JPWO2016027888A1 - 保護膜形成用シートおよび保護膜付き半導体チップの製造方法 - Google Patents

保護膜形成用シートおよび保護膜付き半導体チップの製造方法 Download PDF

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Publication number
JPWO2016027888A1
JPWO2016027888A1 JP2016544268A JP2016544268A JPWO2016027888A1 JP WO2016027888 A1 JPWO2016027888 A1 JP WO2016027888A1 JP 2016544268 A JP2016544268 A JP 2016544268A JP 2016544268 A JP2016544268 A JP 2016544268A JP WO2016027888 A1 JPWO2016027888 A1 JP WO2016027888A1
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JP
Japan
Prior art keywords
protective film
forming
film
sheet
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016544268A
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English (en)
Japanese (ja)
Inventor
山本　大輔
大輔 山本
尚哉 佐伯
尚哉 佐伯
裕之 米山
裕之 米山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of JPWO2016027888A1 publication Critical patent/JPWO2016027888A1/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Dicing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Adhesive Tapes (AREA)
  • Laser Beam Processing (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
  • Formation Of Insulating Films (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2016544268A 2014-08-22 2015-08-21 保護膜形成用シートおよび保護膜付き半導体チップの製造方法 Pending JPWO2016027888A1 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2014169267 2014-08-22
JP2014169266 2014-08-22
JP2014169267 2014-08-22
JP2014169266 2014-08-22
PCT/JP2015/073545 WO2016027888A1 (fr) 2014-08-22 2015-08-21 Feuille pour formation de membrane protectrice, et procédé de fabrication de puce semi-conductrice avec membrane protectrice

Publications (1)

Publication Number Publication Date
JPWO2016027888A1 true JPWO2016027888A1 (ja) 2017-06-01

Family

ID=55350823

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016544268A Pending JPWO2016027888A1 (ja) 2014-08-22 2015-08-21 保護膜形成用シートおよび保護膜付き半導体チップの製造方法
JP2016544263A Active JP6589209B2 (ja) 2014-08-22 2015-08-21 保護膜形成用シートおよび保護膜付き半導体チップの製造方法

Family Applications After (1)

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JP2016544263A Active JP6589209B2 (ja) 2014-08-22 2015-08-21 保護膜形成用シートおよび保護膜付き半導体チップの製造方法

Country Status (8)

Country Link
JP (2) JPWO2016027888A1 (fr)
KR (2) KR102368140B1 (fr)
CN (2) CN106660333B (fr)
MY (2) MY186759A (fr)
PH (2) PH12017500284A1 (fr)
SG (2) SG11201701270QA (fr)
TW (4) TWI712670B (fr)
WO (2) WO2016027888A1 (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201803325QA (en) * 2015-10-29 2018-05-30 Lintec Corp Film for protective film formation and composite sheet for protective film formation
WO2017149890A1 (fr) * 2016-03-04 2017-09-08 リンテック株式会社 Feuille composite pour formation de membrane protectrice
WO2017149926A1 (fr) * 2016-03-04 2017-09-08 リンテック株式会社 Feuille de traitement de semi-conducteur
KR20180122316A (ko) * 2016-03-04 2018-11-12 린텍 가부시키가이샤 반도체 가공용 시트
JP6573841B2 (ja) * 2016-03-04 2019-09-11 リンテック株式会社 半導体加工用シート
KR102516392B1 (ko) * 2016-03-04 2023-03-30 린텍 가부시키가이샤 보호막 형성용 복합 시트
JP6617056B2 (ja) * 2016-03-04 2019-12-04 リンテック株式会社 半導体加工用シート、その巻取体および当該巻取体の製造方法
TWI721158B (zh) * 2016-04-28 2021-03-11 日商琳得科股份有限公司 保護膜形成用膜及保護膜形成用複合片
TWI778960B (zh) * 2016-04-28 2022-10-01 日商琳得科股份有限公司 保護膜形成用膜、保護膜形成用複合片、以及附有保護膜的半導體晶片之製造方法
TWI796297B (zh) * 2016-04-28 2023-03-21 日商琳得科股份有限公司 保護膜形成用複合片
KR102407322B1 (ko) * 2016-04-28 2022-06-10 린텍 가부시키가이샤 보호막 형성용 필름 및 보호막 형성용 복합 시트
TWI731964B (zh) * 2016-04-28 2021-07-01 日商琳得科股份有限公司 保護膜形成用複合片
WO2017195711A1 (fr) * 2016-05-12 2017-11-16 住友ベークライト株式会社 Ruban adhésif permettant de traiter des substrats semi-conducteurs
JP6776081B2 (ja) * 2016-09-28 2020-10-28 リンテック株式会社 保護膜付き半導体チップの製造方法及び半導体装置の製造方法
JP6438181B1 (ja) * 2017-05-17 2018-12-12 リンテック株式会社 半導体装置及びその製造方法
CN111051455B (zh) * 2017-08-28 2022-05-03 琳得科株式会社 膜状透明粘合剂及红外线传感器模块
WO2019146607A1 (fr) * 2018-01-24 2019-08-01 リンテック株式会社 Longue feuille stratifiée et son corps d'enroulement
KR102487552B1 (ko) 2018-02-05 2023-01-11 삼성전자주식회사 보호막 조성물 및 이를 이용한 반도체 패키지 제조 방법
JP7282076B2 (ja) * 2018-03-23 2023-05-26 リンテック株式会社 フィルム状接着剤及び半導体加工用シート
WO2019187010A1 (fr) * 2018-03-30 2019-10-03 リンテック株式会社 Feuille composite de formation de film de protection et son procédé de production
WO2019187014A1 (fr) * 2018-03-30 2019-10-03 リンテック株式会社 Feuille de support et feuille composite pour formation de film de protection
WO2020218519A1 (fr) * 2019-04-26 2020-10-29 リンテック株式会社 Procédé de production d'un corps à trois couches, procédé de production d'un corps à quatre couches, procédé de production d'un dispositif à semi-conducteurs équipé d'un film de protection de surface arrière, et corps à trois couches
JP7453879B2 (ja) 2020-08-12 2024-03-21 リンテック株式会社 保護膜形成用シートロールおよび保護膜形成用シートロールの製造方法
JP7484557B2 (ja) 2020-08-18 2024-05-16 三菱ケミカル株式会社 粘接着剤組成物、粘接着シート及び積層体
JP7084972B2 (ja) * 2020-10-06 2022-06-15 リンテック株式会社 保護膜形成用複合シート

Citations (8)

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Publication number Priority date Publication date Assignee Title
WO2004109786A1 (fr) * 2003-06-06 2004-12-16 Hitachi Chemical Co., Ltd. Feuille adhesive, feuille adhesive du type integre a un ruban de decoupage en des et procede de production d'un dispositif semi-conducteur
WO2007119507A1 (fr) * 2006-03-28 2007-10-25 Lintec Corporation Feuille permettant de former un film de protection pour puces électroniques
JP2011139042A (ja) * 2009-12-04 2011-07-14 Lintec Corp ステルスダイシング用粘着シート及び半導体装置の製造方法
JP2013120841A (ja) * 2011-12-07 2013-06-17 Lintec Corp 保護膜形成層付ダイシングシートおよびチップの製造方法
WO2013121701A1 (fr) * 2012-02-13 2013-08-22 信越化学工業株式会社 Film de protection destiné à une plaquette de semi-conducteur et procédé de fabrication d'une puce de semi-conducteur
WO2013172328A1 (fr) * 2012-05-14 2013-11-21 リンテック株式会社 Feuille ayant une couche de résine adhésive attachée à celle-ci, et procédé de fabrication d'un dispositif à semi-conducteur
WO2015145807A1 (fr) * 2014-03-24 2015-10-01 リンテック株式会社 Film de formation de film protecteur, feuille de formation de film protecteur et procédé de fabrication de produit de fabrication
WO2015146936A1 (fr) * 2014-03-24 2015-10-01 リンテック株式会社 Pellicule formant une membrane de protection, feuille d'utilisation formant une membrane de protection, procédé de production et procédé d'inspection pour pièce à usiner ou produit transformé, pièce à usiner déterminée comme étant un produit adéquat et produit transformé déterminé comme étant un produit adéquat

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JP5335483B2 (ja) * 2009-02-27 2013-11-06 リンテック株式会社 粘着剤層付き偏光板の製造方法
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JP2012033637A (ja) 2010-07-29 2012-02-16 Nitto Denko Corp ダイシングテープ一体型半導体裏面用フィルム及び半導体装置の製造方法
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Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004109786A1 (fr) * 2003-06-06 2004-12-16 Hitachi Chemical Co., Ltd. Feuille adhesive, feuille adhesive du type integre a un ruban de decoupage en des et procede de production d'un dispositif semi-conducteur
WO2007119507A1 (fr) * 2006-03-28 2007-10-25 Lintec Corporation Feuille permettant de former un film de protection pour puces électroniques
JP2011139042A (ja) * 2009-12-04 2011-07-14 Lintec Corp ステルスダイシング用粘着シート及び半導体装置の製造方法
JP2013120841A (ja) * 2011-12-07 2013-06-17 Lintec Corp 保護膜形成層付ダイシングシートおよびチップの製造方法
WO2013121701A1 (fr) * 2012-02-13 2013-08-22 信越化学工業株式会社 Film de protection destiné à une plaquette de semi-conducteur et procédé de fabrication d'une puce de semi-conducteur
WO2013172328A1 (fr) * 2012-05-14 2013-11-21 リンテック株式会社 Feuille ayant une couche de résine adhésive attachée à celle-ci, et procédé de fabrication d'un dispositif à semi-conducteur
WO2015145807A1 (fr) * 2014-03-24 2015-10-01 リンテック株式会社 Film de formation de film protecteur, feuille de formation de film protecteur et procédé de fabrication de produit de fabrication
WO2015146936A1 (fr) * 2014-03-24 2015-10-01 リンテック株式会社 Pellicule formant une membrane de protection, feuille d'utilisation formant une membrane de protection, procédé de production et procédé d'inspection pour pièce à usiner ou produit transformé, pièce à usiner déterminée comme étant un produit adéquat et produit transformé déterminé comme étant un produit adéquat

Also Published As

Publication number Publication date
TW201614024A (en) 2016-04-16
KR20170044108A (ko) 2017-04-24
TW201940622A (zh) 2019-10-16
PH12017500285A1 (en) 2017-06-28
TW201938728A (zh) 2019-10-01
SG11201701270QA (en) 2017-03-30
KR102376017B1 (ko) 2022-03-17
MY186759A (en) 2021-08-18
KR20170044652A (ko) 2017-04-25
TWI706023B (zh) 2020-10-01
WO2016027883A1 (fr) 2016-02-25
PH12017500284B1 (en) 2017-07-03
PH12017500285B1 (en) 2017-06-28
CN106660333B (zh) 2018-11-06
CN106660332B (zh) 2020-08-07
MY182846A (en) 2021-02-05
TW201614023A (en) 2016-04-16
CN106660333A (zh) 2017-05-10
WO2016027888A1 (fr) 2016-02-25
TWI668290B (zh) 2019-08-11
TWI712670B (zh) 2020-12-11
JPWO2016027883A1 (ja) 2017-06-01
TWI672354B (zh) 2019-09-21
KR102368140B1 (ko) 2022-02-25
PH12017500284A1 (en) 2017-07-03
JP6589209B2 (ja) 2019-10-16
CN106660332A (zh) 2017-05-10
SG11201701272UA (en) 2017-04-27

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