WO2020218519A1 - Procédé de production d'un corps à trois couches, procédé de production d'un corps à quatre couches, procédé de production d'un dispositif à semi-conducteurs équipé d'un film de protection de surface arrière, et corps à trois couches - Google Patents

Procédé de production d'un corps à trois couches, procédé de production d'un corps à quatre couches, procédé de production d'un dispositif à semi-conducteurs équipé d'un film de protection de surface arrière, et corps à trois couches Download PDF

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Publication number
WO2020218519A1
WO2020218519A1 PCT/JP2020/017717 JP2020017717W WO2020218519A1 WO 2020218519 A1 WO2020218519 A1 WO 2020218519A1 JP 2020017717 W JP2020017717 W JP 2020017717W WO 2020218519 A1 WO2020218519 A1 WO 2020218519A1
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WO
WIPO (PCT)
Prior art keywords
back surface
protective film
surface protective
film
film forming
Prior art date
Application number
PCT/JP2020/017717
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English (en)
Japanese (ja)
Inventor
厚史 上道
拓 根本
康喜 中石
健太 古野
Original Assignee
リンテック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by リンテック株式会社 filed Critical リンテック株式会社
Priority to JP2020547152A priority Critical patent/JP6854983B1/ja
Priority to KR1020217031950A priority patent/KR20220004964A/ko
Priority to CN202080026612.1A priority patent/CN113692352A/zh
Priority to SG11202110169VA priority patent/SG11202110169VA/en
Publication of WO2020218519A1 publication Critical patent/WO2020218519A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings

Definitions

  • the present invention relates to a method for manufacturing a third laminated body, a method for manufacturing a fourth laminated body, a method for manufacturing a semiconductor device with a back surface protective film, and a third laminated body.
  • a method for manufacturing a third laminate in which a work such as a semiconductor wafer, a film for forming a back surface protective film, and a support sheet are laminated in this order, a work such as a semiconductor wafer, a back surface protective film, and a support sheet.
  • a method for manufacturing a fourth laminated body laminated in this order a method for manufacturing a semiconductor device with a back surface protective film using these, a work such as a semiconductor wafer, a film for forming a back surface protective film, and a support sheet.
  • a work such as a semiconductor wafer, a film for forming a back surface protective film, and a support sheet.
  • the present application claims priority based on Japanese Patent Application No. 2019-08629 filed in Japan on April 26, 2019, the contents of which are incorporated herein by reference.
  • semiconductor devices to which a mounting method called a face down method has been applied have been manufactured.
  • a semiconductor chip having an electrode such as a bump on the circuit surface is used, and the electrode is bonded to the substrate. Therefore, the back surface of the semiconductor chip opposite to the circuit surface may be exposed.
  • a resin film containing an organic material is formed on the back surface of the exposed semiconductor chip as a back surface protective film, and may be incorporated into a semiconductor device as a semiconductor chip with a back surface protective film.
  • the back surface protective film is used to prevent cracks from occurring in the semiconductor chip after the dicing step or packaging (for example, Patent Documents 1 and 2).
  • Such a semiconductor chip with a back surface protective film is manufactured, for example, through the process shown in FIG. That is, the back surface protective film forming film 13 is laminated on the back surface 8b of the semiconductor wafer 8 having the circuit surface (FIG. 9A), and the back surface protective film forming film 13 is thermally cured or energy ray cured to protect the back surface.
  • the film is 13'(FIG. 9 (B)), the back surface protective film 13'is laser-marked (FIG. 9 (C)), and the support sheet 10 is laminated on the back surface protective film 13'(FIG. 9 (D)).
  • the wafer 8 and the back surface protective film 13' are die to obtain a semiconductor chip 7 with a back surface protective film (FIGS.
  • FIGS. 9 (E) and 9 (F) the semiconductor chip 7 with a back surface protective film is picked up from the support sheet 10.
  • the method is known.
  • the order of the curing step and the laser marking step is arbitrary, and the back surface protective film forming film 13 is laminated on the back surface 8b of the semiconductor wafer 8 having a circuit surface (FIG. 9A), and the back surface protective film forming film 13 is laminated.
  • the back surface protective film forming film 13 may be thermoset or energy ray cured to form a back surface protective film 13', and then the steps of FIGS. 9 (D) to 9 (G) may be performed.
  • FIG. 9 (D) to 9 (G) the steps of FIGS. 9 (D) to 9 (G) may be performed.
  • the device is a separate device.
  • These methods include not only a semiconductor device as a semiconductor chip obtained by dying a semiconductor wafer and individualizing it, but also a semiconductor device panel consisting of an aggregate of semiconductor devices in which at least one electronic component is sealed with a sealing resin. Therefore, it is also used in the case of manufacturing a semiconductor device in which at least one electronic component is sealed with a sealing resin by dying in the same manner.
  • a protective film forming composite sheet in which the back surface protective film forming film 13 and the support sheet 10 are integrated is used for manufacturing a semiconductor chip with a back surface protective film (for example, Patent Document 2).
  • a method for manufacturing a semiconductor chip with a back surface protective film using a composite sheet for forming a protective film goes through, for example, the process shown in FIG. That is, the back surface protective film forming film 13 of the protective film forming composite sheet 1 in which the back surface protective film forming film 13 and the support sheet 10 are laminated is attached to the back surface 8b of the semiconductor wafer 8 having the circuit surface (FIG. 10 (A')), the circuit surface protection tape 17 is peeled off (FIG. 10 (B')), and the back surface protective film forming film 13 is heat-cured or energy ray-cured to obtain the back surface protective film 13'(FIG. 10). (C')), laser marking the back surface protective film 13'from the side of the support sheet 10 (FIG.
  • the exposed back surface protective film forming film 13 or the back surface protective film 13' is formed. It can be laser marked directly.
  • the support sheet 10 is supported. Laser marking is performed by irradiating the sheet 10 with a laser beam, but the outlines of the characters and symbols printed at the interface between the back surface protective film forming film 13 and the support sheet 10 are blurred, and the visual recognition after printing is performed. The sex gets worse.
  • the back surface protective film can be laser-marked through the support sheet, and the work such as a semiconductor wafer having good visibility of the laser mark, the back surface protective film forming film, and the support It is an object of the present invention to provide a method for producing a third laminated body in which sheets are laminated in this order. Further, in the present invention, the back surface protective film can be laser-marked through the support sheet, and the work such as a semiconductor wafer, which has good visibility of the laser mark, the back surface protective film, and the support sheet can be formed. , An object of the present invention is to provide a method for producing a fourth laminated body laminated in this order. Furthermore, an object of the present invention is to provide a method for manufacturing a semiconductor device with a back surface protective film using these.
  • the present invention provides the following method for manufacturing a third laminated body, a method for manufacturing a fourth laminated body, a method for manufacturing a semiconductor device with a back surface protective film, and a third laminated body.
  • One side of the work is the circuit surface and the other side is the back surface.
  • One surface of the back surface protective film forming film is a smooth surface, and the other surface is a rough surface coarser than the smooth surface.
  • the device for attaching the back surface protective film forming film and the device for attaching the support sheet are connected or the same.
  • the second laminated body to which the back surface protective film forming film is attached to the work is conveyed one by one.
  • Any of the above [1] to [3], wherein the transport distance of the work from the sticking start point of the first laminating step to the sticking completion point of the second laminating step is 7000 mm or less.
  • the support sheet has an adhesive layer provided on a base material.
  • the third item according to any one of [1] to [9], which comprises a second laminating step of attaching the pressure-sensitive adhesive layer of the support sheet to the smooth surface of the back surface protective film forming film.
  • Method for manufacturing a laminate [11] The method for producing a third laminate according to the above [10], wherein the pressure-sensitive adhesive layer is energy ray-curable.
  • the step of picking up the semiconductor device with the back surface protective film from the support sheet is included.
  • the back surface protective film forming film and the work of the third laminate produced by the production method according to any one of the above [1] to [12] are diced to form the back surface protective film.
  • the process of making a semiconductor device with a film for A step of curing the back surface protective film forming film to obtain a back surface protective film, and A step of picking up a semiconductor device with a film for forming a back surface protective film or a semiconductor device with a back surface protective film from the support sheet is included.
  • a method for manufacturing a semiconductor device with a back surface protective film. [17] The back surface protective film forming film is thermosetting, and the step of forming the back surface protective film is the above-mentioned [15] or [16] in which the back surface protective film forming film is heat-treated and heat-cured. The method for manufacturing a semiconductor device with a back surface protective film.
  • the back surface protective film forming film is energy ray curable, and the step of forming the back surface protective film is to irradiate the back surface protective film forming film with energy rays to cure the energy ray.
  • the work, the film for forming the back surface protective film, and the support sheet are laminated in this order as a third laminated body.
  • One side of the work is the circuit surface and the other side is the back surface.
  • One surface of the back surface protective film forming film is a smooth surface, and the other surface is a rough surface coarser than the smooth surface.
  • the rough surface of the back surface protective film forming film is bonded to the back surface of the work.
  • the work, the back surface protective film forming film, and the support sheet which can be laser-marked on the back surface protective film through the support sheet and have good visibility of the laser mark, are formed.
  • a method for producing a third laminated body laminated in this order is provided.
  • the work, the back surface protective film, and the support sheet are laminated in this order, in which the back surface protective film can be laser-marked through the support sheet and the visibility of the laser mark is good.
  • a method for producing the fourth laminated body is provided.
  • the present invention provides a method for manufacturing a semiconductor device with a back surface protective film using these.
  • FIG. 1 is a schematic cross-sectional view schematically showing an example of an embodiment of a method for manufacturing a third laminated body.
  • the method for manufacturing the third laminated body of the present embodiment is a method for manufacturing the third laminated body 19 in which the work 14, the back surface protective film forming film 13, and the support sheet 10 are laminated in this order.
  • One surface of 14 is a circuit surface 14a
  • the other surface is a back surface 14b (FIG. 1 (a))
  • one surface of the back surface protective film forming film 13 is a smooth surface 13b and the other surface.
  • the first laminating step (FIG.
  • the third laminated body of the present embodiment is a third laminated body in which the work 14, the back surface protective film forming film 13, and the support sheet 10 are laminated in this order, and one of the works 14.
  • the surface is a circuit surface 14a
  • the other surface is a back surface 14b
  • one surface of the back surface protective film forming film 13 is a smooth surface 13b
  • the other surface is a rough surface 13a that is coarser than the smooth surface 13b.
  • the rough surface 13a of the back surface protective film forming film 13 is attached to the back surface 14b of the work 14, and the support sheet 10 is attached to the smooth surface 13b of the back surface protective film forming film 13 (FIG. 1 (e). )).
  • a semiconductor wafer is used as the work 14 shown in FIG. 1 (a).
  • One surface of the semiconductor wafer is the circuit surface 14a, on which bumps are formed.
  • the circuit surface 14a and bumps of the semiconductor wafer are circuited. It is protected by a surface protection tape 17.
  • the circuit surface protection tape 17 is a back surface grinding tape, and the back surface of the semiconductor wafer, which is the work 14, (that is, the back surface 14b of the work) is a ground surface.
  • the work 14 is not limited as long as it has a circuit surface 14a on one side and the other surface can be said to be the back surface.
  • a semiconductor wafer having a circuit surface on one side or individual electronic components are sealed with a sealing resin, and one side has a terminal forming surface (in other words, a circuit surface) of a semiconductor device with terminals.
  • An example includes a semiconductor device panel composed of a semiconductor device assembly with terminals.
  • the circuit surface protection tape 17 for example, the surface protection sheet disclosed in JP-A-2016-192488 and JP-A-2009-141265 can be used.
  • the circuit surface protection tape 17 includes an adhesive layer having an appropriate removability.
  • the pressure-sensitive adhesive layer may be formed of a general-purpose weak adhesive type pressure-sensitive adhesive such as rubber-based, acrylic-based, silicone-based, urethane-based, and vinyl ether-based. Further, the pressure-sensitive adhesive layer may be an energy ray-curable pressure-sensitive adhesive that is cured by irradiation with energy rays and becomes removable.
  • the circuit surface protection tape 17 has a double-sided tape shape, and the outer side of the circuit surface protection tape 17 may be fixed to a hard support, or the work 14 may be fixed to a hard support. ..
  • the term "energy beam” means an electromagnetic wave or a charged particle beam having an energy quantum.
  • energy rays include ultraviolet rays, radiation, electron beams and the like.
  • Ultraviolet rays can be irradiated by using, for example, a high-pressure mercury lamp, a fusion lamp, a xenon lamp, a black light, an LED lamp, or the like as an ultraviolet source.
  • the electron beam can be irradiated with an electron beam generated by an electron beam accelerator or the like.
  • energy ray curable means a property of being cured by irradiating with energy rays
  • non-energy ray curable is a property of not being cured by irradiating with energy rays.
  • the back surface protective film forming film 13 can be used as the first laminated body 5 shown in FIG.
  • the first laminated body 5 shown in FIG. 2 includes a first release film 151 on one surface (that is, the rough surface 13a) of the back surface protective film forming film 13, and the other surface on the opposite side to the rough surface 13a.
  • a second release film 152 is provided on (that is, the smooth surface 13b).
  • the back surface protective film forming film 13 at this time may be one that has been processed in advance according to the shape of the work 14, or may be processed and used in the apparatus immediately before.
  • the second release film 152 on the side of the smooth surface 13b is peeled off to form the second laminated body 6 (FIG. 1 (c)).
  • the back surface protective film forming film shown in FIG. 2 is prepared, for example, by applying a protective film forming composition containing a solvent on the peeling surface of the second release film 152 having a thickness of 38 ⁇ m with a knife coater and then placing the film in an oven. Then, it is dried at 120 ° C. for 2 minutes to form a film for forming a back surface protective film. Next, the release surface of the first release film 151 having a thickness of 38 ⁇ m was overlapped with the back surface protective film forming film and the two were bonded to each other, and the first release film 151 and the back surface protective film forming film (formation of the back surface protective film in FIG. 2).
  • a film for forming a back surface protective film including the film 13) (thickness: 25 ⁇ m) and the second release film 152 can be obtained.
  • a back surface protective film forming film is suitable for storage, for example, in the form of a roll.
  • the peeled surface of the first peeling film 151 is, for example, a rough surface having a surface roughness Ra of 200 nm
  • the peeled surface of the second peeling film 152 is smoother than the surface roughness of the rough surface, for example, the surface roughness.
  • the smooth surface with Ra of 30 nm one surface of the back surface protective film forming film 13 can be made into a smooth surface 13b, and the side opposite to the one surface of the back surface protective film forming film 13.
  • the other surface of the above can be a rough surface 13a that is coarser than the smooth surface 13b. Then, after the first release film 151 on the side of the rough surface 13a is peeled off, the rough surface 13a of the back surface protective film forming film 13 is attached to the back surface 14b of the work 14 face to face in the first laminating step. ..
  • the back surface protective film is as follows.
  • One surface of the forming film 13 can be a smooth surface 13b, and the other surface of the back surface protective film forming film 13 opposite to the one surface is a rough surface 13a that is rougher than the smooth surface 13b. Can be.
  • a protective film-forming composition containing a solvent is applied to the peeled surface of the second peeling film 152 having a surface roughness Ra of 30 nm with a knife coater, and then dried in an oven at 120 ° C. for 2 minutes. To form a film for forming a back surface protective film.
  • the peeling surface of the first release film 151 having a thickness of 38 ⁇ m and a surface roughness Ra of 30 nm was superposed on the film for forming the back surface protective film, and both were bonded together under the conditions of, for example, 23 ° C. and 0.4 MPa.
  • a back surface protective film forming film including a first release film 151, a back surface protective film forming film (back surface protective film forming film 13 in FIG. 2) (thickness: 25 ⁇ m), and a second release film 152 is obtained. be able to. As a result, the rough surface 13a of the back surface protective film forming film 13 and the first release film 151 become a light release surface, and the smooth surface 13b of the back surface protective film forming film 13 and the second release film 152 are separated from each other. The peeling strength of the light peeling surface is higher than that of the light peeling surface.
  • Such a film for forming a back surface protective film is also suitable for storage as a roll, for example.
  • the surface roughness of the back surface protective film forming film on the first release film 151 side can be adjusted by the conditions of the temperature and pressure at which the release surface of the first release film 151 is attached to the back surface protective film forming film. If the temperature and pressure conditions for bonding the release surface of the first release film 151 to the back surface protective film forming film are increased, the surface roughness of the back surface protective film forming film on the first release film 151 side becomes the first release. It is faithful to the surface roughness of the peeled surface of the film 151.
  • the surface roughness Ra of the rough surface of the back surface protective film forming film facing the back surface side of the work may be 32 to 1200 nm, preferably 32 to 1000 nm, and 32 to 900 nm. Is more preferable, and 32 to 800 nm is particularly preferable.
  • the surface roughness Ra of the smooth surface of the back surface protective film forming film facing the side of the support sheet is preferably 20 to 80 nm, more preferably 24 to 50 nm, and 28 to 32 nm. Is more preferable.
  • the ratio of the surface roughness Ra of the rough surface of the back surface protective film forming film to the surface roughness Ra of the smooth surface of the back surface protective film forming film (rough surface surface roughness Ra / smooth surface surface roughness Ra).
  • the Ra may be 1.1 to 50, 1.2 to 45, 1.3 to 35, 1.4 to 30, and 1 It may be .5 to 24.
  • the support sheet 10 is laminated on the smooth surface 13b of the back surface protective film forming film 13 laminated on the back surface 14b of the work 14.
  • the support sheet 10 is, for example, a circular polyethylene terephthalate film having a thickness of 80 ⁇ m and a diameter of 270 mm, and is provided with a jig adhesive layer 16 on the outer peripheral portion.
  • the work 14 is fixed to the fixing jig 18 together with the back surface protective film forming film 13.
  • the support sheet 10 is laminated on the smooth surface 13b of the back surface protective film forming film 13 and fixed to the fixing jig 18 via the jig adhesive layer 16 (FIG. 1 (e)). ..
  • FIG. 9A a device for laminating a back surface protective film forming film 13 on the back surface 8b of a semiconductor wafer 8
  • FIG. 9D a device for laminating a support sheet 10 on a back surface protective film 13'.
  • the back surface protective film forming film is formed at least between the first laminating step shown in FIG. 1 (b) and the second laminating step shown in FIG. 1 (d). It can be performed by connecting the device to be attached and the device to attach the support sheet, or can be performed in the same device.
  • the second laminated body in which the back surface protective film forming film 13 is attached to the work 14 is not accommodated in the cassette, and FIG. It can be conveyed one by one to the second laminating step shown in d).
  • the device space can be further reduced.
  • the manufacturing efficiency can be improved and the contamination and damage of the second laminated body can be suppressed.
  • the step of peeling the second release film 152 on the smooth surface 13b side from the back surface protective film forming film 13 is also an apparatus for attaching the back surface protective film forming film.
  • the device for peeling the second release film and the device for attaching the support sheet can be connected to each other, or can be performed in the same device.
  • the back surface protective film forming film 13 used in the first laminating step may be processed into the shape of the work in advance, or may be processed in the same apparatus immediately before the first laminating step is performed. If the size of the work is constant on the production line used, the former that can be machined in advance is more efficient, and if the size of the work is likely to change, the latter For example, there is no waste of the film for forming the back surface protective film, and there is a cost merit.
  • the step of peeling the first release film 151 on the rough surface 13a side from the back surface protective film forming film 13 of the first laminated body 5 is also an apparatus for peeling the first release film. It can be carried out by connecting with a device to which a film for forming a back surface protective film is attached, or it can be carried out in the same device.
  • the transport distance of the work 14 can be designed to be 7,000 mm or less, and the device space can be reduced.
  • the transport distance of the work 14 from the sticking start point of the first laminating step to the sticking completion point of the second laminating step (or the sticking start point of the first laminating step to the curing completion point of the curing step). Can be 6500 mm or less, 6000 mm or less, 4500 mm or less, or 3000 mm or less.
  • the transport time of the work 14 from the start of sticking of the first laminating step to the completion of sticking of the second laminating step can be reduced to 150 s or less, and the process time can be shortened. can do.
  • the transport time of the work 14 from the start of sticking of the first laminating step to the completion of sticking of the second laminating step can be 130 s or less, 110 s or less, 90 s or less. It can be set to 70s or less.
  • the transport time of the work 14 from the start of sticking of the first laminating step to the completion of curing of the curing step can be reduced to 400 s or less, and the step time can be shortened. it can.
  • the transport time of the work 14 from the start of sticking in the first laminating step to the completion of curing in the curing step may be 300 s or less, 250 s or less, or 200 s or less. It can also be 150 s or less.
  • the speed at which the support sheet 10 is attached to the smooth surface 13b of the back surface protective film forming film 13 can be 100 mm / s or less, 80 mm / s or less, or 60 mm / s or less. It can also be 40 mm / s or less.
  • the sticking speed in the first laminating step and the sticking speed in the second laminating step can be 2 mm / s or more, 5 mm / s or more, or 10 mm / s or more. You can also do it.
  • the production efficiency of the second laminated body 6 and the third laminated body 19 is improved by the sticking speed in the first laminating step and the sticking speed in the second laminating step being equal to or higher than the above lower limit value.
  • the transport time of the work 14 from the start of pasting of the first laminating step to the completion of pasting of the second laminating step can be set to 150 s or less, from the start of pasting of the first laminating step.
  • the transport time of the work 14 until the completion of curing in the curing step can be set to 400 s or less.
  • the transport distance of the work from the sticking start point of the first laminating step of the present embodiment shown in FIG. 1 (b) to the sticking completion point of the second laminating step shown in FIG. 1 (d) is 7000 mm. It can be as follows, it can be 6500 mm or less, it can be 6000 mm or less, it can be 4500 mm or less, and it can be 3000 mm or less.
  • the transport time of the work from the start of sticking of the first laminating step of the present embodiment shown in FIG. 1 (b) to the completion of sticking of the second laminating step shown in FIG. 1 (d) is 150 s. It can be as follows, it can be 130 s or less, and it can be 110 s or less.
  • the transport distance of the work from the sticking start point of the first laminating step of the present embodiment shown in FIG. 1 (b) to the curing completion point of the curing step shown in FIG. 4 (g) is 7,000 mm or less. It can be 6500 mm or less, it can be 6000 mm or less, it can be 4500 mm or less, and it can be 3000 mm or less.
  • the transport time of the work 14 from the sticking start point of the first laminating step of the present embodiment shown in FIG. 1 (b) to the curing completion point of the curing step shown in FIG. 4 (g) is 400 s or less. It can be set to 300 s or less, 250 s or less, 200 s or less, or 150 s or less.
  • the composition of the protective film forming composition for forming the back surface protective film forming film preferably contains a binder polymer component and a curable component.
  • Binder polymer component A binder polymer component is used to impart sufficient adhesiveness and film forming property (sheet forming property) to the back surface protective film forming film.
  • the binder polymer component conventionally known acrylic polymers, polyester resins, urethane resins, acrylic urethane resins, silicone resins, rubber-based polymers and the like can be used.
  • the weight average molecular weight (Mw) of the binder polymer component is preferably 10,000 to 2 million, more preferably 100,000 to 1.2 million. If the weight average molecular weight of the binder polymer component is too low, the adhesive force between the back surface protective film forming film and the support sheet becomes high, and transfer failure of the back surface protective film forming film may occur. If it is too high, the back surface protective film is formed. The adhesiveness of the film for use may deteriorate and transfer to a chip or the like may not be possible, or the back surface protective film may peel off from the chip or the like after transfer.
  • Acrylic polymer is preferably used as the binder polymer component.
  • the glass transition temperature (Tg) of the acrylic polymer is preferably in the range of ⁇ 60 to 50 ° C., more preferably ⁇ 50 to 40 ° C., and particularly preferably ⁇ 40 to 30 ° C. If the glass transition temperature of the acrylic polymer is too low, the peeling force between the back surface protective film forming film and the support sheet may increase, causing transfer failure of the back surface protective film forming film. If it is too high, the back surface protective film forming film may occur. The adhesiveness of the film may deteriorate and transfer to a chip or the like may not be possible, or the back surface protective film may peel off from the chip or the like after transfer.
  • Examples of the monomer constituting the acrylic polymer include a (meth) acrylic acid ester monomer or a derivative thereof.
  • an alkyl (meth) acrylate having an alkyl group having 1 to 18 carbon atoms specifically methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, and 2-ethylhexyl.
  • Examples include (meth) acrylate.
  • a (meth) acrylate having a cyclic skeleton specifically, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, Examples thereof include dicyclopentenyloxyethyl (meth) acrylate and imide (meth) acrylate.
  • examples of the monomer having a functional group include hydroxymethyl (meth) acrylate having a hydroxyl group, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate and the like; and glycidyl (meth) having an epoxy group.
  • examples include acrylate.
  • an acrylic polymer containing a monomer having a hydroxyl group is preferable because it has good compatibility with a curable component described later.
  • the acrylic polymer may be copolymerized with acrylic acid, methacrylic acid, itaconic acid, vinyl acetate, acrylonitrile, styrene and the like.
  • thermoplastic resin for maintaining the flexibility of the protective film after curing may be blended.
  • a thermoplastic resin one having a weight average molecular weight of 1,000 to 100,000 is preferable, and one having a weight average molecular weight of 3,000 to 80,000 is more preferable.
  • the glass transition temperature of the thermoplastic resin is preferably ⁇ 30 to 120 ° C., more preferably ⁇ 20 to 120 ° C.
  • the thermoplastic resin include polyester resin, urethane resin, phenoxy resin, polybutene, polybutadiene, polystyrene and the like. These thermoplastic resins can be used alone or in admixture of two or more.
  • the back surface protective film forming film follows the transfer surface of the back surface protective film forming film, and the generation of voids and the like can be suppressed.
  • thermosetting component As the curable component, a thermosetting component and / or an energy ray curable component is used.
  • thermosetting component a thermosetting resin and a thermosetting agent are used.
  • thermosetting resin for example, an epoxy resin is preferable.
  • the epoxy resin a conventionally known epoxy resin can be used.
  • the epoxy resin include polyfunctional epoxy resin, biphenyl compound, bisphenol A diglycidyl ether and its hydrogenated product, orthocresol novolac epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, and bisphenol.
  • examples thereof include epoxy compounds having bifunctionality or higher in the molecule, such as A-type epoxy resin, bisphenol F-type epoxy resin, and phenylene skeleton-type epoxy resin. These can be used alone or in combination of two or more.
  • the film for forming the back surface protective film contains 100 parts by mass of the binder polymer component, preferably 1 to 1000 parts by mass, more preferably 10 to 500 parts by mass, and particularly preferably 20 to 200 parts by mass. Is done. If the content of the thermosetting resin is less than 1 part by mass, sufficient adhesiveness may not be obtained, and if it exceeds 1000 parts by mass, the peeling force between the back surface protective film forming film and the pressure-sensitive adhesive sheet or the base film becomes strong. It becomes high, and transfer failure of the back surface protective film forming film may occur.
  • thermosetting agent functions as a curing agent for thermosetting resins, especially epoxy resins.
  • Preferred thermosetting agents include compounds having two or more functional groups capable of reacting with epoxy groups in one molecule.
  • the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxyl group and an acid anhydride. Of these, phenolic hydroxyl groups, amino groups, acid anhydrides and the like are preferable, and phenolic hydroxyl groups and amino groups are more preferable.
  • phenolic curing agent examples include polyfunctional phenolic resin, biphenol, novolak type phenolic resin, dicyclopentadiene type phenolic resin, zylock type phenolic resin, and aralkylphenolic resin.
  • amine-based curing agent examples include DICY (dicyandiamide). These can be used alone or in combination of two or more.
  • the content of the thermosetting agent is preferably 0.1 to 500 parts by mass and more preferably 1 to 200 parts by mass with respect to 100 parts by mass of the thermosetting resin. If the content of the thermosetting agent is small, the adhesiveness may not be obtained due to insufficient curing, and if it is excessive, the hygroscopicity of the film for forming the back surface protective film may increase and the reliability of the semiconductor device may be lowered.
  • the energy ray-curable component a low molecular weight compound (energy ray-polymerizable compound) containing an energy ray-polymerizable group and polymerizing and curing when irradiated with energy rays such as ultraviolet rays and electron beams can be used.
  • energy ray-curable component trimethylolpropantriacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate or 1,4-butylene glycol.
  • Examples thereof include acrylate-based compounds such as diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, oligoester acrylate, urethane acrylate-based oligomer, epoxy-modified acrylate, polyether acrylate and itaconic acid oligomer.
  • acrylate-based compounds such as diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, oligoester acrylate, urethane acrylate-based oligomer, epoxy-modified acrylate, polyether acrylate and itaconic acid oligomer.
  • Such a compound has at least one polymerizable double bond in the molecule, and usually has a weight average molecular weight of about 100 to 30,000, preferably about 300 to 10,000.
  • the blending amount of the energy ray-polymerizable compound is preferably 1 to 1500 parts by mass, more preferably 10 to 500 parts by mass, and
  • an energy ray-curable polymer in which an energy ray-curable group is bonded to the main chain or side chain of the binder polymer component may be used.
  • Such an energy ray-curable polymer has both a function as a binder polymer component and a function as a curable component.
  • the main skeleton of the energy ray-curable polymer is not particularly limited, and may be an acrylic polymer that is widely used as a binder polymer component, or may be polyester, polyether, or the like, but synthesis and control of physical properties may be used. It is particularly preferable to use an acrylic polymer as a main skeleton because it is easy to use.
  • the energy ray-polymerizable group bonded to the main chain or side chain of the energy ray-curable polymer is, for example, a group containing an energy ray-polymerizable carbon-carbon double bond, specifically, a (meth) acryloyl group or the like. Can be exemplified.
  • the energy ray-polymerizable group may be bonded to the energy ray-curable polymer via an alkylene group, an alkyleneoxy group, or a polyalkyleneoxy group.
  • the weight average molecular weight (Mw) of the energy ray-curable polymer to which the energy ray-polymerizable group is bonded is preferably 10,000 to 2 million, more preferably 100,000 to 1.5 million.
  • the glass transition temperature (Tg) of the energy ray-curable polymer is preferably in the range of ⁇ 60 to 50 ° C., more preferably ⁇ 50 to 40 ° C., and particularly preferably ⁇ 40 to 30 ° C.
  • the energy ray-curable polymer is, for example, an acrylic polymer containing a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group or an epoxy group, and a substituent and an energy ray-polymerizable carbon that react with the functional group. It is obtained by reacting with a polymerizable group-containing compound having 1 to 5 carbon double bonds per molecule.
  • the substituent that reacts with the functional group include an isocyanate group, a glycidyl group, a carboxyl group and the like.
  • Examples of the polymerizable group-containing compound include (meth) acryloyloxyethyl isocyanate, meta-isopropenyl- ⁇ , ⁇ -dimethylbenzyl isocyanate, (meth) acryloyl isocyanate, allyl isocyanate, glycidyl (meth) acrylate; (meth) acrylic acid and the like. Can be mentioned.
  • the acrylic polymer is a (meth) acrylic monomer having a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, an epoxy group or a derivative thereof, and another (meth) acrylic acid ester monomer copolymerizable therewith.
  • a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, an epoxy group or a derivative thereof
  • another (meth) acrylic acid ester monomer copolymerizable therewith is preferably a copolymer composed of a derivative thereof.
  • Examples of the (meth) acrylic monomer having a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, and an epoxy group or a derivative thereof include 2-hydroxyethyl (meth) acrylate having a hydroxyl group and 2-hydroxy.
  • Propyl (meth) acrylate; acrylic acid having a carboxyl group, methacrylic acid, itaconic acid; glycidyl methacrylate having an epoxy group, glycidyl acrylate and the like can be mentioned.
  • an (meth) acrylic acid ester monomer or a derivative thereof that can be copolymerized with the above monomer for example, an alkyl (meth) acrylate having an alkyl group having 1 to 18 carbon atoms, specifically a methyl (meth) acrylate.
  • the above-mentioned energy ray-polymerizable compound may be used in combination, or a binder polymer component may be used in combination.
  • the energy ray-polymerizable compound is preferably used with respect to 100 parts by mass of the total mass of the energy ray-curable polymer and the binder polymer component. It is contained in an amount of 1 to 1500 parts by mass, more preferably 10 to 500 parts by mass, and particularly preferably 20 to 200 parts by mass.
  • a protective film for a chip is generally formed of a thermosetting resin such as an epoxy resin, but since the curing temperature of the thermosetting resin exceeds 200 ° C. and the curing time is about 2 hours. It was an obstacle to improving production efficiency.
  • the energy ray-curable back surface protective film forming film is cured in a short time by energy ray irradiation, the protective film can be easily formed and can contribute to the improvement of production efficiency.
  • the back surface protective film forming film can contain the following components in addition to the above binder polymer component and curable component.
  • the back surface protective film forming film preferably contains a colorant.
  • a colorant in the film for forming the back surface protective film, it is possible to shield the infrared rays and the like generated from the surrounding devices when the semiconductor device is incorporated into the device, and prevent the semiconductor device from malfunctioning due to them.
  • the visibility of characters when a product number or the like is printed on the protective film obtained by curing the back surface protective film forming film is improved.
  • a product number or the like is usually printed on the surface of the protective film by a laser marking method (a method in which the surface of the protective film is scraped off by laser light), but the protective film is By containing the colorant, a sufficient contrast difference between the portion scraped by the laser beam of the protective film and the portion not scraped can be obtained, and the visibility is improved.
  • Organic or inorganic pigments and dyes are used as the colorants.
  • black pigments are preferable from the viewpoint of electromagnetic wave and infrared shielding properties.
  • carbon black, iron oxide, manganese dioxide, aniline black, activated carbon and the like are used, but the black pigment is not limited thereto.
  • carbon black is particularly preferable.
  • the colorant one type may be used alone, or two or more types may be used in combination.
  • the high curability of the back surface protective film forming film in the present invention is particularly preferably exhibited when the transparency of ultraviolet rays is reduced by using a colorant that reduces the transparency of both visible light and / or infrared rays and ultraviolet rays. Will be done.
  • black pigments as a colorant that reduces the transparency of both visible light and / or infrared rays and ultraviolet rays, absorbability or reflectivity in both wavelength regions of visible light and / or infrared rays and ultraviolet rays is provided. It is not particularly limited as long as it has.
  • the blending amount of the colorant is preferably 0.1 to 35 parts by mass, more preferably 0.5 to 25 parts by mass, and particularly preferably 0.5 to 25 parts by mass with respect to 100 parts by mass of the total solid content constituting the back surface protective film forming film. It is 1 to 15 parts by mass.
  • the curing accelerator is used to adjust the curing rate of the back surface protective film forming film.
  • the curing accelerator is preferably used when the epoxy resin and the thermosetting agent are used in combination, especially in the curable component.
  • Preferred curing accelerators are tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol; 2-methylimidazole, 2-phenylimidazole, 2-phenyl- Imidazoles such as 4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole; organic phosphines such as tributylphosphine, diphenylphosphine, triphenylphosphine; Examples thereof include tetraphenylborone salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylborate. These can be used alone or in combination of two or more.
  • the curing accelerator is contained in an amount of preferably 0.01 to 10 parts by mass, more preferably 0.1 to 1 part by mass with respect to 100 parts by mass of the curable component.
  • the curing accelerator By containing the curing accelerator in an amount in the above range, it has excellent adhesive properties even when exposed to high temperature and high humidity, and achieves high reliability even when exposed to severe reflow conditions. be able to. If the content of the curing accelerator is low, sufficient adhesive properties cannot be obtained due to insufficient curing, and if it is excessive, the curing accelerator having high polarity is placed on the adhesive interface side in the back surface protective film forming film under high temperature and high humidity. The reliability of the semiconductor device is lowered by moving to and segregating.
  • the coupling agent may be used to improve the adhesiveness, adhesion and / or cohesiveness of the protective film to the chip of the back surface protective film forming film. Further, by using the coupling agent, the water resistance of the protective film obtained by curing the back surface protective film forming film can be improved without impairing the heat resistance of the protective film.
  • the coupling agent a compound having a group that reacts with a functional group of a binder polymer component, a curable component, or the like is preferably used.
  • a silane coupling agent is desirable. Examples of such a coupling agent include ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldiethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and ⁇ - (methacryloxypropyl).
  • the coupling agent is usually 0.1 to 20 parts by mass, preferably 0.2 to 10 parts by mass, and more preferably 0.3 to 5 parts by mass with respect to 100 parts by mass of the total of the binder polymer component and the curable component. Is included in the ratio of. If the content of the coupling agent is less than 0.1 parts by mass, the above effect may not be obtained, and if it exceeds 20 parts by mass, it may cause outgas.
  • Inorganic filler By blending the inorganic filler into the film for forming the back surface protective film, it is possible to adjust the coefficient of thermal expansion of the protective film after curing, and the coefficient of thermal expansion of the protective film after curing is optimized for the semiconductor chip. By doing so, the reliability of the semiconductor device can be improved. It is also possible to reduce the hygroscopicity of the protective film after curing.
  • Preferred inorganic fillers include powders of silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide, boron nitride and the like, spherical beads, single crystal fibers and glass fibers.
  • silica filler and alumina filler are preferable.
  • the inorganic filler can be used alone or in combination of two or more.
  • the content of the inorganic filler can be usually adjusted in the range of 1 to 80 parts by mass with respect to 100 parts by mass of the total solid content constituting the back surface protective film forming film.
  • the back surface protective film forming film contains an energy ray-curable component as the above-mentioned curable component
  • the energy ray-curable component is cured by irradiating with energy rays such as ultraviolet rays when using the film.
  • energy rays such as ultraviolet rays
  • photopolymerization initiators include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, benzoin dimethyl ketal, 2, 4-diethylthioxanthone, ⁇ -hydroxycyclohexylphenylketone, benzyldiphenylsulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzyl, dibenzyl, diacetyl, 1,2-diphenylmethane, 2-hydroxy-2-methyl Examples thereof include -1- [4- (1-methylvinyl) phenyl] propanone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide and ⁇ -chloranthraquinone.
  • the photopolymer include
  • the blending ratio of the photopolymerization initiator is preferably 0.1 to 10 parts by mass and more preferably 1 to 5 parts by mass with respect to 100 parts by mass of the energy ray-curable component. If it is less than 0.1 part by mass, satisfactory transferability may not be obtained due to insufficient photopolymerization, and if it exceeds 10 parts by mass, a residue that does not contribute to photopolymerization is generated, and the back surface protective film forming film is formed. Curability may be insufficient.
  • Cross-linking agent A cross-linking agent can also be added to adjust the initial adhesive force and cohesive force of the back surface protective film forming film.
  • examples of the cross-linking agent include an organic polyvalent isocyanate compound and an organic polyvalent imine compound.
  • organic polyvalent isocyanate compound examples include aromatic polyvalent isocyanate compounds, aliphatic polyhydric isocyanate compounds, alicyclic polyvalent isocyanate compounds, trimerics of these organic polyvalent isocyanate compounds, and these organic polyvalent isocyanate compounds.
  • examples thereof include a terminal isocyanate urethane prepolymer obtained by reacting with a polyol compound.
  • organic polyvalent isocyanate compound examples include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4'-diisocyanate, and diphenylmethane.
  • organic polyvalent imine compound examples include N, N'-diphenylmethane-4,4'-bis (1-aziridinecarboxyamide), trimethylpropan-tri- ⁇ -aziridinyl propionate, and tetramethylolmethane-tri.
  • examples thereof include - ⁇ -aziridinyl propionate and N, N'-toluene-2,4-bis (1-aziridinecarboxyamide) triethylene melamine.
  • the cross-linking agent is usually 0.01 to 20 parts by mass, preferably 0.1 to 10 parts by mass, and more preferably 0.5 to 5 parts by mass with respect to 100 parts by mass of the total amount of the binder polymer component and the energy ray-curable polymer. Used in proportions of parts.
  • additives may be added to the back surface protective film forming film, if necessary.
  • additives include leveling agents, plasticizers, antistatic agents, antioxidants, ion scavengers, gettering agents, chain transfer agents and the like.
  • the protective film-forming composition preferably further contains a solvent.
  • the protective film-forming composition containing a solvent has good handleability.
  • the solvent is not particularly limited, but preferred ones are, for example, hydrocarbons such as toluene and xylene; alcohols such as methanol, ethanol, 2-propanol, isobutyl alcohol (2-methylpropan-1-ol) and 1-butanol. Examples thereof include esters such as ethyl acetate; ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; amides such as dimethylformamide and N-methylpyrrolidone (compounds having an amide bond).
  • the solvent contained in the adhesive composition may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.
  • the solvent contained in the adhesive composition is preferably methyl ethyl ketone or the like from the viewpoint that the components contained in the adhesive composition can be mixed more uniformly.
  • the back surface protective film forming film obtained by applying and drying the protective film forming composition composed of the above-mentioned components has adhesiveness and curability, and in an uncured state, the work (semiconductor wafer or It adheres easily by pressing against a chip, etc.).
  • the back surface protective film forming film may be heated. After curing, a protective film having high impact resistance can be finally provided, the adhesive strength is excellent, and a sufficient protective function can be maintained even under severe high temperature and high humidity conditions.
  • the back surface protective film forming film may have a single-layer structure, or may have a multi-layer structure as long as it contains one or more layers containing the above components.
  • the thickness of the back surface protective film forming film is not particularly limited, but is preferably 3 to 300 ⁇ m, more preferably 5 to 250 ⁇ m, and particularly preferably 7 to 200 ⁇ m.
  • Examples of the support sheet 10 used in one aspect of the present invention include a sheet composed of only the base material 11 and a pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer 12 on the base material 11.
  • the support sheet included in the third laminate of one aspect of the present invention is a release sheet that prevents dust from adhering to the surface of the back surface protective film forming film, or the surface of the back surface protective film forming film in a dicing step or the like. It plays the role of a dicing sheet or the like for protection.
  • the thickness of the support sheet is appropriately selected depending on the intended use, but is preferably 10 to 500 ⁇ m, more preferably from the viewpoint of imparting sufficient flexibility to the composite sheet and improving the adhesiveness to the silicon wafer. Is 20 to 350 ⁇ m, more preferably 30 to 200 ⁇ m.
  • the thickness of the support sheet includes not only the thickness of the base material constituting the support sheet but also the thickness of those layers and the film when the adhesive layer is provided.
  • a resin film is preferable as the base material 11 constituting the support sheet 10.
  • the resin film include polyethylene films such as low-density polyethylene (LDPE) films and linear low-density polyethylene (LLDPE) films, ethylene / propylene copolymer films, polypropylene films, polybutene films, polybutadiene films, and polymethylpentene.
  • LDPE low-density polyethylene
  • LLDPE linear low-density polyethylene
  • ethylene / propylene copolymer films polypropylene films
  • polybutene films polybutadiene films
  • polymethylpentene polymethylpentene
  • the base material used in one aspect of the present invention may be a single-layer film composed of one type of resin film, or may be a laminated film in which two or more types of resin films are laminated. Further, in one aspect of the present invention, a sheet obtained by subjecting the surface of a base material such as the above-mentioned resin film to a surface treatment may be used as a support sheet.
  • resin films may be crosslinked films. Further, colored resin films or printed ones can also be used. Further, the resin film may be a sheet obtained by extruding a thermoplastic resin or may be a stretched resin film, or a curable resin thinned and cured by a predetermined means to form a sheet. May be used.
  • a base material containing a polypropylene film is preferable from the viewpoint that it has excellent heat resistance, has expandability because it has appropriate flexibility, and easily maintains pickup suitability.
  • the base material containing the polypropylene film may have a single-layer structure composed of only the polypropylene film or a multi-layer structure composed of the polypropylene film and another resin film.
  • the film for forming the back surface protective film is thermosetting, the resin film constituting the base material has heat resistance, thereby suppressing damage due to heat of the base material and suppressing the occurrence of defects in the manufacturing process of the semiconductor device. it can.
  • the surface tension of the surface of the base material in contact with the surface of the back surface protective film forming film is preferable from the viewpoint of adjusting the peeling force within a certain range. Is 20 to 50 mN / m, more preferably 23 to 45 mN / m, still more preferably 25 to 40 mN / m.
  • the thickness of the base material constituting the support sheet is preferably 10 to 500 ⁇ m, more preferably 15 to 300 ⁇ m, and further preferably 20 to 200 ⁇ m.
  • FIG. 11 is a schematic cross-sectional view showing an example of a support sheet 10 in which the pressure-sensitive adhesive layer 12 is provided on the base material 11.
  • the support sheet 10 includes the pressure-sensitive adhesive layer 12
  • the pressure-sensitive adhesive layer 12 of the support sheet 10 is attached to the smooth surface 13b of the back surface protective film forming film 13 in the second laminating step.
  • Examples of the pressure-sensitive adhesive which is a material for forming the pressure-sensitive adhesive layer include a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive resin, and the pressure-sensitive adhesive composition further contains a general-purpose additive such as the above-mentioned cross-linking agent and pressure-sensitive adhesive. You may.
  • Examples of the adhesive resin include acrylic resin, urethane resin, rubber resin, silicone resin, vinyl ether resin, etc. when focusing on the structure of the resin, and when focusing on the function of the resin.
  • an energy ray-curable pressure-sensitive adhesive, a heat-foaming type pressure-sensitive adhesive, an energy ray-foaming type pressure-sensitive adhesive, and the like can be mentioned.
  • an energy ray-curable adhesive formed from an adhesive composition containing an energy ray-curable resin from the viewpoint of adjusting the peeling force within a certain range and improving the pick-up property.
  • a pressure-sensitive adhesive sheet having an agent layer or a pressure-sensitive adhesive sheet having a slightly adhesive pressure-sensitive adhesive layer is preferable.
  • the energy ray-curable resin may be a resin having a polymerizable group such as a (meth) acryloyl group or a vinyl group, but an adhesive resin having a polymerizable group is preferable.
  • the back surface protective film forming film is not attached to the entire surface of the work such as a semiconductor wafer, (b) the back surface protective film forming film floats, and (c) the back surface.
  • the support sheet can also serve as a peeling sheet for the back surface protective film forming film when the back surface protective film forming film is poorly attached such as wrinkles appearing on the protective film forming film. Even if the back surface protective film forming film is poorly attached in the first laminating step, the third laminated body is produced as it is through the second laminating step. After that, the work such as the semiconductor wafer can be reworked by removing the film for forming the back surface protective film from the work such as the semiconductor wafer together with the support sheet.
  • the adhesive layer for the jig is preferably energy ray curable.
  • the support sheet is directly supported on a fixing jig such as a ring frame without using an adhesive layer for a jig.
  • the sheet can be fixed, and by irradiating with energy rays such as ultraviolet rays, the reworkability can be made excellent.
  • an adhesive containing an acrylic resin is preferable.
  • an acrylic resin an acrylic polymer having a structural unit (x1) derived from alkyl (meth) acrylate is preferable, and the structural unit (x1) and the structural unit (x2) derived from the functional group-containing monomer are used. Acrylic copolymer having is more preferable.
  • the alkyl group of the alkyl (meth) acrylate has preferably 1 to 18 carbon atoms, more preferably 1 to 12 carbon atoms, and even more preferably 1 to 8 carbon atoms.
  • Examples of the alkyl (meth) acrylate include the same alkyl (meth) acrylates described in the above-mentioned binder polymer component section.
  • the alkyl (meth) acrylate may be used alone or in combination of two or more.
  • the content of the structural unit (x1) is usually 50 to 100% by mass, preferably 50 to 99.9% by mass, and more preferably 60 to 99% with respect to the total structural unit (100% by mass) of the acrylic polymer. It is by mass, more preferably 70 to 95% by mass.
  • Examples of the functional group-containing monomer include a hydroxy group-containing monomer, a carboxy group-containing monomer, an epoxy group-containing monomer, and the like, and specific examples of each monomer are the same as those exemplified in the binder polymer component portion. can give. In addition, these may be used alone or in combination of 2 or more types.
  • the content of the structural unit (x2) is usually 0 to 40% by mass, preferably 0.1 to 40% by mass, and more preferably 1 to 30 with respect to the total structural unit (100% by mass) of the acrylic polymer. It is by mass, more preferably 5 to 20% by mass.
  • the acrylic resin used in one embodiment of the present invention is obtained by reacting the acrylic copolymer having the above-mentioned structural units (x1) and (x2) with a compound having an energy ray-polymerizable group. It may be an energy ray-curable acrylic resin.
  • the compound having an energy ray-polymerizable group may be a compound having a polymerizable group such as a (meth) acryloyl group or a vinyl group.
  • a cross-linking agent When a pressure-sensitive adhesive containing an acrylic resin is used, it is preferable to contain a cross-linking agent together with the acrylic resin from the viewpoint of adjusting the peeling force within a certain range.
  • the cross-linking agent include isocyanate-based cross-linking agents, imine-based cross-linking agents, epoxy-based cross-linking agents, oxazoline-based cross-linking agents, carbodiimide-based cross-linking agents, and the like, from the viewpoint of adjusting the peeling force within a certain range. Isocyanate-based cross-linking agents are preferred.
  • the content of the cross-linking agent is preferably 0.01 to 20 parts by mass, more preferably 0.1 to 15 parts by mass, based on the total mass (100 parts by mass) of the acrylic resin contained in the pressure-sensitive adhesive. It is more preferably 0.5 to 10 parts by mass, and even more preferably 1 to 8 parts by mass.
  • the support sheet 10 may be composed of one layer (single layer) or may be composed of two or more layers.
  • the constituent materials and the thicknesses of the plurality of layers may be the same or different from each other, and the combination of the plurality of layers is not particularly limited as long as the effects of the present invention are not impaired.
  • the support sheet may be transparent, opaque, or colored depending on the purpose.
  • the support sheet preferably allows energy rays to pass through.
  • the support sheet is preferably transparent.
  • the circuit surface 14a of the work 14 is protected by the circuit surface protection tape 17, and after the second laminating step, the circuit surface protection tape 17 is peeled off from the circuit surface 14a of the work 14. It can include a peeling step to make it.
  • the circuit surface protection tape 17 has an energy ray-curable pressure-sensitive adhesive layer on the side attached to the circuit surface 14a, which is cured by irradiation with energy rays and becomes removable. In the peeling step, the pressure-sensitive adhesive layer of the circuit surface protection tape 17 is irradiated with energy rays to cure the pressure-sensitive adhesive layer so that it can be peeled off again, thereby protecting the circuit surface from the circuit surface 14a of the work 14.
  • the tape 17 can be easily peeled off.
  • the method for producing the third laminated body of the present embodiment may include a step of irradiating the back surface protective film forming film 13 with a laser from the side of the support sheet 10 to perform laser marking.
  • the support sheet 10 is laminated on the smooth surface 13b of the back surface protective film forming film 13. Therefore, when the laser is irradiated from the side of the support sheet 10 through the support sheet, the back surface is backed up.
  • the smooth surface 13b of the protective film forming film 13 is laser-marked, and the laser marking can be performed more clearly than when the rough surface 13a is laser-marked.
  • the smooth surface 13b of the back surface protective film forming film 13 of the protective film forming composite sheet 1 is the semiconductor wafer 8. Since it is attached to the back surface 8b of the above, when irradiating the laser from the side of the support sheet 10 through the support sheet in FIG. 10 (D'), the rough surface 13a of the back surface protective film forming film 13 is laser-marked. Become.
  • the interface between the rough surface 13a of the back surface protective film forming film 13 and the support sheet 10 is impaired in adhesion, when a laser is irradiated through the support sheet, the back surface protective film forming film 13 and the support sheet 13 are supported when the laser is irradiated.
  • the outlines of the characters and symbols printed at the interface with the sheet 10 are blurred, and the visibility after printing is impaired.
  • the smooth surface 13b and the support sheet of the back surface protective film forming film 13 are laminated. Good adhesion is maintained at the interface with 10. Therefore, when the laser is subsequently irradiated from the side of the support sheet 10 through the support sheet, as shown in FIGS. 1 (b) to 1 (e) and FIG. 4 (f), a film for forming a back surface protective film.
  • the smooth surface 13b of 13 is laser-marked, the characters and symbols printed at the interface between the smooth surface 13b of the back surface protective film forming film 13 and the support sheet 10 are prevented from bleeding, so that the rough surface 13a is prevented. Laser marking can be performed more clearly than in the case of laser marking.
  • the back surface protective film forming film 13 is then cured to cure the back surface. Even if the laser is irradiated from the side of the support sheet 10 through the support sheet after the protective film 13'is formed, the smooth surface 13'b of the back surface protective film 13'is laser-marked, and the rough surface 13'a is formed. Laser marking can be performed more clearly than in the case of laser marking.
  • the smooth surface 13b of the back surface protective film forming film 13 is thermosetting in an exposed state.
  • the support sheet 10 is laminated on the smooth surface 13b of the back surface protective film forming film 13, so that when the back surface protective film forming film 13 is cured, the support sheet is formed. Upon contact with 10, the smooth surface 13b is in a protected state.
  • the smooth surface 13'b of the back surface protective film 13'that is protected by the support sheet 10 in the curing step is laser-marked. Therefore, laser marking can be performed more clearly than in the case of laser marking on the smooth surface 13'b of the back surface protective film 13'that is heat-cured in the exposed state.
  • FIG. 3 is a schematic cross-sectional view schematically showing another example of the embodiment of the method for manufacturing the third laminated body.
  • the same components as those shown in the already explained figures are designated by the same reference numerals as in the case of the already explained figures, and detailed description thereof will be omitted.
  • the work 14 is a semiconductor device panel composed of an aggregate in which at least one electronic component 62 is sealed with a sealing resin layer 64 and arranged in a plane.
  • the method for manufacturing the third laminated body of the present embodiment is a method for manufacturing the third laminated body 19 in which the semiconductor device panel which is the work 14, the back surface protective film forming film 13, and the support sheet 10 are laminated in this order.
  • One side of the semiconductor device panel, which is the work 14, is a circuit surface, the other side is a back surface 14b (FIG. 3 (a')), and one of the back surface protective film forming films 13.
  • the first surface is a smooth surface 13b
  • the other surface is a rough surface 13a that is coarser than the smooth surface 13b
  • the rough surface 13a of the back surface protective film forming film 13 is attached to the back surface 14b of the work 14 so as to face each other.
  • the laminating step (FIG. 3 (b')) and the second laminating step (FIG. 3 (c')) of attaching the support sheet 10 to the smooth surface 13b of the back surface protective film forming film 13 are performed in this order. Included (FIGS. 3 (a') to 3 (d')).
  • the semiconductor device panel may be formed by arranging individual semiconductor devices in a substantially circular region in a plane, and the individual semiconductor devices may be formed in a substantially rectangular region in a plane. It may be formed side by side.
  • the support sheet 10 is laminated on the smooth surface 13b of the back surface protective film forming film 13 as in the embodiment shown in FIG. 1, so that the support sheet 10 is laminated from the side of the support sheet 10.
  • the smooth surface 13b of the back surface protective film forming film 13 or the smooth surface 13'b of the back surface protective film 13' is laser-marked, and the rough surface 13a or the rough surface 13'a is laser-marked. Laser marking can be performed more clearly than in the case of.
  • the smooth surface 13'b of the back surface protective film 13' which is protected by the support sheet 10 is laser-marked, so that the laser is irradiated from the side of the support sheet 10 through the support sheet. Even so, laser marking can be performed more clearly than in the case of laser marking on the smooth surface 13'b of the back surface protective film 13'that is thermoset in the exposed state.
  • the back surface protective film forming film 13 of the third laminated body 19 produced by the method for producing the third laminated body is cured to obtain the back surface protective film 13'.
  • FIG. 4 is a schematic cross-sectional view schematically showing an example of an embodiment of a method for manufacturing a fourth laminated body.
  • the method for manufacturing the fourth laminated body of the present embodiment includes a peeling step (FIG. 4 (e)) of peeling the circuit surface protection tape 17 from the circuit surface 14a of the work 14 after the second laminating step.
  • the curing step (FIG. 4 (g)) is included.
  • a thermosetting film for forming a back surface protective film is used, and in the curing step of this embodiment, the film is thermoset at 130 ° C. for 2 hours.
  • the curing conditions are as long as the degree of curing is such that the back surface protective film sufficiently exerts its function. It is not particularly limited, and may be appropriately selected depending on the type of the thermosetting film for forming the back surface protective film.
  • the heating temperature during thermosetting is preferably 100 to 200 ° C, more preferably 110 to 180 ° C, and particularly preferably 120 to 170 ° C.
  • the heating time at the time of thermosetting is preferably 0.5 to 5 hours, more preferably 0.5 to 3 hours, and particularly preferably 1 to 2 hours.
  • the order of the peeling steps is preferably before the curing step in consideration of the heat resistance of the circuit surface protection tape 17.
  • FIG. 5 is a schematic cross-sectional view schematically showing another example of the embodiment of the method for manufacturing the fourth laminated body.
  • the method for manufacturing the fourth laminated body of the present embodiment includes a peeling step (FIG. 5 (e)) of peeling the circuit surface protection tape 17 from the circuit surface 14a of the work 14 after the second laminating step.
  • a curing step (FIG. 5 (f')) in which the back surface protective film 13 is cured to form the back surface protective film 13', and the back surface protective film 13'is irradiated with a laser from the support sheet 10 side for laser marking. (FIG. 5 (g')) and the like.
  • laser marking is performed on the smooth surface 13'b of the back surface protective film 13'in a state of being protected by the support sheet 10 in the curing step, when the laser is irradiated from the side of the support sheet 10 through the support sheet, Laser marking can be performed more clearly than when laser marking is performed on the smooth surface 13'b of the back surface protective film 13'that is heat-cured in the exposed state.
  • FIG. 6 is a schematic cross-sectional view schematically showing an example of an embodiment of a method for manufacturing a semiconductor device with a back surface protective film.
  • the work 14 and the back surface protective film 13'of the fourth laminated body 19'manufactured by the method for manufacturing the fourth laminated body are diced to protect the back surface.
  • the step of forming the semiconductor device 21 with a film (FIGS. 6 (h) and 6 (i)) and the step of picking up the semiconductor device 21 with a back surface protective film from the support sheet 10 (FIG. 6 (j)) are included.
  • FIG. 7 is a schematic cross-sectional view schematically showing another example of the embodiment of the method for manufacturing a semiconductor device with a back surface protective film.
  • the back surface protective film forming film 13 and the work 14 of the third laminate 19 manufactured by the method for manufacturing the third laminate are diced to form the back surface.
  • a step of forming the semiconductor device 21'with a protective film forming film (FIGS. 7 (h') and 7 (i')) and a step of picking up the back surface protective film forming film-attached semiconductor device 21'from the support sheet 10.
  • FIG. 7 (j') and a curing step in which the back surface protective film forming film 13 is cured to obtain the back surface protective film 13'.
  • FIG. 8 is a schematic cross-sectional view schematically showing another example of the embodiment of the method for manufacturing a semiconductor device with a back surface protective film.
  • the back surface protective film forming film 13 and the work 14 of the third laminate 19 manufactured by the method for manufacturing the third laminate are diced to form the back surface.
  • a step of forming a semiconductor device 21'with a protective film forming film (FIGS. 8 (h') and 8 (i')) and a curing step of curing the back surface protective film 13 to form a back surface protective film 13'. (FIG. 8 (j')) and the step of picking up the semiconductor device 21 with the back surface protective film from the support sheet 10.
  • the back surface protective film forming film 13 is thermosetting, and in the step of forming the back surface protective film of the present embodiment, for example, the back surface protective film forming film 13 Is thermoset at 130 ° C. for 2 hours.
  • the curing conditions for forming the back surface protective film by thermosetting the thermosetting film for forming the back surface protective film are as long as the degree of curing is such that the back surface protective film sufficiently exerts its function.
  • the method is not particularly limited, and may be appropriately selected depending on the type of the thermosetting film for forming the back surface protective film.
  • the back surface protective film forming film 13 is energy ray curable, and the step of forming the back surface protective film is to apply energy rays to the back surface protective film forming film 13. It may be a step of irradiating and curing the energy ray.
  • the curing conditions when the energy ray-curable back surface protective film forming film is energy-cured to form the protective film are not particularly limited as long as the degree of curing is such that the protective film sufficiently exerts its function.
  • the energy ray-curable back surface protective film may be appropriately selected according to the type of the film.
  • the illuminance of the energy ray at the time of energy ray curing of the energy ray curable back surface protective film forming film is preferably 4 to 280 mW / cm 2 .
  • the amount of light of the energy rays at the time of curing is preferably 3 to 1000 mJ / cm 2 .
  • the energy ray-curable back surface protective film forming film for example, those disclosed in International Publication No. 2017/188200 and International Publication No. 2017/188218 can also be used.
  • Example 1 Each of the following components was mixed at the compounding ratio (in terms of solid content) shown in Table 1 and diluted with methyl ethyl ketone so that the solid content concentration was 50% by mass with respect to the total mass of the protective film-forming composition.
  • a protective film forming composition for forming a film for forming a back surface protective film was prepared.
  • the peeled surface (surface roughness) of the release film obtained by peeling one side of the polyethylene terephthalate (PET) film by silicone treatment.
  • the composition (III-1) obtained above was applied to Ra: 30 nm) and dried at 100 ° C. for 3 minutes to form a back surface protective film forming film having a thickness of 25 ⁇ m.
  • one side of the polyethylene terephthalate (PET) film is separately peeled off by a silicone treatment on the exposed surface (the surface opposite to the side provided with the release film) of the back surface protective film forming film.
  • the temperature of the peeled surface (surface roughness Ra: 30 nm) of the film (“SP-PET38131” manufactured by Lintec Co., Ltd., thickness 38 ⁇ m, corresponding to the first release film) is measured from the first release film side with a laminate roll.
  • Laminated sheets that is, first laminates in which release films are laminated on both sides of the back surface protective film forming film by laminating under the conditions of: 23 ⁇ 5 ° C., pressure: 0.4 MPa, speed: 1 m / min. Made.
  • the pressure-sensitive adhesive composition is applied to the peel-treated surface of the release film (Lintec's "SP-PET381031", thickness 38 ⁇ m), dried at 100 ° C. for 3 minutes, and then an ultraviolet curable pressure-sensitive adhesive layer (after drying). (Thickness 10 ⁇ m) is formed, and a polypropylene film (thickness 80 ⁇ m, manufactured by Gunze Corporation), which is a base material, is separately attached to the exposed surface (the surface opposite to the side with the release film) to support the support sheet.
  • SP-PET381031 thickness 38 ⁇ m
  • the pressure-sensitive adhesive composition is 100 parts by mass (solid content) of the (meth) acrylic acid alkyl ester copolymer, and 6.6 parts by mass of a trifunctional xylylene diisocyanate-based cross-linking agent (“Takenate D110N” manufactured by Mitsui Takeda Chemical Co., Ltd.). Solid content) and 3.0 parts by mass (solid content) of a photopolymerization initiator (BASF “Irgacure 127”), and a solid content concentration of 30 mass by mass using a mixed solvent of methyl ethyl ketone, toluene and ethyl acetate. It is adjusted to%.
  • the (meth) acrylic acid alkyl ester copolymer shall be abbreviated as 70 parts by mass of 2-ethylhexyl acrylate (hereinafter, may be abbreviated as "2EHA”) and vinyl acetate (hereinafter, abbreviated as "VAc”).
  • 2EHA 2-ethylhexyl acrylate
  • VAc vinyl acetate
  • HOA 2-hydroxylethyl acrylate
  • Oxyethyl isocyanate (2-isocyanatoethyl methacrylate, hereinafter abbreviated as "MOI") 21.4 parts by mass (total number of isocyanate groups in MOI relative to the total number of moles of hydroxyl groups in HEA) It is an ultraviolet curable acrylic copolymer having a weight average molecular weight of 700,000 obtained by reacting (amount in which the number of moles is 0.8 times).
  • a mechanism for peeling the first release film, a mechanism for attaching the back surface protective film forming film, a mechanism for peeling the second release film, and a support sheet are attached in the same device.
  • the mechanism was made continuous, and between each mechanism, the second laminated body in which the back surface protective film forming film was attached to the silicon wafer as a work was conveyed one by one using a conveying arm.
  • a laminated sheet that is, a first laminated body
  • a back surface protective film forming film and a first release film are formed of silicon as a work.
  • a second release film / back surface protective film on the # 2000 polished surface of the silicon wafer under the conditions of temperature: 23 ° C. and pressure: 0.5 MPa by punching into the shape of a wafer and peeling off the first release film.
  • the film was attached.
  • the second release film was peeled from the laminate composed of the second release film / back surface protective film forming film / silicon wafer, and the back surface protective film forming film was attached to the silicon wafer as the work.
  • a laminate was obtained.
  • a third laminate was obtained by laminating a support sheet, a film for forming a back surface protective film, and a semiconductor wafer in this order by laminating under a sticking condition of 20 mm / s and a press pressure of 0.3 MPa.
  • the transport time was 60 s.
  • the transport distance was 2900 mm.
  • the third laminated body was heat-treated at 130 ° C. for 2 hours to obtain a fourth laminated body composed of a support sheet, a back surface protective film, and a silicon wafer laminated in this order.
  • a laser printing device (“CSM300M” manufactured by EO Technics Co., Ltd.) is used to irradiate the surface of the back surface protective film in the fourth laminate on the adhesive layer side with laser light through the support sheet. By doing so, printing was performed. At this time, characters having a size of 0.3 mm ⁇ 0.2 mm were printed.
  • Example 2 In Example 1, when the laminated sheet (that is, the first laminated body) of the second release film / the back surface protective film forming film / the first release film is produced, the first is formed on the exposed surface of the back surface protective film forming film. Except that the conditions for laminating the release film were temperature: 40 ° C., pressure: 0.5 MPa, speed: 1 m / min, the number of sheets in which peeling failure occurred was examined in the same manner as in Example 1. , The frequency of peeling defects was evaluated, and the surface roughness (Ra) was measured. Further, in the same manner as in Example 1, the second laminated body, the third laminated body and the fourth laminated body were manufactured and laser marking evaluation was performed. The results are shown in Table 1.
  • Example 3 In Example 1, when the laminated sheet (that is, the first laminated body) of the second release film / the back surface protective film forming film / the first release film is produced, the first is formed on the exposed surface of the back surface protective film forming film. Except that the conditions for laminating the release film were temperature: 50 ° C., pressure: 0.5 MPa, speed: 1 m / min, the number of sheets in which peeling failure occurred was examined in the same manner as in Example 1. , The frequency of peeling defects was evaluated, and the surface roughness (Ra) was measured. Further, in the same manner as in Example 1, the second laminated body, the third laminated body and the fourth laminated body were manufactured and laser marking evaluation was performed. The results are shown in Table 1.
  • Example 4 In Example 1, when the laminated sheet (that is, the first laminated body) of the second release film / the back surface protective film forming film / the first release film is produced, the first is formed on the exposed surface of the back surface protective film forming film. Except that the conditions for laminating the release film were temperature: 60 ° C., pressure: 0.5 MPa, speed: 1 m / min, the number of sheets in which peeling failure occurred was examined in the same manner as in Example 1. , The frequency of peeling defects was evaluated, and the surface roughness (Ra) was measured. Further, in the same manner as in Example 1, the second laminated body, the third laminated body and the fourth laminated body were manufactured and laser marking evaluation was performed. The results are shown in Table 1.
  • Example 5 In Example 1, when the laminated sheet (that is, the first laminated body) of the second release film / the back surface protective film forming film / the first release film is produced, the first is formed on the exposed surface of the back surface protective film forming film. Except that the conditions for laminating the release film were temperature: 70 ° C., pressure: 0.5 MPa, speed: 1 m / min, the number of sheets in which peeling failure occurred was examined in the same manner as in Example 1. , The frequency of peeling defects was evaluated, and the surface roughness (Ra) was measured. Further, in the same manner as in Example 1, the second laminated body, the third laminated body and the fourth laminated body were manufactured and laser marking evaluation was performed. The results are shown in Table 1.
  • Example 6 In Example 1, when the laminated sheet (that is, the first laminated body) of the second release film / the back surface protective film forming film / the first release film is produced, the first is formed on the exposed surface of the back surface protective film forming film. Except that the conditions for laminating the release film were temperature: 70 ° C., pressure: 0.7 MPa, speed: 1 m / min, the number of sheets in which peeling failure occurred was examined in the same manner as in Example 1. , The frequency of peeling defects was evaluated, and the surface roughness (Ra) was measured. Further, in the same manner as in Example 1, the second laminated body, the third laminated body and the fourth laminated body were manufactured and laser marking evaluation was performed. The results are shown in Table 1.
  • Example 7 In Example 1, when the laminated sheet (that is, the first laminated body) of the second release film / the back surface protective film forming film / the first release film is produced, the first is formed on the exposed surface of the back surface protective film forming film. Except that the conditions for laminating the release film were temperature: 70 ° C., pressure: 0.8 MPa, speed: 1 m / min, the number of sheets in which peeling failure occurred was examined in the same manner as in Example 1. , The frequency of peeling defects was evaluated, and the surface roughness (Ra) was measured. Further, in the same manner as in Example 1, the second laminated body, the third laminated body and the fourth laminated body were manufactured and laser marking evaluation was performed. The results are shown in Table 1.
  • Example 8 In Example 1, when the laminated sheet (that is, the first laminated body) of the second release film / the back surface protective film forming film / the first release film is produced, the first is formed on the exposed surface of the back surface protective film forming film. Except that the conditions for laminating the release film were temperature: 70 ° C., pressure: 0.9 MPa, speed: 1 m / min, the number of sheets in which peeling failure occurred was examined in the same manner as in Example 1. , The frequency of peeling defects was evaluated, and the surface roughness (Ra) was measured. Further, in the same manner as in Example 1, the second laminated body, the third laminated body and the fourth laminated body were manufactured and laser marking evaluation was performed. The results are shown in Table 1.
  • one side of the polyethylene terephthalate (PET) film is separately peeled off by a silicone treatment on the exposed surface (the surface opposite to the side provided with the release film) of the back surface protective film forming film.
  • the peeled surface (surface roughness: 30 nm) of the film (“SP-PET38131” manufactured by Lintec Co., Ltd., thickness 38 ⁇ m, corresponding to the first release film) was subjected to temperature: from the first release film side with a laminate roll.
  • a laminated sheet that is, a first laminated body in which a release film was laminated on both sides of a back surface protective film forming film was prepared.
  • the number of sheets in which peeling defects occurred was examined, the frequency of occurrence of peeling defects was evaluated, and the surface roughness (Ra) was measured.
  • the second laminated body, the third laminated body and the fourth laminated body were manufactured and laser marking evaluation was performed. The results are shown in Table 1.
  • the method for producing the third laminated body and the method for producing the fourth laminated body of the present invention can be used for manufacturing a semiconductor device with a back surface protective film.
  • circuit surface of work 14b ... ⁇ ⁇ Back side of work, 151 ⁇ ⁇ ⁇ 1st release film, 152 ⁇ ⁇ ⁇ 2nd release film, 16 ⁇ ⁇ ⁇ Adhesive layer for jig, 17 ⁇ ⁇ ⁇ Tape for circuit surface protection, 18 ⁇ ⁇ ⁇ Fixed Jig, 19 ... Third laminated body, 19'... Fourth laminated body, 20 ... Semiconductor device, 21 ... Semiconductor device with backside protective film, 21'... Backside protective film formation Semiconductor device with film for 62 ... Electronic component, 63 ... Circuit board, 63a ... Terminal forming surface, 64 ... Sealing resin layer

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Abstract

La présente invention concerne un procédé de production d'un corps à trois couches (19) comprenant les étapes suivantes dans cet ordre : une première étape de stratification dans laquelle une surface d'une pièce à usiner (14) est une surface de circuit (14a) et l'autre surface est une surface arrière (14b), une surface d'un film (13) pour former un film de protection de surface arrière est une surface lisse (13b) et l'autre surface est une surface rugueuse (13a) plus rugueuse que la surface lisse (13b), et la surface rugueuse (13a) du film (13) pour former un film de protection de surface arrière est amenée à faire face à la surface arrière (14b) de la pièce à usiner (14) et fixée à celle-ci ; et une seconde étape de stratification dans laquelle une feuille de support (10) est fixée à la surface lisse (13b) du film (13) pour former un film de protection de surface arrière.
PCT/JP2020/017717 2019-04-26 2020-04-24 Procédé de production d'un corps à trois couches, procédé de production d'un corps à quatre couches, procédé de production d'un dispositif à semi-conducteurs équipé d'un film de protection de surface arrière, et corps à trois couches WO2020218519A1 (fr)

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JP2020547152A JP6854983B1 (ja) 2019-04-26 2020-04-24 第三積層体の製造方法、第四積層体の製造方法及び裏面保護膜付き半導体装置の製造方法、並びに、第三積層体
KR1020217031950A KR20220004964A (ko) 2019-04-26 2020-04-24 제3 적층체의 제조 방법, 제4 적층체의 제조 방법 및 이면 보호막 부착 반도체 장치의 제조 방법, 그리고, 제3 적층체
CN202080026612.1A CN113692352A (zh) 2019-04-26 2020-04-24 第三层叠体的制造方法、第四层叠体的制造方法及带背面保护膜的半导体装置的制造方法、以及第三层叠体
SG11202110169VA SG11202110169VA (en) 2019-04-26 2020-04-24 Method of manufacturing third laminate, method of manufacturing fourth laminate, method of manufacturing semiconductor device with back surface protective film, and third laminate

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KR20220135157A (ko) 2021-03-29 2022-10-06 린텍 가부시키가이샤 지지 시트, 수지막 형성용 복합 시트, 키트, 및 수지막이 형성된 칩의 제조 방법

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