WO2019146607A1 - Longue feuille stratifiée et son corps d'enroulement - Google Patents

Longue feuille stratifiée et son corps d'enroulement Download PDF

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Publication number
WO2019146607A1
WO2019146607A1 PCT/JP2019/001918 JP2019001918W WO2019146607A1 WO 2019146607 A1 WO2019146607 A1 WO 2019146607A1 JP 2019001918 W JP2019001918 W JP 2019001918W WO 2019146607 A1 WO2019146607 A1 WO 2019146607A1
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WO
WIPO (PCT)
Prior art keywords
sheet
resin film
layer
support sheet
long
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PCT/JP2019/001918
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English (en)
Japanese (ja)
Inventor
厚史 上道
岡本　直也
康喜 中石
Original Assignee
リンテック株式会社
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Application filed by リンテック株式会社 filed Critical リンテック株式会社
Priority to JP2019567093A priority Critical patent/JP7402052B2/ja
Publication of WO2019146607A1 publication Critical patent/WO2019146607A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention forms a resin layer such as an adhesive layer or a protective film on a semiconductor package in which a plurality of semiconductor chips are resin-sealed, and a support sheet with a resin film forming layer used to dice the semiconductor package.
  • the present invention relates to a long laminate sheet including a long release sheet and an auxiliary sheet, and a wound body obtained by winding the long laminate sheet into a roll. Furthermore, the present invention provides a technique for facilitating the peeling and stably performing the peeling operation when the long laminated sheet is bent at a steep angle to peel the support sheet with the resin film-formed layer from the long release sheet. Do.
  • the present invention also provides a technique for eliminating wrinkles generated on the resin sheet with the resin film formed layer when the support sheet with the resin film formed layer is attached to an adherend such as a ring frame. Furthermore, this invention provides the technique which can manufacture a long laminated sheet continuously and stably.
  • CSP Chip Scale Package
  • WLP and PLP are classified into fan-in type and fan-out type.
  • the semiconductor chip is covered with a sealing material so as to be a region larger than the chip size to form a sealed body of the semiconductor chip, and the rewiring layer and the external electrode are Not only in the circuit surface of the above, but also in the surface area of the sealing material.
  • Patent Document 1 a plurality of semiconductor chips separated from a semiconductor wafer are left surrounding the circuit forming surface, and an expansion wafer is formed using a mold member to form an expanded wafer, and the semiconductor chip is formed outside the semiconductor chip.
  • a method of manufacturing a semiconductor package formed by extending a rewiring pattern is described.
  • a semiconductor wafer is subjected to a dicing step of being separated into pieces in a state of being attached to a pressure-sensitive adhesive tape for dicing (hereinafter, also referred to as a "dicing sheet").
  • a resin sealing body including such a plurality of semiconductor chips may be referred to as a "chip group package”.
  • the process of dicing this to obtain individual CSPs may be referred to as "package dicing.”
  • Chip group package In general, in package dicing, a plurality of semiconductor chips are mounted on a rectangular substrate, resin sealing is collectively performed, external terminals are formed, and a rectangular package consisting of a chip group sealed with resin ( Chip group package) is obtained. This is because the rectangular shape is preferable in terms of the efficiency in arranging the chips and the subsequent transfer and storage of the package.
  • this chip group package is diced to obtain a semiconductor device such as CSP.
  • a rectangular dicing sheet corresponding to the shape of the package is stretched on a frame for dicing, the chip group package is attached to the dicing sheet, and the package is diced (Patent Document 2) , Patent Document 3).
  • the semiconductor chip is temporarily attached on a holder such as a resin tape.
  • the circuit surface and the bump surface of the semiconductor chip face upward, and the back surface side of the chip is temporarily attached on the resin tape.
  • leads are attached to the circuit surface and the bump surface for external connection, and resin sealing is performed collectively.
  • the chip tape is obtained by peeling the resin tape.
  • the chip group package obtained through such a process is obtained with a structure in which the back surface of the chip is exposed. Thereafter, dicing is performed using the dicing sheet as described above to obtain divided semiconductor devices.
  • a protective film is usually formed on the exposed surface of the chip. This protective film enhances the bending strength and also functions effectively when printing a product number or the like on a semiconductor device.
  • an adhesive layer is attached to the exposed surface of the chip of the semiconductor device and bonded to the other member.
  • a protective film and an adhesive layer are collectively formed on a chip group package having a structure in which the back surface of the chip is exposed, and then dicing.
  • a layer for forming a resin film such as a protective film or an adhesive layer may be described as a “resin film forming layer”.
  • a resin film forming layer such as a protective film precursor layer or an adhesive layer is attached to one side of a semiconductor wafer, and then the semiconductor wafer and the resin film forming layer are simultaneously diced to form a resin film on one side.
  • a semiconductor chip having a layer is obtained.
  • a wafer processing sheet such as a dicing / die bonding sheet or a dicing sheet with a protective film-forming layer (Patent Document 4) is known. Since it is assumed that these wafer processing sheets are attached to a substantially circular silicon wafer, a circular resin film-forming layer is peelably laminated on a circular dicing sheet.
  • the chip group package is formed in a rectangular shape as described above. This is because the rectangular shape is preferable in terms of the efficiency in arranging the chips and the subsequent transfer and storage of the package.
  • a conventional dicing sheet with a resin film-formed layer is applied to such a rectangular chip group package, only the largest square portion of the circular resin film-formed layer can be used, and the surrounding portion is discarded without being used.
  • Ru Specifically, if the resin film-forming layer is a circle with a radius of 10 cm (area about 314 cm 2 ), the maximum area of the square in it is 200 cm 2 (2 1/2 ⁇ 10 cm square), and the resin film is formed The effective area rate of the layer is only 63.7%.
  • a resin film formation layer is laminated on a support sheet, and an adhesive ring frame holding means for temporarily attaching to a ring frame is provided on the outer periphery of the resin film formation layer.
  • the support sheet with the resin film formation layer is laminated on a long release sheet.
  • This long laminate sheet is marketed as a roll wound in a roll.
  • the long laminate sheet has a portion on which the support sheet with a resin film-formed layer is laminated and a portion not to be laminated, and a portion having a different thickness inevitably arises.
  • unrolling may occur.
  • a gap may be generated on the side of the roll due to the thickness difference, and dust and the like may intrude from the gap to contaminate the resin film-forming layer.
  • auxiliary sheet along the longitudinal direction at both ends in the width direction of the long laminate sheet.
  • the thickness of the long laminate sheet becomes uniform, the winding collapse of the winding body is prevented, and the running stability at the time of unwinding is also improved. Furthermore, since the auxiliary sheet is present in the gap at the side of the roll, intrusion of dust can be prevented.
  • a long auxiliary sheet 15 is continuously laminated on one side of the long release sheet 14 at both ends in the short direction, and along the longitudinal direction of the release sheet inside the short direction.
  • the representative example of the elongate laminated sheet 2 by which several support sheets 10 with a resin film formation layer are temporarily attached independently so that peeling is possible is shown.
  • FIG. 8 the state which is sending out the elongate laminated sheet 2 from the winding body 1 is shown.
  • the support sheet 10 with a resin film formation layer is peeled off from the above long laminate sheet 2 and attached to an adherend such as a ring frame or a chip group package, the support sheet 10 with a resin film formation layer Peeling defects may occur.
  • the long laminate sheet 2 is sent out from the winding body 1 and conveyed by the guide roller 41. And the long laminated sheet 2 is bent at a sharp angle by the peel plate 40. By bending at a steep angle, the leading end of the support sheet 10 with a resin film forming layer is lifted from the long release sheet 14 and becomes a release starting point. This operation is also called "bero out”.
  • the ring frame holding means 15 formed on the outer peripheral portion of the support sheet 10 with a resin film forming layer is attached to the ring frame 45 which is an adherend, and the resin film forming layer 12 on the inner peripheral portion is attached to the chip group package 44 .
  • the front portion of the support sheet 10 with the resin film formation layer does not lift from the long release sheet 14, passes through the peel plate 40, and is wound along with the long release sheet 14 through the guide rollers 42 and 43. , May be collected as a waste tape 46.
  • the auxiliary sheet is omitted. Therefore, when peeling the support sheet 10 with the resin film formation layer from the long laminate sheet 2, there is a demand for a technology capable of reliably peeling (spreading out) the support sheet 10 with the resin film formation layer (Problem 2) .
  • the support sheet 10 with the resin film formation layer is attached to the adherend, the head of the ring frame holding means 15 is adhered to the ring frame, and then the ring frame holding means is attached to the entire ring frame. Also, the resin film forming layer 12 and the chip group package are attached. Immediately after the foremost part of the ring frame holding means 15 is adhered to the ring frame, it is in a state of point adhesion, and in this state, tension starting from the adhesion point acts in the longitudinal direction of the support sheet 10 with a resin film formed layer. As a result, a relatively large tension is applied to the central portion of the support sheet 10 with a resin film-formed layer, and the end portion is not stretched.
  • wrinkles may be generated in the resin film-formed layer-supported sheet 10 due to the difference in elongation rate between the central portion and the peripheral portion of the resin film-formed layer-supported support sheet 10. .
  • adhesion to the chip group package may be insufficient, the package may come off, and when wrinkles occur in the ring frame holding means 15, a support sheet with a resin film formed layer 10 may drop out of the ring frame (task 3).
  • the support sheet with resin film formation layer 10 and the auxiliary sheet 15 are substantially the same material, and when cutting the support sheet with resin film formation layer into a rectangular shape, the side edge of the support sheet with resin film formation layer Leave the auxiliary sheet in the vicinity. That is, the support sheet 10 with the resin film formation layer and the auxiliary sheet 15 are die-cut into a predetermined shape, and as shown in FIG. 10A, the surplus portion 16 between the support sheet 10 with the resin film formation layer and the auxiliary sheet 15 ( By removing the residue, the support sheet 10 with a resin film formation layer having a predetermined shape is obtained on the release sheet 14, and the auxiliary sheet 15 remains at both ends in the short direction of the release sheet 14.
  • the cutting in this case is continuously performed by a roll-shaped punching blade, and the removal of the surplus portion 16 is performed by continuously pulling up the surplus portion 16 (sump up).
  • the scrap portion 16 can be pulled up with a relatively small peeling force.
  • the surplus portion 16 has a large area between the support sheet with the resin film formation layer and the support sheet with the resin film formation layer adjacent thereto (FIG. 10B). Therefore, in this area, it has a relatively large force for pulling up the waste portion 16. As a result, an excessive force is applied to the thin portion of the surplus portion 16, and the surplus portion 16 may be broken at the time of scrap lifting, making it impossible to continuously raise the scrap (Problem 4).
  • the support sheet 10 with the resin film formation layer and the auxiliary sheet 15 are punched into a predetermined shape, the support sheet 10 with the resin film formation layer and the auxiliary sheet 15 are completely cut by a roll-shaped extraction blade. Then, the base long release sheet 14 is cut not to be completely cut.
  • the depth of the cut into the long release sheet 14 is too deep, when the long stack sheet 2 is bent at a steep angle to release the support sheet 10 with a resin film-formed layer from the long stack sheet 2, the long release The sheet 14 may be cut to prevent continuous operation (Problem 5).
  • the present invention has been made in view of the prior art as described above, and provides a support sheet with a rectangular resin film formation layer in place of the circular resin film formation layer with a dicing sheet, and The objective is to solve the problem 1 by increasing the effective area rate.
  • the present invention solves Problem 2 by providing a technology capable of reliably peeling off the support sheet 10 with the resin film formation layer when peeling the support sheet 10 with the resin film formation layer.
  • the purpose is that.
  • the present invention aims to reduce the wrinkles generated in the resin film forming layer 12 and the ring frame holding means 15 when the support sheet 10 with the resin film forming layer is attached to the adherend, and solve the problem 3.
  • Another object of the present invention is to solve the problem 4 and to improve the manufacturing efficiency by continuously and reliably pulling up the surplus portion (curs portion).
  • the present invention for solving the above-mentioned problems includes the following gist.
  • the long laminate sheet according to the first embodiment of the present invention includes a substantially rectangular support sheet, a resin film forming layer formed on the support sheet and having substantially the same shape as the support sheet, and a surface of the resin film forming layer.
  • a long auxiliary sheet is continuously laminated on both ends in the lateral direction on the release-treated surface of the release sheet.
  • a plurality of support sheets with a resin film-forming layer are separately tacked on the inner side in the short direction on the release treatment surface of the release sheet so as to be releaseable independently along the longitudinal direction of the release sheet. .
  • the long laminate sheet according to the second embodiment of the present invention sends out the long laminate sheet and peels the support sheet with a resin film forming layer from the long release sheet while being covered
  • the shape of the tip side of the support sheet with a resin film formation layer which is in contact with the adherend first is characterized in that it is convex to the outside of the support sheet with a resin film formation layer.
  • the shape of the tip side of the support sheet with the resin film-formed layer is preferably any one of the following: [1] A shape having an arc-like portion at a top portion and a linear portion continuous to each end of the arc-like portion, [2] arc shape, [3] Elliptical arc shape, [4] triangle shape without base, [5] A shape including a plurality of shapes selected from the shapes of trapezoidal shapes [6] [1] to [5] without a bottom.
  • the shape of the tip side of the support sheet with a resin film-formed layer is [4] a triangle without a base, and the internal angle of the apex is 179.8 ° to 168 °. Is preferred.
  • the side of the support sheet with a resin film-formed layer along the longitudinal direction of the long laminate sheet is processed into a wave shape It is preferable that
  • the long laminate sheet according to the fourth embodiment of the present invention sends out the long laminate sheet and peels the support sheet with a resin film-formed layer from the long release sheet while being covered
  • a front end side of the support sheet with a resin film-forming layer that is in contact with the adherend first and a rear end side that is in contact lastly The side of the support sheet with resin film formation layer along the longitudinal direction of the long laminate sheet is connected by an arc-shaped curve or a shape connected by a short line so that the internal angle is 90 ° or more. It is preferable that
  • a part of the auxiliary sheet is convex between the two support sheets with a resin film formation layer along the longitudinal direction. Be prominent in It is preferable that the convex portion is formed in a shape of an arc-shaped curved line or a short line connecting the inner angle to 90 ° or more.
  • a cut is formed in the long release sheet along the outer extension of the support sheet with a resin film forming layer,
  • the thickness of the release sheet at the cut portion is preferably 20% or more of the total thickness of the release sheet.
  • the wound body of the present invention is characterized in that the long laminate sheet of any one of the first to sixth aspects is rolled up.
  • a long laminate sheet including a rectangular resin film-formed support sheet is provided to solve the problem 1.
  • peeling (spreading out) of the support sheet 10 with a resin film forming layer can be reliably performed, thereby solving the problem 2.
  • the wrinkles generated in the resin film forming layer 12 and the ring frame holding means 15 are reduced when the resin film forming layer provided support sheet 10 is attached to the adherend. Or prevent and solve the problem 3.
  • FIG. 1B is a cross-sectional view taken along line AA of FIG. 1A.
  • the BB sectional drawing of FIG. 1A is shown.
  • An example of the top view of the elongate laminated sheet which concerns on a 2nd embodiment is shown.
  • An example of the shape of the tip side in a 2nd embodiment is shown.
  • An example of the shape of the tip side in a 2nd embodiment is shown.
  • An example of the shape of the tip side in a 2nd embodiment is shown.
  • An example of the shape of the tip side in a 2nd embodiment is shown.
  • An example of the shape of the tip side in a 2nd embodiment is shown.
  • An example of the shape of the tip side in a 2nd embodiment is shown.
  • An example of the shape of the tip side in a 2nd embodiment is shown.
  • An example of the shape of the side in a 3rd embodiment is shown.
  • An example of the shape of the side in a 3rd embodiment is shown.
  • An example of the shape of the side in a 3rd embodiment is shown.
  • the working condition of the tension in a 3rd embodiment is shown typically.
  • An example of the top view of the support sheet with a resin film formation layer in a 4th embodiment is shown.
  • An example of the top view of the support sheet with a resin film formation layer in a 4th embodiment is shown.
  • An example of the shape of the wide part in a 5th embodiment is shown.
  • FIG. 9C shows a perspective view of FIG. 9A. Indicates a state in which the surplus portion is removed. Indicates a state in which the surplus portion is removed.
  • substantially rectangular includes not only strictly squares and rectangles, but also slightly distorted shapes similar thereto.
  • each side of a square or a rectangle may be curved or bent, and a corner may be a rounded curve, and it is configured to be a short straight line whose direction changes continuously.
  • a "support sheet” is a sheet-like member which can support a resin film formation layer so that peeling is possible, may be a peeling sheet, and may be an adhesive sheet like a so-called dicing sheet.
  • the “resin film forming layer” is used in the sense that it includes both a precursor layer for forming a protective film and an adhesive layer. The precursor layer for forming the protective film is cured by a predetermined operation to form a protective film.
  • the "support sheet with a resin film formation layer” means a laminate of a support sheet and a resin film formation layer. It also includes substantially rectangular ring frame holding means for holding the ring frame.
  • the “release sheet” is a sheet whose surface peel force is controlled, and may be made of resin, paper or cloth. Although the peeling force of the surface is controlled by a peeling agent etc., it is not limited to this. "Long” means a rectangular shape having a longitudinal direction sufficiently longer than the lateral direction.
  • the "auxiliary sheet” means a layered body formed on both ends of the long release sheet in the width direction.
  • the “long laminate sheet” is a long release sheet, a long auxiliary sheet continuously laminated on both ends of the release sheet in the lateral direction, and a temporary attachment that can be released to the inside of the release sheet in the lateral direction. And a support sheet with a resin film forming layer.
  • a “rolling body” means what wound up the said long laminated sheet and was made into roll shape.
  • the first embodiment is a basic form common to the other embodiments of the present invention.
  • the long laminate sheet 2 according to the first embodiment is a substantially rectangular support sheet 11 and a resin film formed on the support sheet 1 and having substantially the same shape as the support sheet.
  • a long auxiliary sheet 15 is continuously laminated on both ends in the short direction on the release-treated surface of the release sheet 14.
  • FIG. 1A the perspective view of the state which is sending out the elongate laminated sheet 2 from the winding body 1 is shown.
  • FIG. 1B is a cross-sectional view taken along the line AA of FIG. 1A
  • FIG. 1C is a cross-sectional view taken along the line BB of FIG. 1A.
  • the support sheet 10 with a resin film formation layer is formed on the outer periphery of one surface of the support sheet 11, the resin film formation layer 12 laminated on the entire surface of one side, and the resin film formation layer 12. And a ring frame holding means 13.
  • the support sheet 11 and the resin film forming layer 12 are laminated in a peelable manner.
  • the support sheet 11 is a release sheet
  • the resin film forming layer 12 is formed on the release treated surface.
  • the support sheet 11 is a pressure-sensitive adhesive sheet such as a dicing sheet
  • the resin film forming layer 12 is formed on the pressure-sensitive adhesive layer.
  • a plurality of support sheets 10 with a resin film-formed layer are temporarily attached so as to be peelable independently, inside the short direction.
  • a long auxiliary sheet 15 is laminated at both ends in the short direction along the longitudinal direction of the long release sheet 14.
  • the auxiliary sheet 15 has the same laminated structure as the outer peripheral portion of the support sheet 10 with a resin film forming layer. That is, the auxiliary sheet 15 is made of the same material as the support sheet 11, the resin film forming layer 12 and the ring frame holding means 13.
  • the auxiliary sheet 15 may extend inward in the short direction between the release sheets 14. That is, the width of the auxiliary sheet is not uniform, and the auxiliary sheet may be formed so as to be wider at a portion between the resin sheet with the support layer with a resin film formed layer (hereinafter referred to as "wide portion" There is A cross-sectional view of the wide portion is shown in FIG. 1C.
  • the resin film forming layer 12 is substantially rectangular, effective use of the resin film forming layer 12 is performed when sticking to a rectangular chip group package. Can be solved and the problem 1 can be solved.
  • Such a long laminate sheet 2 can be manufactured, for example, as follows. On the long release sheet 14, a pressure-sensitive adhesive layer (which may be a double-sided pressure-sensitive adhesive tape) to be the ring frame holding means 13 is attached. The pressure-sensitive adhesive layer is cut into a rectangular shape. At this time, the pressure-sensitive adhesive layer is completely cut, and the release sheet is cut with a cutting blade to such an extent that a shallow cut occurs. Next, the stamped pressure-sensitive adhesive layer is removed, and the pressure-sensitive adhesive layer having a rectangular opening remains on the release sheet 14.
  • a pressure-sensitive adhesive layer which may be a double-sided pressure-sensitive adhesive tape
  • a laminate of the support sheet and the resin film forming layer is prepared, and this is laminated on the side of the release sheet 14 having the pressure-sensitive adhesive layer.
  • the laminate is then cut into the shape of the ring frame. At this time, the cut is formed so that the rectangular opening of the pressure-sensitive adhesive layer is positioned approximately at the center of the die-cut shape.
  • a cut is made in accordance with the planned shape of the auxiliary sheet 15. At this time as well, the laminate is completely cut in the same manner as described above, and the release sheet is cut with a punching blade to such an extent that a shallow cut occurs.
  • the support sheet 10 with the resin film formation layer of a predetermined shape is obtained on the release sheet 14
  • the auxiliary sheet 15 remains at both ends of the sheet 14 in the width direction, and the long laminate sheet 2 having the above structure is obtained.
  • the shape of the front end side of the support sheet with a resin film formation layer which contacts the adherend at first is a convex shape on the outside of the support sheet with a resin film formation layer.
  • planar shape of the support sheet 10 with a resin film-formed layer in this embodiment is substantially rectangular as shown in FIG. 2, each side may be curved and bent, and the corner is rounded. It may be a curved line, or may be configured as a short straight line whose direction changes continuously.
  • Inward of the long laminate sheet 2 at an obtuse angle from straight side edges 21 (two) parallel to each other on both sides in the width direction of the support sheet 10 with a resin film-formed layer and the end of the side 21 It has linear middle sides 22 (two) obliquely extending toward the head, and an outermost side 23 (two) connecting the two middle sides 22 and a rear end 25.
  • the middle side 22 and the outermost side 23 may be collectively referred to as “tip side 24”.
  • the end side 24 is a side located at the end (the end direction) when the support sheet 10 with a resin film-formed layer is sent out from the roll 1 of the long laminate sheet 2 and has a shape described later It is also good.
  • the rear end side 25 is the opposite side of the front end side 24, and is a side located at the rear end portion (in the rear end direction) when the resin film-formed layer-supporting support sheet 10 is delivered from the winding body 1.
  • the rear end side 25 preferably has a shape in which the front end side 24 is inverted, but may be linear.
  • the long laminate sheet 2 is bent at a sharp angle, and the tip side 24 of the resin film-formed layer-attached support sheet 10 is lifted to serve as a peeling starting point.
  • peeling failure may occur.
  • a difference occurs in the tension applied to the resin sheet with the resin film formed layer between the portion where the front end side 24 is in contact with the adherend and the portion which is not in contact, which causes the resin film formed layer attached Wrinkles may occur on the support sheet 10.
  • the support sheet 10 with a resin film formed layer In order to prevent the generation of wrinkles, there is a method of increasing tension applied to the support sheet 10 with a resin film formed layer, but the support sheet 10 with a resin film formed layer whose internal stress is increased due to the tension For example, it may come off from the ring frame).
  • the tension applied to the resin film forming layer 12 becomes uneven, wrinkles also occur in the resin film forming layer due to the difference in elongation. Even when the chip group package is attached to the resin film forming layer 12 in which such wrinkles are generated, the attachment can not be made uniform, and when dicing the package, some semiconductor devices may be scattered.
  • the end side 24 when the end side 24 is convex in the delivery direction as in this embodiment, the end side 24 is easily lifted when bent, and the resin sheet with the resin film formed layer can be peeled off smoothly. Further, the support sheet 10 with the resin film formation layer is sequentially contacted and adhered to the adherend from the top of the tip side 24, and no uneven force is applied to the support sheet 10 with the resin film formation layer. As a result, generation of wrinkles in the support sheet 10 with a resin film formation layer is suppressed.
  • the distance d (see FIG. 2) in the convex direction of the convex portion of the tip side 24 is 0.5 to 25% of the total length L in the sticking direction (lateral direction in FIG. 2) of the support sheet 10 with resin film forming layer. It is preferable that the length is 1 to 15%.
  • the distance d in the convex direction of the tip side 24 is less than 0.5%, it may be difficult to obtain the above-described wrinkle suppression effect.
  • the distance d in the convex direction of the front end side 24 exceeds 25%, the support sheet 10 with the resin film formation layer is unnecessarily large, and the support sheet 10 with the resin film formation layer is from the adherend (for example, ring frame) Sometimes it may spill out.
  • the shape of the tip side 24 may be a shape having an arc-shaped portion at the [1] apex portion and a linear portion continuous to each end of the arc-shaped portion.
  • the shape of the tip side is [2] arc-shaped as shown in FIG. 3B, [3] elliptical arc-shaped as shown in FIG. 3C, [4] triangle-shaped without a base side as shown in FIG. As shown to FIG. 3E, it may be trapezoid shape without [5] lower bottom.
  • the shape of the tip side may include a plurality of shapes selected from the shapes of [1] to [5] described above as shown in FIG. 3F.
  • the shape where the circular arc-shaped convex part continued in FIG. 3F was shown, another shape may be sufficient and these combination may be sufficient.
  • the preferable length L and the distance d in the convex direction of the support sheet 10 with a resin film forming layer are the same as described above.
  • the shape of the front end side of the support sheet 10 with a resin film-formed layer is a triangular shape without a [4] bottom side, and the internal angle ⁇ of the apex angle thereof is 179.8 ° to 168 °.
  • the convex shape of the tip side is as described above, when peeling the support sheet 10 with a resin film-formed layer from the long laminate sheet 2, the tip side is easily lifted, so the support sheet 10 with a resin film-formed layer Peeling can be performed reliably, and the problem 2 is solved.
  • the convex shape of the tip side when attaching the support sheet 10 with a resin film formed layer, the support sheet 10 with a resin film formed layer gradually contacts the adherend from the vertex portion of the tip side It is stuck and the uneven
  • FIG. 4 is a plan view of a resin sheet with a resin film formed layer in a long laminate sheet according to a third embodiment of the present invention.
  • the side 21 of the support sheet 10 with a resin film formation layer along the longitudinal direction is processed in a wave form. It is characterized by
  • the wavelike shape is not particularly limited, and may be a sine wave shape as shown in FIG. 4A or a continuous arc shape as shown in FIG. 4B, and as shown in FIG. 4C, an upward arc and a downward direction.
  • the circular arcs may be a continuous shape, or may be a zigzag shape formed of short lines as shown in FIG. 4D. Furthermore, it may be a combination of these shapes.
  • the support sheet 10 with the resin film formation layer is sequentially stuck to the adherend from the top of the tip side.
  • the tension acts on the longitudinal laminated sheet in the longitudinal direction starting from the apex of the tip side.
  • This tension increases the central part in the lateral direction of the support sheet 10 with a resin film-formed layer, and slightly acts on the lateral ends.
  • the central portion in the width direction of the resin film-formed layer-supporting support sheet 10 is stretched, and a difference in elongation is generated between the ends in the width direction, which causes wrinkles.
  • the fourth and fifth embodiments are aimed at preventing breakage of the surplus portion (cursed portion) at the time of scrapping.
  • the support sheet 10 with resin film formation layer and the auxiliary sheet 15 are cut out in a predetermined shape, and the support sheet 10 with resin film formation layer and the auxiliary sheet 15 Is obtained by removing the surplus portion (cursing portion) between In the area
  • the surplus portion 16 has a large area between the support sheet with the resin film formation layer and the support sheet with the resin film formation layer adjacent thereto (FIG. 10B).
  • the resin film along the longitudinal direction of the long laminate sheet and the front end side and the rear end side of the support sheet with the resin film formation layer is connected by an arc-shaped curve (FIG. 5A), or connected by a shape connected by a short line so that the internal angle is 90 ° or more ( FIG. 5B) is characterized.
  • the meaning of the front end side is the same as the above, and the rear end side is the side opposite to the front end side, and when the support sheet with a resin film-formed layer is attached to the adherend, means.
  • the corner portion of the substantially rectangular support film 10 with a resin film-formed layer is an arc-shaped curve (FIG. 5A) or a series of short lines (inner angle is 90 ° or more) 5B).
  • the corner portion is tapered by one line, but the corner portion may be connected by two or more lines.
  • the fifth embodiment aims to prevent breakage of the surplus portion (curd portion) at the time of scrap lifting.
  • a part of the auxiliary sheet 15 is protruded between the two support sheets 10 with a resin film-formed layer along the longitudinal direction of the long laminate sheet, and the convex portion
  • it is characterized in that it is configured in an arc-shaped curve or a shape connected by a short line so that the internal angle is 90 ° or more.
  • the “wide portion” of the auxiliary sheet 15 described in regard to the first embodiment is made convex, and an arc-shaped curve (FIG. 6A) or a series of short lines so that the internal angle is 90 ° or more It consists of
  • the convex portion is formed in a two-tapered shape by three lines, but the convex portion may be connected by four or more lines.
  • the shape of the surplus portion gradually changes, so the peeling force of the surplus portion from the long release sheet also gradually changes.
  • the manufacturing efficiency of the long laminate sheet is improved, and the problem 4 is solved.
  • the laminate of the support sheet 11 provided on the release sheet 14, the resin film forming layer 12 and the ring frame holding means 13 having the rectangular opening is Cut into shape.
  • a cut is made in accordance with the planned shape of the auxiliary sheet 15.
  • the laminate is completely cut, and the release sheet is cut with a punching blade to such an extent that a shallow cut occurs.
  • the support sheet 10 with the resin film formation layer having a predetermined shape is obtained on the release sheet 14.
  • the auxiliary sheet 15 remains at both ends in the width direction of the release sheet 14 to obtain the long laminate sheet 2 having the above-mentioned structure.
  • the long release sheet 14 is also cut.
  • the object of the sixth embodiment is to prevent the cutting of the long release sheet when peeling the support sheet 10 with a resin film-formed layer from the long laminate sheet 2.
  • the cut portion 30 is formed in the long release sheet 14 along the outer extension of the support sheet 10 with a resin film forming layer. It is characterized in that the thickness of the release sheet 14 at the cut portion 30 is 20% or more, preferably 30% or more, of the total thickness of the release sheet 14. Therefore, the incision depth is 80% or less, preferably 70% or less, of the total thickness of the release sheet 14.
  • the long release sheet may be cut when the long laminate sheet 2 is bent at a sharp angle.
  • the thickness of the release sheet 14 at the cut portion 30 is too thick (that is, the cut depth is too shallow)
  • the control of the depth of the cut portion 30 is performed by appropriately adjusting the height of the punching blade used for die cutting and the pressure applied thereto.
  • the long laminate sheets according to the first to sixth embodiments described above are generally marketed as a roll wound in a roll.
  • the second to sixth embodiments can be appropriately combined with the first embodiment which is the basic form.
  • corner portions of the support sheet 10 with a resin film forming layer may be arc-shaped as in the fourth embodiment, and the shape of the auxiliary sheet 15 may be arc-shaped projections as in the fifth embodiment.
  • a support sheet As the support sheet 11, a release sheet can be mentioned, and an adhesive sheet such as a dicing sheet described later can also be used.
  • release sheet for example, polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, Polyurethane film, ethylene vinyl acetate copolymer film, ionomer resin film, ethylene (meth) acrylic acid copolymer film, ethylene (meth) acrylic acid ester copolymer film, polystyrene film, polycarbonate film, polyimide film, fluorine A resin film or the like is used. Moreover, these crosslinked films are also used. Furthermore, these laminated films may be sufficient.
  • the surface tension of the surface of the release sheet in contact with the resin film-forming layer is preferably 40 mN / m or less, more preferably 37 mN / m or less, particularly preferably 35 mN / m or less.
  • the lower limit is usually about 25 mN / m.
  • Such a release sheet having a relatively low surface tension can be obtained by appropriately selecting the material, and can also be obtained by applying a release agent to the surface of the release sheet and performing a release treatment. .
  • Alkyd-based, silicone-based, fluorine-based, unsaturated polyester-based, polyolefin-based, wax-based, etc. are used as the release agent used for the release treatment, but particularly the alkyd-based, silicone-based and fluorine-based release agents are heat resistant It is preferable because it has
  • the release agent may be used as it is with no solvent, or diluted with solvent or emulsified to form a gravure coater, Mayer bar coater, air knife coater.
  • the release sheet may be coated by a roll coater or the like, and the release sheet coated with the release agent may be provided at normal temperature or under heating, or may be cured by an electron beam to form a release layer.
  • the surface tension of the release sheet may be adjusted by laminating films by wet lamination, dry lamination, hot melt lamination, melt extrusion lamination, coextrusion processing, or the like. That is, a film whose surface tension of at least one surface is in a preferable range as that of the surface in contact with the resin film-forming layer of the above-mentioned release sheet is the other surface so that the surface is in contact with the resin film-forming layer
  • stacked with the film of 4 may be manufactured, and it is good also as a peeling sheet.
  • the resin film-forming layer is laminated on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet.
  • the above-mentioned film illustrated as a peeling sheet is mentioned.
  • the pressure-sensitive adhesive layer may be a weak adhesive having a degree of adhesion capable of peeling the resin film-forming layer, or an energy ray-curable one whose adhesion is reduced by energy ray irradiation. It is also good.
  • the pressure-sensitive adhesive layer may be any of various known pressure-sensitive adhesives (for example, general-purpose pressure-sensitive adhesives such as rubber, acrylic, silicone, urethane, vinyl ether, etc., pressure-sensitive adhesives with uneven surface, energy ray-curable pressure-sensitive adhesive, thermal It can be formed by an expansion component-containing pressure-sensitive adhesive and the like.
  • general-purpose pressure-sensitive adhesives such as rubber, acrylic, silicone, urethane, vinyl ether, etc.
  • pressure-sensitive adhesives with uneven surface energy ray-curable pressure-sensitive adhesive, thermal It can be formed by an expansion component-containing pressure-sensitive adhesive and the like.
  • the thickness of the support sheet is usually 10 to 500 ⁇ m, preferably 15 to 300 ⁇ m, and particularly preferably 20 to 250 ⁇ m. In the case of a pressure-sensitive adhesive sheet in which the support sheet has a pressure-sensitive adhesive layer formed on a substrate, the thickness of the pressure-sensitive adhesive layer is 3 to 50 ⁇ m in the support sheet.
  • the resin film forming layer 12 is a precursor layer for forming a protective film, or consists of an adhesive layer.
  • the functions required at least for the resin film-forming layer are (1) sheet shape maintainability, (2) initial adhesion and (3) curability.
  • the resin film-forming layer can be given (1) sheet shape maintainability and (3) curability by addition of a binder component, and as the binder component, a polymer component (A) and a curable component (B) And a second binder component containing a curable polymer component (AB) having both the properties of the components (A) and (B). In addition, it is a function for temporarily attaching to a package until it hardens a resin film formation layer.
  • Initial adhesion may be pressure-sensitive adhesion, and it softens and adheres by heat. It may be a property.
  • the initial adhesiveness is usually controlled by various characteristics of the binder component, adjustment of the blending amount of the inorganic filler (C) described later, and the like.
  • the first binder component contains the polymer component (A) and the curable component (B) to impart sheet shape maintainability and curability to the resin film-forming layer.
  • a 1st binder component does not contain a curable polymer component (AB) for convenience of distinguishing with a 2nd binder component.
  • the polymer component (A) is added to the resin film forming layer mainly for the purpose of imparting the sheet shape maintaining property to the resin film forming layer.
  • the weight average molecular weight (Mw) of the polymer component (A) is usually 20,000 or more, and preferably 20,000 to 3,000,000.
  • the value of weight average molecular weight (Mw) is a value as measured by gel permeation chromatography (GPC) (polystyrene standard).
  • a high-speed GPC apparatus “HLC-8120GPC” manufactured by Tosoh Corp.
  • a high-speed column “TSK gurd column H XL -H", “TSK Gel GMH XL”, “TSK Gel G2000 H XL”
  • a detector is used as a differential refractometer at a column temperature of 40 ° C., a liquid transfer rate of 1.0 mL / min, using a combination of (all manufactured by Tosoh Corporation) in this order.
  • the polymer component (A) does not have a curing functional group which will be described later, for the sake of distinction from the curable polymer (AB) which will be described later.
  • an acrylic polymer As a polymer component (A), an acrylic polymer, polyester, a phenoxy resin (It limits to the thing which does not have an epoxy group for convenience to distinguish with the curable polymer (AB) mentioned later.), A polycarbonate, a polyether, a polyurethane And polysiloxane, rubber polymers and the like can be used.
  • acrylic urethane resin having an isocyanate group at the molecular terminal is obtained by reacting an acrylic polyol having an hydroxyl group with an acrylic polymer having a hydroxyl group, for example, an acrylic urethane resin having an isocyanate group at the molecular terminal. May be Furthermore, you may use combining these 2 or more types including the polymer which 2 or more types couple
  • acrylic polymer (A1) As the acrylic polymer polymer component (A), acrylic polymer (A1) is preferably used.
  • the glass transition temperature (Tg) of the acrylic polymer (A1) is preferably in the range of -60 to 50 ° C, more preferably -50 to 40 ° C, and still more preferably -40 to 30 ° C.
  • Tg glass transition temperature
  • the glass transition temperature of the acrylic polymer (A1) is high, the adhesiveness of the resin film forming layer is lowered and it can not be transferred to the work, or the resin film forming layer or the resin film forming layer is cured from the work after transfer. Problems such as peeling of the resulting resin film may occur.
  • the glass transition temperature of the acrylic polymer (A1) is low, the peeling force between the resin film forming layer and the support sheet may be increased to cause a transfer failure of the resin film forming layer.
  • the weight average molecular weight of the acrylic polymer (A1) is preferably 100,000 to 1,500,000.
  • the weight-average molecular weight of the acrylic polymer (A1) is high, the adhesiveness of the resin film-forming layer is lowered, and transfer to the work becomes impossible, and problems such as peeling of the resin film-forming layer or resin film from the work after transfer May occur.
  • the weight average molecular weight of the acrylic polymer (A1) is low, the adhesion between the resin film forming layer and the support sheet becomes high, and transfer failure of the resin film forming layer may occur.
  • An acrylic polymer (A1) contains (meth) acrylic acid ester in the monomer which comprises at least.
  • an alkyl (meth) acrylate having 1 to 18 carbon atoms in the alkyl group specifically methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl ( (Meth) acrylates, 2-ethylhexyl (meth) acrylates and the like;
  • (meth) acrylic may be used in a meaning including both acrylic and methacrylic.
  • a monomer which comprises acrylic polymer (A1) you may use the monomer which has a hydroxyl group.
  • a hydroxyl group is introduced into the acrylic polymer (A1), and the resin film forming layer separately contains an energy ray curable component (B2), and this and the acrylic polymer
  • B2 energy ray curable component
  • the monomer having a hydroxyl group include (meth) acrylic acid esters having a hydroxyl group such as 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate; and N-methylol (meth) acrylamide.
  • a monomer which comprises acrylic polymer (A1) you may use the monomer which has a carboxyl group.
  • a carboxyl group is introduced into the acrylic polymer (A1), and when the resin film forming layer separately contains an energy ray curable component (B2), this and the acrylic resin The compatibility with the polymer (A1) is improved.
  • the monomer having a carboxyl group include (meth) acrylic acid esters having a carboxyl group such as 2- (meth) acryloyloxyethyl phthalate and 2- (meth) acryloyloxypropyl phthalate; (meth) acrylic acid, Maleic acid, fumaric acid, itaconic acid etc. are mentioned.
  • the carboxyl group and the epoxy group in the epoxy-based thermosetting component react with each other, and therefore a monomer having a carboxyl group
  • the amount used is preferably small.
  • a monomer which comprises acrylic polymer (A1) you may use the monomer which has an amino group.
  • (meth) acrylic acid ester etc. which have amino groups, such as monoethylamino (meth) acrylate, etc. are mentioned.
  • acrylic polymer (A1) vinyl acetate, styrene, ethylene, ⁇ -olefin or the like may be used.
  • the acrylic polymer (A1) may be crosslinked.
  • the acrylic polymer (A1) before crosslinking has a crosslinkable functional group such as a hydroxyl group, and is crosslinked by adding a crosslinking agent to the composition for forming a resin film-forming layer The reaction is carried out by reacting the functional group with the functional group possessed by the crosslinking agent.
  • crosslinking the acrylic polymer (A1) it becomes possible to control the cohesion of the resin film-forming layer.
  • crosslinking agent examples include organic polyvalent isocyanate compounds and organic polyvalent imine compounds.
  • organic polyvalent isocyanate compounds aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, alicyclic polyvalent isocyanate compounds, trimers of these organic polyvalent isocyanate compounds, and these organic polyvalent isocyanate compounds
  • aromatic polyvalent isocyanate compounds aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, alicyclic polyvalent isocyanate compounds, trimers of these organic polyvalent isocyanate compounds, and these organic polyvalent isocyanate compounds
  • trimers of these organic polyvalent isocyanate compounds and these organic polyvalent isocyanate compounds
  • the terminal isocyanate urethane prepolymer etc. which are obtained by making a polyol compound react can be mentioned.
  • organic polyvalent isocyanate compound specifically, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4'- Diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, lysine diisocyanate, and the like
  • Examples include polyhydric alcohol adducts.
  • N, N'-diphenylmethane-4,4'-bis (1-aziridine carboxamide), trimethylolpropane-tri- ⁇ -aziridinyl propionate, and tetramethylol as organic polyvalent imine compounds Mention may be made of methane-tri- ⁇ -aziridinyl propionate and N, N′-toluene-2,4-bis (1-aziridine carboxamide) triethylene melamine and the like.
  • the crosslinking agent is usually 0.01 to 20 parts by mass, preferably 0.1 to 10 parts by mass, and more preferably 0.5 to 5 parts by mass, per 100 parts by mass of the acrylic polymer (A1) before crosslinking. Used in proportions.
  • the reference The content to be contained is the content of the acrylic polymer before being crosslinked.
  • Non-acrylic resin As the polymer component (A), polyester, phenoxy resin (limited to those having no epoxy group for the sake of distinction from the curable polymer (AB) described later), polycarbonate, poly It is also possible to use one or a combination of two or more non-acrylic resins (A2) selected from ethers, polyurethanes, polysiloxanes, rubber polymers or those in which two or more of these are bonded. As such a resin, one having a weight average molecular weight of 20,000 to 100,000 is preferable, and one having a weight average molecular weight of 20,000 to 80,000 is more preferable.
  • the glass transition temperature of the non-acrylic resin (A2) is preferably in the range of -30 to 150.degree. C., more preferably -20 to 120.degree.
  • non-acrylic resin (A2) When using non-acrylic resin (A2) in combination with the above-mentioned acrylic polymer (A1), the content of non-acrylic resin (A2) corresponds to non-acrylic resin (A2) and acrylic polymer (A
  • the mass ratio (A2: A1) to A1) is usually in the range of 1:99 to 60:40, preferably 1:99 to 30:70.
  • the content of the non-acrylic resin (A2) is in this range, the above-described effects can be obtained.
  • the curable component (B) is added mainly for the purpose of imparting curability to the resin film-forming layer.
  • a thermosetting component (B1) or an energy ray curable component (B2) can be used. Moreover, you may use combining these.
  • the thermosetting component (B1) contains a compound having at least a functional group that reacts by heating.
  • the energy ray curable component (B2) contains a compound (B21) having a functional group that reacts by energy ray irradiation, and polymerizes and hardens when it is irradiated with energy rays such as ultraviolet rays and electron beams.
  • the functional groups possessed by these curable components react with one another to form a three-dimensional network structure, whereby curing is realized.
  • the curable component (B) is used in combination with the polymer component (A), from the viewpoint of suppressing the viscosity of the coating composition for forming the resin film-forming layer and improving the handleability, etc.
  • the weight average molecular weight (Mw) is 10,000 or less, preferably 100 to 10,000.
  • thermosetting component for example, an epoxy-based thermosetting component is preferable. It is preferable that an epoxy-type thermosetting component contains the compound (B11) which has an epoxy group, and it uses what combined the compound (B11) and thermosetting agent (B12) which have an epoxy group.
  • epoxy compound (B11) Compound Having an Epoxy Group
  • epoxy compound (B11) conventionally known compounds can be used. Specifically, polyfunctional epoxy resin, bisphenol A diglycidyl ether or a hydrogenated product thereof, ortho cresol novolac epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type
  • numerator such as an epoxy resin and a phenylene frame type
  • the resin film forming layer preferably contains 1 to 1500 parts by mass of the epoxy compound (B11) with respect to 100 parts by mass of the polymer component (A), and more preferably Is contained in an amount of 3 to 1200 parts by mass.
  • the amount of the epoxy compound (B11) is small, the adhesiveness after curing of the resin film-forming layer tends to decrease.
  • the peeling force of a resin film formation layer and a support sheet may become high, and the transfer defect of a resin film formation layer may occur.
  • thermosetting agent (B12) functions as a curing agent for the epoxy compound (B11).
  • the compound which has 2 or more of functional groups which can react with an epoxy group in 1 molecule is mentioned.
  • the functional group include phenolic hydroxyl group, alcoholic hydroxyl group, amino group, carboxyl group and acid anhydride. Among these, preferred are phenolic hydroxyl group, amino group, acid anhydride and the like, and more preferred are phenolic hydroxyl group and amino group.
  • phenolic curing agent examples include polyfunctional phenolic resins, biphenols, novolac phenolic resins, dicyclopentadiene phenolic resins, zyloc phenolic resins, and aralkyl phenolic resins.
  • amine curing agent examples include DICY (dicyandiamide). These can be used singly or in combination of two or more.
  • the content of the thermosetting agent (B12) is preferably 0.1 to 500 parts by mass, and more preferably 1 to 200 parts by mass with respect to 100 parts by mass of the epoxy compound (B11).
  • the content of the thermosetting agent is low, the adhesiveness after curing tends to be lowered.
  • the curing accelerator (B13) may be used to adjust the rate of heat curing of the resin film-forming layer.
  • the curing accelerator (B13) is preferably used particularly when an epoxy-based thermosetting component is used as the thermosetting component (B1).
  • Preferred curing accelerators include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol and tris (dimethylaminomethyl) phenol; 2-methylimidazole, 2-phenylimidazole, 2-phenyl- Imidazoles such as 4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole; Organic phosphines such as tributylphosphine, diphenylphosphine, triphenylphosphine and the like Tetraphenyl boron salts such as tetraphenyl phosphonium tetraphenyl borate, triphenyl phosphine tetraphenyl borate and the like can be mentioned. These can be used singly or in combination of two or more.
  • the curing accelerator (B13) is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 1 parts by mass, per 100 parts by mass of the total amount of the epoxy compound (B11) and the thermosetting agent (B12). Included in the amount of By containing the curing accelerator (B13) in an amount in the above range, it has excellent adhesion even when exposed to high temperature and high humidity, and has high reliability even when exposed to severe reflow conditions. Can be achieved. By adding a curing accelerator (B13), the adhesiveness after hardening of a resin film formation layer can be improved. Such an effect is intensified as the content of the curing accelerator (B13) increases.
  • the energy ray-curable component resin film-forming layer contains the energy ray-curable component, so that the resin film-forming layer can be cured without performing a thermosetting process requiring a large amount of energy and a long time. . Thereby, the manufacturing cost can be reduced.
  • a compound (B21) having a functional group that reacts by energy ray irradiation may be used alone, but a compound (B21) having a functional group that reacts by energy ray irradiation and a photopolymerization initiator ( It is preferable to use a combination of B22).
  • (B21) A compound having a functional group that reacts by energy ray irradiation
  • energy ray reactive compound (B21) A specific example of the compound (B21) having a functional group that reacts by energy ray irradiation (hereinafter sometimes referred to as "energy ray reactive compound (B21)")
  • acrylate compounds such as acrylates, oligoester acrylates, urethane acrylate oligomers, epoxy acrylates, polyether acrylates and
  • a acrylate compound having a polymerizable structure acrylate compounds such as Con acid oligomer include those of relatively
  • the resin film forming layer preferably contains 1 to 1500 parts by mass of the energy ray reactive compound (B21) with respect to 100 parts by mass of the polymer component (A). And more preferably 3 to 1200 parts by mass.
  • photopolymerization initiator examples include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, benzoin dimethyl ketal 2,4-diethylthioxanthone, ⁇ -hydroxycyclohexyl phenyl ketone, benzyl diphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzyl, dibenzyl, diacetyl, 1,2-diphenylmethane, 2-hydroxy- 2-Methyl-1- [4- (1-methylvinyl) phenyl] propanone, 2,4,6-trimethylbenzoyl diphenyl phosphine oxide and Such as ⁇ - crawl anthr
  • the blending ratio of the photopolymerization initiator (B22) is preferably 0.1 to 10 parts by mass, and more preferably 1 to 5 parts by mass with respect to 100 parts by mass of the energy ray reactive compound (B21). . If the blending ratio of the photopolymerization initiator (B22) is less than 0.1 parts by mass, sufficient curability may not be obtained due to insufficient photopolymerization, and if it exceeds 10 parts by mass, residues not contributing to the photopolymerization May cause problems.
  • the second binder component imparts sheet shape maintainability and curability to the resin film-forming layer by containing the curable polymer component (AB).
  • the curable polymer component is a polymer having a curable functional group.
  • the curing functional group is a functional group that can react with each other to form a three-dimensional network structure, and includes a functional group that reacts by heating and a functional group that reacts by energy rays.
  • the curing functional group may be added in the unit of the continuous structure which becomes the skeleton of the curable polymer (AB) or may be added at the end.
  • the curable functional group may be attached to a side chain or directly added to the main chain It may be done.
  • the weight average molecular weight (Mw) of the curable polymer component (AB) is usually 20,000 or more from the viewpoint of achieving the purpose of imparting sheet shape maintainability to the resin film forming layer.
  • An epoxy group is mentioned as a functional group which reacts by heating.
  • the curable polymer component (AB) having an epoxy group include high molecular weight epoxy group-containing compounds and phenoxy resins having an epoxy group. High molecular weight epoxy group-containing compounds are disclosed, for example, in JP-A-2001-261789. Moreover, it is a polymer similar to the above-mentioned acrylic polymer (A1), and is a polymer polymerized using a monomer having an epoxy group as a monomer (epoxy group-containing acrylic polymer) It is also good.
  • the monomer having an epoxy group include (meth) acrylic acid esters having a glycidyl group such as glycidyl (meth) acrylate. When using an epoxy-group-containing acrylic polymer, the preferable aspect is the same as that of acrylic polymer (A1) except an epoxy group.
  • thermosetting agent (B12) or a curing accelerator (B13) When using a curable polymer component (AB) having an epoxy group, as in the case of using an epoxy-based thermosetting component as the curable component (B), a thermosetting agent (B12) or a curing accelerator (B13) ) May be used in combination.
  • Examples of functional groups that react with energy radiation include (meth) acryloyl groups.
  • a curable polymer component (AB) having a functional group that reacts with energy rays acrylate compounds having a polymerized structure such as polyether acrylate can be used, and those having a high molecular weight can be used.
  • a polymer prepared by reacting a low molecular weight compound having a functional group to be reacted by the reaction may be used.
  • the raw material polymer corresponds to the above-mentioned acrylic polymer (A1)
  • the preferable embodiment of the raw material polymer is the same as the acrylic polymer (A1).
  • a photopolymerization initiator (B22) may be used in combination as in the case of using an energy ray curable component (B2) .
  • the second binder component may contain the above-mentioned polymer component (A) or curable component (B) in combination with the curable polymer component (AB).
  • the resin film forming layer may contain the following components in addition to the binder component.
  • Inorganic filler resin film formation layer may contain the inorganic filler (C).
  • the inorganic filler (C) in the resin film forming layer it becomes possible to adjust the thermal expansion coefficient of the resin film after curing, and optimize the thermal expansion coefficient of the resin film after curing for the package.
  • the reliability of the semiconductor device can be improved.
  • the protective film is subjected to laser marking to remove inorganic fillers (C ) Is exposed and takes on a color close to white as the reflected light diffuses. Therefore, when the resin film forming layer contains a colorant (D) described later, a contrast difference is obtained between the laser marking portion and the other portion, and the printing becomes clear.
  • the inorganic filler include powders of silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide and boron nitride, beads obtained by spheroidizing them, single crystal fibers, glass fibers and the like.
  • silica fillers and alumina fillers are preferable.
  • the said inorganic filler (C) can be used individually or in mixture of 2 or more types.
  • the range of the content of the inorganic filler (C) for obtaining the above-mentioned effects more reliably is preferably 1 to 80 parts by mass, relative to 100 parts by mass of the total solids constituting the resin film forming layer.
  • the amount is preferably 20 to 75 parts by mass, particularly preferably 40 to 70 parts by mass.
  • Colorant resin film forming layer may be transparent. Further, a coloring agent (D) may be blended in the resin film forming layer to color it.
  • a coloring agent By blending a coloring agent, there is an effect that when marking is performed on a resin film by means such as laser marking, marks such as characters and symbols can be easily recognized. That is, in the package in which the resin film is formed, the product number etc. is usually printed on the surface of the resin film by the laser marking method (a method of scraping the surface of the protective film with laser light and performing printing).
  • Organic or inorganic pigments and dyes are used as colorants.
  • black pigments are preferable in terms of electromagnetic wave and infrared shielding properties.
  • a coloring agent (D) may be used individually by 1 type, and may be used in combination of 2 or more type.
  • an infrared-transparent colorant may be used.
  • the compounding amount of the colorant (D) is preferably 0.1 to 35 parts by mass, more preferably 0.5 to 25 parts by mass, particularly preferably 100 parts by mass of the total solids constituting the resin film forming layer. Is 1 to 15 parts by mass.
  • Coupling agent (E) having a functional group that reacts with an inorganic substance and a functional group that reacts with an organic functional group, adhesion of the resin film forming layer to the package, adhesion, and / or aggregation of the resin film It may be used to improve the quality. Moreover, the water resistance can be improved by using a coupling agent (E), without impairing the heat resistance of the resin film obtained by hardening
  • a coupling agent a titanate coupling agent, an aluminate coupling agent, a silane coupling agent and the like can be mentioned. Among these, silane coupling agents are preferred.
  • the functional group which reacts with the organic functional group is a group which reacts with the functional group which a polymer component (A), a curable component (B), a curable polymer component (AB), etc. have.
  • Certain silane coupling agents are preferably used.
  • ⁇ -glycidoxypropyltrimethoxysilane As such a silane coupling agent, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldiethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, ⁇ - (methacryloxy) Propyl) trimethoxysilane, ⁇ -aminopropyltrimethoxysilane, N-6- (aminoethyl) - ⁇ -aminopropyltrimethoxysilane, N-6- (aminoethyl) - ⁇ -aminopropylmethyldiethoxysilane, N -Phenyl- ⁇ -aminopropyltrimethoxysilane, ⁇ -ureidopropyltriethoxysilane, ⁇ -mercaptopropyltrimethoxysilane, ⁇ -mer
  • the amount of the silane coupling agent is usually 0.1 to 20 parts by mass, preferably 0.1 to 20 parts by mass with respect to a total of 100 parts by mass of the polymer component (A), the curable component (B) and the curable polymer component (AB). It is contained in a proportion of 2 to 10 parts by mass, more preferably 0.3 to 5 parts by mass. If the content of the silane coupling agent is less than 0.1 parts by mass, the above effect may not be obtained, and if it exceeds 20 parts by mass, it may cause outgassing.
  • additives may be blended in the general-purpose additive resin film-forming layer as required.
  • a leveling agent a plasticizer, an antistatic agent, an antioxidant, an ion scavenger, a gettering agent, a chain transfer agent, a release agent and the like can be mentioned.
  • the resin film forming layer is obtained, for example, using a composition (a composition for forming a resin film) obtained by mixing the above-mentioned respective components in an appropriate ratio.
  • the composition for resin film formation may be previously diluted with a solvent, or may be added to the solvent at the time of mixing. Moreover, you may dilute with a solvent at the time of use of the composition for resin film formation.
  • Such solvents include ethyl acetate, methyl acetate, diethyl ether, dimethyl ether, acetone, methyl ethyl ketone, acetonitrile, hexane, cyclohexane, toluene, heptane and the like.
  • the resin film-forming layer has initial adhesiveness and curability, and in the uncured state, easily adheres to the chip group package by pressing on the chip group package at normal temperature or under heating. In addition, when pressing, the resin film forming layer may be heated. Then, after curing, a resin film having high impact resistance can be finally given, the adhesive strength is also excellent, and sufficient reliability can be maintained even under severe high temperature and high humidity conditions.
  • the resin film forming layer may have a single layer structure or a multilayer structure.
  • the thickness of the resin film-forming layer is preferably 1 to 100 ⁇ m, more preferably 2 to 90 ⁇ m, and particularly preferably 3 to 80 ⁇ m. By setting the thickness of the resin film forming layer to the above range, the resin film forming layer functions as a highly reliable protective film or adhesive.
  • Ring frame holding means 13 is provided on the outer peripheral portion of the surface of the resin film forming layer.
  • a pressure-sensitive adhesive member comprising a single pressure-sensitive adhesive layer, a pressure-sensitive adhesive member comprising a base and a pressure-sensitive adhesive layer, or a double-sided pressure-sensitive adhesive member having a core material can be employed.
  • the ring frame holding means has a substantially rectangular outer peripheral shape, and has a rectangular hollow portion (inner opening) in the inner peripheral portion. Externally, it has a size that can be fixed to the ring frame. The internal opening is larger than the chip group package.
  • the ring frame is usually a molded body of metal or plastic.
  • a pressure-sensitive adhesive member consisting of a single pressure-sensitive adhesive layer
  • it is not particularly limited, but preferably made of, for example, an acrylic pressure-sensitive adhesive, a rubber pressure-sensitive adhesive, or a silicone pressure-sensitive adhesive.
  • acrylic pressure-sensitive adhesives are preferable in consideration of removability from the ring frame.
  • the above-mentioned pressure-sensitive adhesives may be used alone or in combination of two or more.
  • the thickness of the pressure-sensitive adhesive layer constituting the ring frame holding means is preferably 2 to 20 ⁇ m, more preferably 3 to 15 ⁇ m, and still more preferably 4 to 10 ⁇ m. When the thickness of the pressure-sensitive adhesive layer is less than 2 ⁇ m, sufficient adhesion may not be exhibited. When the thickness of the pressure-sensitive adhesive layer exceeds 20 ⁇ m, when peeling from the ring frame, the residue of the pressure-sensitive adhesive may remain on the ring frame to contaminate the ring frame.
  • the ring frame is attached to the pressure-sensitive adhesive layer constituting the pressure-sensitive adhesive member.
  • an adhesive which forms an adhesive layer it is the same as that of the adhesive which forms the adhesive layer in the adhesive member which consists of said adhesive layer single-piece
  • the thickness of an adhesive layer is also the same.
  • the base material constituting the ring frame holding means is not particularly limited.
  • examples thereof include polyolefin films such as acrylic acid ester copolymer films and ionomer resin films, polyvinyl chloride films, and polyethylene terephthalate films.
  • polyethylene films and polyvinyl chloride films are preferable in consideration of expandability, and polyvinyl chloride films are more preferable.
  • the thickness of the substrate constituting the ring frame holding means is preferably 5 to 200 ⁇ m, more preferably 10 to 150 ⁇ m, and still more preferably 20 to 100 ⁇ m.
  • the double-sided adhesive member having the core material When used as ring frame holding means, the double-sided adhesive member is formed on the core material, the pressure-sensitive adhesive layer for lamination formed on one surface, and the other surface. And a fixing pressure-sensitive adhesive layer.
  • the laminating pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer attached to the resin film-forming layer
  • the fixing pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer attached to the ring frame.
  • a core material of a double-sided adhesive member As a core material of a double-sided adhesive member, the thing similar to the base material of the said adhesive member is mentioned. Among these, polyolefin films and plasticized polyvinyl chloride films are preferred in consideration of expandability.
  • the thickness of the core material is usually 5 to 200 ⁇ m, preferably 10 to 150 ⁇ m, more preferably 20 to 100 ⁇ m.
  • the laminating pressure-sensitive adhesive layer and the fixing pressure-sensitive adhesive layer of the double-sided pressure-sensitive adhesive member may be layers formed of the same pressure-sensitive adhesive or layers formed of different pressure-sensitive adhesives.
  • the adhesion between the fixing pressure-sensitive adhesive layer and the ring frame is appropriately selected so as to be smaller than the adhesion between the resin film-forming layer and the lamination pressure-sensitive adhesive layer.
  • Examples of such pressure-sensitive adhesives include acrylic pressure-sensitive adhesives, rubber-based pressure-sensitive adhesives, and silicone pressure-sensitive adhesives. Among these, acrylic pressure-sensitive adhesives are preferable in consideration of removability from the ring frame.
  • the pressure-sensitive adhesive forming the fixing pressure-sensitive adhesive layer may be used alone or in combination of two or more. The same applies to the pressure-sensitive adhesive layer for lamination.
  • the thicknesses of the laminating pressure-sensitive adhesive layer and the fixing pressure-sensitive adhesive layer are the same as the thickness of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive member.
  • the ring frame holding means By providing the ring frame holding means, it becomes easy to bond the support sheet with the resin film forming layer to a jig such as a ring frame.
  • the long release sheet 14 plays a role as a carrier film when the resin film forming sheet is used, and the release sheet exemplified as the above-mentioned support sheet can be used.
  • the surface tension of the surface of the long release sheet in contact with the resin film-forming layer is preferably 40 mN / m or less, more preferably 37 mN / m or less, particularly preferably 35 mN / m or less.
  • the lower limit is usually about 25 mN / m.
  • the specific example of a long peeling sheet, a peeling agent, the peeling processing method, etc. are the same as that of the peeling sheet demonstrated as an example of the support sheet mentioned above.
  • the thickness of the long release sheet is not particularly limited, but is preferably 30 ⁇ m or more, more preferably 50 to 200 ⁇ m.
  • the release film is less than 30 ⁇ m, when the resin film forming sheet is wound in a roll, winding marks may be generated in the resin film forming layer.
  • the long laminated sheet 2 is sent out from the winding body 1, and while being bent at a sharp angle by the peel plate 40, the support sheet 10 with the resin film formation layer is peeled from the long release sheet 14, and the support with the resin film formation layer
  • the sheet 10 is attached to the chip group package 44.
  • the ring frame 45 is fixed to the ring frame holding means 13.
  • the surplus sheets (the release sheet 14 and the auxiliary sheet 15) are taken up through the guide rollers 42 and 43 and collected as a disposal tape 46.
  • the auxiliary sheet 15 is omitted in FIG. 9A.
  • the resin film forming layer 12 and the chip group package 44 are completely cut, and the support sheet 11 is diced so as not to be completely cut.
  • the package divided after dicing is peeled off from the support sheet 11 together with the resin film forming layer 12 to obtain a package to which the resin film forming layer is transferred.
  • the resin film forming layer may be cured to be a protective film prior to dicing, or may be cured after dicing.
  • a resin film formation layer as an adhesive bond layer, a package is stuck on a predetermined to-be-adhered body through a resin film formation layer, and a resin film formation layer is hardened as needed.
  • Such a process is carried out according to the method described in WO 2015/146254 for forming a protective film on a semiconductor wafer or chip or transferring an adhesive layer.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)

Abstract

Le problème décrit par la présente invention est de pourvoir à une feuille de support fixée à une couche de formation de film de résine rectangulaire au lieu d'une feuille à découpage en dés fixée à une couche de formation de film de résine ronde, et d'augmenter le taux de surface utile d'une couche de formation de film de résine. Le problème selon la présente invention est en outre d'obtenir une caractéristique qui permette à une feuille de support fixée à une couche de formation de film de résine d'être décollée (ôtée) de manière fiable. La solution selon la présente invention porte sur une longue feuille stratifiée caractérisée en ce qu'elle comprend une feuille de support sensiblement rectangulaire, une couche de formation de film de résine qui est formée sur la feuille de support et qui possède sensiblement la même forme que la feuille de support, une feuille de support fixée à une couche de formation de film de résine qui comprend un moyen de retenue à cadre annulaire ayant une section d'ouverture sensiblement rectangulaire formée dans la section périphérique externe de la surface de la couche de formation de film de résine, et une longue feuille antiadhésive. Une longue feuille auxiliaire est stratifiée en continu sur les deux extrémités dans la direction latérale sur une surface à traitement antiadhésif de la feuille antiadhésive, et une pluralité de feuilles de support fixées à une couche de formation de film de résine sont collées indépendamment et temporairement de manière détachable dans la direction longitudinale de la feuille antiadhésive sur l'intérieur dans la direction latérale sur la surface à traitement antiadhésif de la feuille antiadhésive. De préférence, lorsque la longue feuille stratifiée est distribuée et que la feuille de support fixée à une couche de formation de film de résine est collée à un adhésif tout en étant décollée de la longue feuille antiadhésive, la forme du côté d'extrémité avant de la feuille de support fixée à une couche de formation de film de résine qui est en contact avec l'adhésif au début est relevée sur l'extérieur de la feuille de support fixée à une couche de formation de film de résine.
PCT/JP2019/001918 2018-01-24 2019-01-22 Longue feuille stratifiée et son corps d'enroulement WO2019146607A1 (fr)

Priority Applications (1)

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JP2019567093A JP7402052B2 (ja) 2018-01-24 2019-01-22 長尺積層シートおよびその巻収体

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JP2018-009738 2018-01-24
JP2018009738 2018-01-24

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CN112574692B (zh) * 2020-12-01 2022-09-13 东莞新能德科技有限公司 双面胶及电池的制备方法

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JP2010083921A (ja) * 2008-09-29 2010-04-15 Lintec Corp 半導体加工用粘着シートおよび半導体加工用テープ
WO2015146254A1 (fr) * 2014-03-26 2015-10-01 リンテック株式会社 Stratifié pour feuille de formation de film de résine
WO2015190230A1 (fr) * 2014-06-10 2015-12-17 リンテック株式会社 Feuille de découpage en dés
WO2016027883A1 (fr) * 2014-08-22 2016-02-25 リンテック株式会社 Feuille pour formation de membrane protectrice, et procédé de fabrication de puce semi-conductrice avec membrane protectrice

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Publication number Priority date Publication date Assignee Title
JP2012122058A (ja) * 2010-11-18 2012-06-28 Nitto Denko Corp ダイボンドフィルム、ダイシング・ダイボンドフィルム、ダイボンドフィルムの製造方法、及び、ダイボンドフィルムを有する半導体装置
JP5158908B1 (ja) * 2012-04-02 2013-03-06 古河電気工業株式会社 接着シート
JP6369996B2 (ja) * 2013-10-21 2018-08-08 リンテック株式会社 樹脂膜形成用シート

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010083921A (ja) * 2008-09-29 2010-04-15 Lintec Corp 半導体加工用粘着シートおよび半導体加工用テープ
WO2015146254A1 (fr) * 2014-03-26 2015-10-01 リンテック株式会社 Stratifié pour feuille de formation de film de résine
WO2015190230A1 (fr) * 2014-06-10 2015-12-17 リンテック株式会社 Feuille de découpage en dés
WO2016027883A1 (fr) * 2014-08-22 2016-02-25 リンテック株式会社 Feuille pour formation de membrane protectrice, et procédé de fabrication de puce semi-conductrice avec membrane protectrice

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JP7402052B2 (ja) 2023-12-20
TW201940621A (zh) 2019-10-16
TWI803567B (zh) 2023-06-01
JPWO2019146607A1 (ja) 2021-01-07
TW202332746A (zh) 2023-08-16

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