査用検査治具の組立方法
CN100535676C (zh) * 2005-04-21 2009-09-02 株式会社光阳科技 检查夹具及检查装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09304431A (ja) * 1996-05-13 1997-11-28 I C T:Kk プローブ針
JP2005338065A (ja) * 2004-04-26 2005-12-08 Koyo Technos:Kk 検査冶具および検査装置
JP2006258687A (ja) * 2005-03-18 2006-09-28 Koyo Technos:Kk 検査装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109661583A (zh) * 2016-07-27 2019-04-19 日本麦可罗尼克斯股份有限公司 电连接装置
CN109661583B (zh) * 2016-07-27 2021-08-06 日本麦可罗尼克斯股份有限公司 电连接装置
CN113167814A (zh) * 2018-11-27 2021-07-23 日本发条株式会社 探针单元
US11782074B2 (en) 2018-11-27 2023-10-10 Nhk Spring Co., Ltd. Probe unit
CN113167814B (zh) * 2018-11-27 2024-02-27 日本发条株式会社 探针单元

Also Published As

Publication number Publication date
TW200914837A (en) 2009-04-01
TWI394952B (zh) 2013-05-01
JP5651333B2 (ja) 2015-01-14
JPWO2009011244A1 (ja) 2010-09-16

Similar Documents

Publication Publication Date Title
US7789714B2 (en) Connector assembly
MY154575A (en) Loaded printed circuit board test fixture and method for manufacturing the same
WO2010096171A3 (en) Test access component for automatic testing of circuit assemblies
ATE542271T1 (de) Mehrfach-koaxialkabel-steckverbindung sowie verfahren zum montieren einer solchen mehrfach- koaxialkabel-steckverbindung
TW200741210A (en) Electronic device test set and contact used therein
TW200730829A (en) Finger tester for the testing of non-componented printed circuit boards and method of testing non-componented printed circuit boards with a finger tester
JP2009133722A5 (ja)
WO2010045214A3 (en) Circuit board testing using a probe
MY162914A (en) Wiring board for testing loaded printed circuit board
WO2009011244A1 (ja) プローブユニット
TW200951440A (en) Direct contact probe card
TW200708745A (en) Connector for measuring electrical resistance, and apparatus and method for measuring electrical resistance of circuit board
GB2487845A (en) Signal sensing devices and cicuit boards
HK1163821A1 (en) Contact-connection unit for a test apparatus for testing printed circuit boards
TW200632327A (en) Inspection probe, inspection device optical panel and inspection method for the optical panel
TW200702672A (en) Wafer inspecting sheet-like probe and application thereof
JP2008039725A5 (ja)
TW200619655A (en) Improved printed circuit board development cycle using probe location automation and bead probe technology
TW200702686A (en) Method of testing non-componented large printed circuit boards using a finger tester
US9007083B2 (en) Self-retaining via probe
JP2009289447A5 (ja)
WO2010117565A3 (en) Automated test equipment employing test signal transmission channel with embedded series isolation resistors
US20090302874A1 (en) Method and apparatus for signal probe contact with circuit board vias
WO2008136395A1 (ja) プローブカード
JP6407239B2 (ja) 垂直型プローブモジュールのプローブホルダー

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08777952

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009523602

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08777952

Country of ref document: EP

Kind code of ref document: A1