SG11201701272UA - Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating - Google Patents
Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coatingInfo
- Publication number
- SG11201701272UA SG11201701272UA SG11201701272UA SG11201701272UA SG11201701272UA SG 11201701272U A SG11201701272U A SG 11201701272UA SG 11201701272U A SG11201701272U A SG 11201701272UA SG 11201701272U A SG11201701272U A SG 11201701272UA SG 11201701272U A SG11201701272U A SG 11201701272UA
- Authority
- SG
- Singapore
- Prior art keywords
- protective coating
- semiconductor chip
- manufacturing semiconductor
- forming sheet
- chip provided
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000011253 protective coating Substances 0.000 title 1
- 230000001681 protective effect Effects 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Plasma & Fusion (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Dicing (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Adhesive Tapes (AREA)
- Laser Beam Processing (AREA)
- Laminated Bodies (AREA)
- Paints Or Removers (AREA)
- Formation Of Insulating Films (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014169266 | 2014-08-22 | ||
JP2014169267 | 2014-08-22 | ||
PCT/JP2015/073503 WO2016027883A1 (fr) | 2014-08-22 | 2015-08-21 | Feuille pour formation de membrane protectrice, et procédé de fabrication de puce semi-conductrice avec membrane protectrice |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201701272UA true SG11201701272UA (en) | 2017-04-27 |
Family
ID=55350823
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201701270QA SG11201701270QA (en) | 2014-08-22 | 2015-08-21 | Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating |
SG11201701272UA SG11201701272UA (en) | 2014-08-22 | 2015-08-21 | Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201701270QA SG11201701270QA (en) | 2014-08-22 | 2015-08-21 | Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating |
Country Status (8)
Country | Link |
---|---|
JP (2) | JPWO2016027888A1 (fr) |
KR (2) | KR102368140B1 (fr) |
CN (2) | CN106660333B (fr) |
MY (2) | MY186759A (fr) |
PH (2) | PH12017500284A1 (fr) |
SG (2) | SG11201701270QA (fr) |
TW (4) | TWI712670B (fr) |
WO (2) | WO2016027888A1 (fr) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG11201803325QA (en) * | 2015-10-29 | 2018-05-30 | Lintec Corp | Film for protective film formation and composite sheet for protective film formation |
WO2017149890A1 (fr) * | 2016-03-04 | 2017-09-08 | リンテック株式会社 | Feuille composite pour formation de membrane protectrice |
WO2017149926A1 (fr) * | 2016-03-04 | 2017-09-08 | リンテック株式会社 | Feuille de traitement de semi-conducteur |
KR20180122316A (ko) * | 2016-03-04 | 2018-11-12 | 린텍 가부시키가이샤 | 반도체 가공용 시트 |
JP6573841B2 (ja) * | 2016-03-04 | 2019-09-11 | リンテック株式会社 | 半導体加工用シート |
KR102516392B1 (ko) * | 2016-03-04 | 2023-03-30 | 린텍 가부시키가이샤 | 보호막 형성용 복합 시트 |
JP6617056B2 (ja) * | 2016-03-04 | 2019-12-04 | リンテック株式会社 | 半導体加工用シート、その巻取体および当該巻取体の製造方法 |
TWI721158B (zh) * | 2016-04-28 | 2021-03-11 | 日商琳得科股份有限公司 | 保護膜形成用膜及保護膜形成用複合片 |
TWI778960B (zh) * | 2016-04-28 | 2022-10-01 | 日商琳得科股份有限公司 | 保護膜形成用膜、保護膜形成用複合片、以及附有保護膜的半導體晶片之製造方法 |
TWI796297B (zh) * | 2016-04-28 | 2023-03-21 | 日商琳得科股份有限公司 | 保護膜形成用複合片 |
KR102407322B1 (ko) * | 2016-04-28 | 2022-06-10 | 린텍 가부시키가이샤 | 보호막 형성용 필름 및 보호막 형성용 복합 시트 |
TWI731964B (zh) * | 2016-04-28 | 2021-07-01 | 日商琳得科股份有限公司 | 保護膜形成用複合片 |
WO2017195711A1 (fr) * | 2016-05-12 | 2017-11-16 | 住友ベークライト株式会社 | Ruban adhésif permettant de traiter des substrats semi-conducteurs |
JP6776081B2 (ja) * | 2016-09-28 | 2020-10-28 | リンテック株式会社 | 保護膜付き半導体チップの製造方法及び半導体装置の製造方法 |
JP6438181B1 (ja) * | 2017-05-17 | 2018-12-12 | リンテック株式会社 | 半導体装置及びその製造方法 |
CN111051455B (zh) * | 2017-08-28 | 2022-05-03 | 琳得科株式会社 | 膜状透明粘合剂及红外线传感器模块 |
WO2019146607A1 (fr) * | 2018-01-24 | 2019-08-01 | リンテック株式会社 | Longue feuille stratifiée et son corps d'enroulement |
KR102487552B1 (ko) | 2018-02-05 | 2023-01-11 | 삼성전자주식회사 | 보호막 조성물 및 이를 이용한 반도체 패키지 제조 방법 |
JP7282076B2 (ja) * | 2018-03-23 | 2023-05-26 | リンテック株式会社 | フィルム状接着剤及び半導体加工用シート |
WO2019187010A1 (fr) * | 2018-03-30 | 2019-10-03 | リンテック株式会社 | Feuille composite de formation de film de protection et son procédé de production |
WO2019187014A1 (fr) * | 2018-03-30 | 2019-10-03 | リンテック株式会社 | Feuille de support et feuille composite pour formation de film de protection |
WO2020218519A1 (fr) * | 2019-04-26 | 2020-10-29 | リンテック株式会社 | Procédé de production d'un corps à trois couches, procédé de production d'un corps à quatre couches, procédé de production d'un dispositif à semi-conducteurs équipé d'un film de protection de surface arrière, et corps à trois couches |
JP7453879B2 (ja) | 2020-08-12 | 2024-03-21 | リンテック株式会社 | 保護膜形成用シートロールおよび保護膜形成用シートロールの製造方法 |
JP7484557B2 (ja) | 2020-08-18 | 2024-05-16 | 三菱ケミカル株式会社 | 粘接着剤組成物、粘接着シート及び積層体 |
JP7084972B2 (ja) * | 2020-10-06 | 2022-06-15 | リンテック株式会社 | 保護膜形成用複合シート |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3664131A3 (fr) | 2002-03-12 | 2020-08-19 | Hamamatsu Photonics K. K. | Procédé de division de substrat |
JP3857953B2 (ja) * | 2002-05-16 | 2006-12-13 | 株式会社巴川製紙所 | 半導体装置製造用接着シート |
US20030190466A1 (en) * | 2002-04-03 | 2003-10-09 | Katsuji Nakaba | Adhesive sheet for producing semiconductor devices |
JP4364508B2 (ja) * | 2002-12-27 | 2009-11-18 | リンテック株式会社 | チップ裏面用保護膜形成用シートおよび保護膜付きチップの製造方法 |
US20060128065A1 (en) * | 2003-06-06 | 2006-06-15 | Teiichi Inada | Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method |
WO2005004216A1 (fr) * | 2003-07-08 | 2005-01-13 | Lintec Corporation | Feuille auto-adhesive durcissable pour decoupage en puces/fixation de puces, et procede de fabrication de dispositif a semiconducteur |
JP4846406B2 (ja) * | 2006-03-28 | 2011-12-28 | リンテック株式会社 | チップ用保護膜形成用シート |
CN102216075A (zh) * | 2008-11-27 | 2011-10-12 | 三井-杜邦聚合化学株式会社 | 电子部件用保护膜、其制造方法及用途 |
JP5335483B2 (ja) * | 2009-02-27 | 2013-11-06 | リンテック株式会社 | 粘着剤層付き偏光板の製造方法 |
JP5603757B2 (ja) * | 2009-12-04 | 2014-10-08 | リンテック株式会社 | レーザーダイシング用粘着シート及び半導体装置の製造方法 |
JP2011151362A (ja) | 2009-12-24 | 2011-08-04 | Nitto Denko Corp | ダイシングテープ一体型半導体裏面用フィルム |
JP2012033637A (ja) | 2010-07-29 | 2012-02-16 | Nitto Denko Corp | ダイシングテープ一体型半導体裏面用フィルム及び半導体装置の製造方法 |
JP5580701B2 (ja) * | 2010-09-13 | 2014-08-27 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
JP5449622B2 (ja) * | 2011-07-01 | 2014-03-19 | 古河電気工業株式会社 | 接着フィルム、並びにダイシングダイボンディングフィルム及びそれを用いた半導体加工方法 |
JP5865045B2 (ja) * | 2011-12-07 | 2016-02-17 | リンテック株式会社 | 保護膜形成層付ダイシングシートおよびチップの製造方法 |
JP6001273B2 (ja) * | 2012-02-13 | 2016-10-05 | 信越化学工業株式会社 | 半導体ウエハ用保護フィルム及び半導体チップの製造方法 |
WO2013172328A1 (fr) * | 2012-05-14 | 2013-11-21 | リンテック株式会社 | Feuille ayant une couche de résine adhésive attachée à celle-ci, et procédé de fabrication d'un dispositif à semi-conducteur |
KR102140470B1 (ko) * | 2012-11-30 | 2020-08-03 | 린텍 가부시키가이샤 | 칩용 수지막 형성용 시트 및 반도체 장치의 제조 방법 |
US10106700B2 (en) * | 2014-03-24 | 2018-10-23 | Lintec Corporation | Protection membrane forming film, protection membrane forming utilization sheet, production method and inspection method for workpiece or processed product, workpiece determined as adequate product, and processed product determined as adequate product |
JP5980438B2 (ja) * | 2014-03-24 | 2016-08-31 | リンテック株式会社 | 加工物の製造方法 |
-
2015
- 2015-08-21 MY MYPI2017700515A patent/MY186759A/en unknown
- 2015-08-21 WO PCT/JP2015/073545 patent/WO2016027888A1/fr active Application Filing
- 2015-08-21 KR KR1020177004497A patent/KR102368140B1/ko active IP Right Grant
- 2015-08-21 CN CN201580044562.9A patent/CN106660333B/zh active Active
- 2015-08-21 JP JP2016544268A patent/JPWO2016027888A1/ja active Pending
- 2015-08-21 SG SG11201701270QA patent/SG11201701270QA/en unknown
- 2015-08-21 TW TW108128902A patent/TWI712670B/zh active
- 2015-08-21 MY MYPI2017700479A patent/MY182846A/en unknown
- 2015-08-21 CN CN201580044561.4A patent/CN106660332B/zh active Active
- 2015-08-21 JP JP2016544263A patent/JP6589209B2/ja active Active
- 2015-08-21 TW TW104127314A patent/TWI668290B/zh active
- 2015-08-21 KR KR1020177004494A patent/KR102376017B1/ko active IP Right Grant
- 2015-08-21 SG SG11201701272UA patent/SG11201701272UA/en unknown
- 2015-08-21 WO PCT/JP2015/073503 patent/WO2016027883A1/fr active Application Filing
- 2015-08-21 TW TW108122914A patent/TWI706023B/zh active
- 2015-08-21 TW TW104127316A patent/TWI672354B/zh active
-
2017
- 2017-02-16 PH PH12017500284A patent/PH12017500284A1/en unknown
- 2017-02-16 PH PH12017500285A patent/PH12017500285B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JPWO2016027888A1 (ja) | 2017-06-01 |
TW201614024A (en) | 2016-04-16 |
KR20170044108A (ko) | 2017-04-24 |
TW201940622A (zh) | 2019-10-16 |
PH12017500285A1 (en) | 2017-06-28 |
TW201938728A (zh) | 2019-10-01 |
SG11201701270QA (en) | 2017-03-30 |
KR102376017B1 (ko) | 2022-03-17 |
MY186759A (en) | 2021-08-18 |
KR20170044652A (ko) | 2017-04-25 |
TWI706023B (zh) | 2020-10-01 |
WO2016027883A1 (fr) | 2016-02-25 |
PH12017500284B1 (en) | 2017-07-03 |
PH12017500285B1 (en) | 2017-06-28 |
CN106660333B (zh) | 2018-11-06 |
CN106660332B (zh) | 2020-08-07 |
MY182846A (en) | 2021-02-05 |
TW201614023A (en) | 2016-04-16 |
CN106660333A (zh) | 2017-05-10 |
WO2016027888A1 (fr) | 2016-02-25 |
TWI668290B (zh) | 2019-08-11 |
TWI712670B (zh) | 2020-12-11 |
JPWO2016027883A1 (ja) | 2017-06-01 |
TWI672354B (zh) | 2019-09-21 |
KR102368140B1 (ko) | 2022-02-25 |
PH12017500284A1 (en) | 2017-07-03 |
JP6589209B2 (ja) | 2019-10-16 |
CN106660332A (zh) | 2017-05-10 |
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