SG11201610182SA - Molecular inks - Google Patents

Molecular inks

Info

Publication number
SG11201610182SA
SG11201610182SA SG11201610182SA SG11201610182SA SG11201610182SA SG 11201610182S A SG11201610182S A SG 11201610182SA SG 11201610182S A SG11201610182S A SG 11201610182SA SG 11201610182S A SG11201610182S A SG 11201610182SA SG 11201610182S A SG11201610182S A SG 11201610182SA
Authority
SG
Singapore
Prior art keywords
molecular inks
inks
molecular
Prior art date
Application number
SG11201610182SA
Other languages
English (en)
Inventor
Arnold Kell
Sylvie Lafreniere
Chantal Paquet
Patrick Malenfant
Olga Mozenson
Original Assignee
Nat Res Council Canada
Groupe Graham Internat Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Res Council Canada, Groupe Graham Internat Inc filed Critical Nat Res Council Canada
Publication of SG11201610182SA publication Critical patent/SG11201610182SA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/08—Printing inks based on natural resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/14—Printing inks based on carbohydrates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/364—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith using a particular conducting material, e.g. superconductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1136—Conversion of insulating material into conductive material, e.g. by pyrolysis

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
SG11201610182SA 2014-06-19 2015-06-19 Molecular inks SG11201610182SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462014360P 2014-06-19 2014-06-19
PCT/CA2015/050568 WO2015192248A1 (en) 2014-06-19 2015-06-19 Molecular inks

Publications (1)

Publication Number Publication Date
SG11201610182SA true SG11201610182SA (en) 2017-01-27

Family

ID=54934622

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201610182SA SG11201610182SA (en) 2014-06-19 2015-06-19 Molecular inks

Country Status (10)

Country Link
US (2) US10883011B2 (fi)
EP (2) EP3689984B8 (fi)
JP (1) JP6541696B2 (fi)
KR (1) KR102387043B1 (fi)
CN (1) CN106574135B (fi)
CA (1) CA2950628C (fi)
FI (1) FI3689984T3 (fi)
MX (2) MX2016016659A (fi)
SG (1) SG11201610182SA (fi)
WO (1) WO2015192248A1 (fi)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2988797C (en) * 2015-06-11 2023-08-01 National Research Council Of Canada Preparation of high conductivity copper films
EP3533300A4 (en) * 2016-10-25 2020-09-09 GGI International PRINTED ELECTRONICS
TW201842086A (zh) * 2017-02-08 2018-12-01 加拿大國家研究委員會 加工金屬導電層之方法
WO2018146619A2 (en) * 2017-02-08 2018-08-16 National Research Council Of Canada Silver molecular ink with low viscosity and low processing temperature
TW201842088A (zh) 2017-02-08 2018-12-01 加拿大國家研究委員會 可印刷分子油墨
TW201842087A (zh) * 2017-02-08 2018-12-01 加拿大國家研究委員會 具改良之熱穩定性的分子油墨
US10797108B2 (en) 2017-09-07 2020-10-06 Her Majesty the Queen in the Right of Canada, as represented by the Minister of Industry, through the Communication Research Centre Canada Printed reconfigurable electronic circuit
WO2019079902A1 (en) 2017-10-27 2019-05-02 National Research Council Of Canada SUBSTRATES COATED WITH BORON NITRIDE NANOTUBES FOR SINGING METAL TRACES WITH INTENSE PULSED LIGHT
CN112334029A (zh) * 2018-02-13 2021-02-05 液体X印刷金属有限公司 使用无颗粒导电油墨制造的电子纺织物
EP3791699B1 (en) * 2018-05-08 2023-07-19 Jabil, Inc. Method for forming a flexible printed circuit board
EP3597707B1 (de) * 2018-07-19 2021-10-06 Heraeus Deutschland GmbH & Co. KG Formulierung zum applizieren auf glas, porzellan, fliesen, metallen und kunststofffolien
TW202020072A (zh) 2018-08-07 2020-06-01 加拿大國家研究委員會 包覆成型的印刷電子零件和其製造方法
CN109880441A (zh) * 2019-03-19 2019-06-14 宁波石墨烯创新中心有限公司 导电油墨及其制备方法、薄膜晶体管及其制备方法
CN110358367A (zh) * 2019-05-31 2019-10-22 南开大学 一种用做可拉伸微电子电路导电油墨的弹性导体材料及其合成方法
TWI815706B (zh) * 2019-09-24 2023-09-11 美商阿爾發金屬化工公司 燒結組成物
TWI805862B (zh) * 2019-10-17 2023-06-21 德商賀利氏德國有限責任兩合公司 施用於玻璃、瓷、瓦、金屬及塑料膜之調配物
US11970627B2 (en) 2020-01-21 2024-04-30 Heraeus Deutschland GmbH & Co. KG Formulation for application onto glass, porcelain, tiles, metals and plastic foil
JP7193605B1 (ja) 2021-10-15 2022-12-20 田中貴金属工業株式会社 金属ペースト
CN114255945A (zh) * 2021-11-30 2022-03-29 福建省长汀卓尔科技股份有限公司 一种添加剂及其应用、2-17型钐钴磁体及其制备方法

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61136978A (ja) 1984-12-06 1986-06-24 アルプス電気株式会社 厚膜回路形成用導電ペ−スト
JPS63278983A (ja) 1987-05-09 1988-11-16 Toyota Autom Loom Works Ltd 金属有機物インク
US20030148024A1 (en) 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
JP2002040632A (ja) 2000-07-21 2002-02-06 Showa Denko Kk レジストインキ組成物
US7115218B2 (en) 2001-06-28 2006-10-03 Parelec, Inc. Low temperature method and composition for producing electrical conductors
US7629017B2 (en) 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
US20030108664A1 (en) 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
AU2002337822A1 (en) 2001-10-05 2003-04-22 Superior Micropowders Llc Low viscosity precursor compositions and methods for the deposition of conductive electronic features
EP1461345B1 (en) 2001-12-12 2006-05-31 E.I. Du Pont De Nemours And Company Copper deposition using copper formate complexes
DE10216078A1 (de) 2002-04-11 2003-10-23 Tesa Ag Weiche flammwidrige Wickelfolie
US7683107B2 (en) 2004-02-09 2010-03-23 E.I. Du Pont De Nemours And Company Ink jet printable thick film compositions and processes
PL1853671T3 (pl) 2005-03-04 2014-01-31 Inktec Co Ltd Tusze przewodzące i sposób ich wytwarzania
ATE489659T1 (de) 2005-09-07 2010-12-15 Exax Inc Silber-organo-sol-farbstoff zum bilden elektrisch leitfähiger muster
TWI312799B (en) * 2005-12-30 2009-08-01 Ind Tech Res Inst Viscosity controllable highly conductive ink composition and method for fabricating a metal conductive pattern
KR101263003B1 (ko) 2006-02-13 2013-05-09 주식회사 이그잭스 도전선 패턴 형성을 위한 은 오르가노 졸 잉크
JP5205717B2 (ja) 2006-07-04 2013-06-05 セイコーエプソン株式会社 ギ酸銅錯体、銅粒子の製造方法および配線基板の製造方法
JP5045015B2 (ja) 2006-07-28 2012-10-10 セイコーエプソン株式会社 ギ酸銅の製造方法、銅粒子の製造方法および配線基板の製造方法
US8240716B2 (en) 2008-08-07 2012-08-14 TI Group Automotive System, LLC Quick connector coupling with pull tab verifier
KR20100031843A (ko) 2008-09-16 2010-03-25 (주)창성 전도성 금속 전극 형성용 잉크조성물 및 그 제조방법
WO2010128107A1 (en) * 2009-05-07 2010-11-11 Neodec B.V. Process for manufacturing conductive tracks
US9137902B2 (en) * 2009-08-14 2015-09-15 Xerox Corporation Process to form highly conductive feature from silver nanoparticles with reduced processing temperature
KR101221716B1 (ko) 2009-08-26 2013-01-11 주식회사 엘지화학 전도성 금속 잉크 조성물 및 전도성 패턴의 형성 방법
JP5747821B2 (ja) * 2009-09-16 2015-07-15 日立化成株式会社 金属銅膜及びその製造方法、金属銅パターン及びそれを用いた導体配線、金属銅バンプ、熱伝導路、接合材、並びに液状組成物
WO2011057218A2 (en) 2009-11-09 2011-05-12 Carnegie Mellon University Metal ink compositions, conductive patterns, methods, and devices
KR20110071805A (ko) 2009-12-21 2011-06-29 삼성전기주식회사 금속 박막 형성용 유기 금속 착물, 이를 포함하는 잉크 및 이를 이용한 금속 박막의 형성방법
JP5906027B2 (ja) 2010-07-30 2016-04-20 トッパン・フォームズ株式会社 装飾用又は鏡面用インク組成物、基材及び金属銀層を表面に供えた基材の製造方法
US9449734B2 (en) 2010-08-27 2016-09-20 Lg Chem, Ltd. Conductive metal ink composition, and method for preparing a conductive pattern
KR20120046457A (ko) 2010-11-02 2012-05-10 삼성전자주식회사 금속 잉크 조성물, 이를 이용한 전도성 금속막 형성방법 및 이를 이용한 전도성 금속막
US20140124713A1 (en) 2011-03-29 2014-05-08 Diptarka Majumdar High-aspect ratio screen printable thick film paste compositions containing wax thixotropes
JP6041517B2 (ja) 2011-04-22 2016-12-07 トッパン・フォームズ株式会社 銀インク組成物
CN102270514A (zh) * 2011-05-03 2011-12-07 华中科技大学 一种均相导电浆料
EP2753668B1 (en) * 2011-09-06 2019-03-27 Henkel IP & Holding GmbH Conductive material and process
US20130156971A1 (en) 2011-10-28 2013-06-20 Liquid X Printed Metals, Inc. Transparent conductive- and ito-replacement materials and structures
JP6051165B2 (ja) 2011-11-15 2016-12-27 日油株式会社 銅パターン形成用組成物及び銅パターンの製造方法
WO2013073331A1 (ja) 2011-11-17 2013-05-23 Jsr株式会社 銅膜形成方法、銅膜、回路基板および銅膜形成組成物溶液
US9039942B2 (en) * 2011-12-21 2015-05-26 E I Du Pont De Nemours And Company Lead-free conductive paste composition and semiconductor devices made therewith
US9469773B2 (en) 2011-12-23 2016-10-18 The Board Of Trustees Of The University Of Illinois Ink composition for making a conductive silver structure
JP6073613B2 (ja) 2012-09-18 2017-02-01 Ｎｅｃプラットフォームズ株式会社 電子装置、ならびに電子装置の温度制御方法
CN102863845A (zh) * 2012-10-11 2013-01-09 复旦大学 印制电子用银有机导电油墨
US9198288B2 (en) 2013-05-15 2015-11-24 Xerox Corporation Method of making silver carboxylates for conductive ink
US9283618B2 (en) 2013-05-15 2016-03-15 Xerox Corporation Conductive pastes containing silver carboxylates
US20140349025A1 (en) * 2013-05-23 2014-11-27 E I Du Pont De Nemours And Company Conductive compositions and methods relating thereto
US9540734B2 (en) 2013-11-13 2017-01-10 Xerox Corporation Conductive compositions comprising metal carboxylates
US10301497B2 (en) 2014-04-17 2019-05-28 Electroninks Incorporated Conductive ink compositions
US9982154B2 (en) 2014-04-17 2018-05-29 Electroninks Incorporated Solid ink composition
US20150298248A1 (en) 2014-04-17 2015-10-22 Electroninks Incorporated Bonded structure including a conductive bonding layer and low-temperature method of forming a bonded structure
WO2015183679A1 (en) 2014-05-30 2015-12-03 Electroninks Writeables, Inc. Conductive ink for a rollerball pen and conductive trace formed on a substrate

Also Published As

Publication number Publication date
WO2015192248A1 (en) 2015-12-23
US11525066B2 (en) 2022-12-13
US20210079248A1 (en) 2021-03-18
EP3689984B1 (en) 2023-06-07
MX2016016659A (es) 2017-05-15
EP3158015A1 (en) 2017-04-26
FI3689984T3 (fi) 2023-07-20
CA2950628A1 (en) 2015-12-23
EP3689984B8 (en) 2023-07-12
JP6541696B2 (ja) 2019-07-10
CA2950628C (en) 2022-11-08
MX2021007763A (es) 2021-08-05
CN106574135A (zh) 2017-04-19
EP3158015A4 (en) 2018-02-07
KR102387043B1 (ko) 2022-04-14
KR20170023994A (ko) 2017-03-06
US10883011B2 (en) 2021-01-05
US20170130084A1 (en) 2017-05-11
EP3689984A1 (en) 2020-08-05
CN106574135B (zh) 2021-04-06
EP3158015B1 (en) 2019-12-04
JP2017524761A (ja) 2017-08-31

Similar Documents

Publication Publication Date Title
IL304663A (en) combination
SG11201610182SA (en) Molecular inks
IL247073A0 (en) combination
AU361515S (en) Dishrack
SG11201609906TA (en) Molecular sieve ssz-98
AU362944S (en) Lapboard
PT3122358T (pt) Combinações de inibidores do fgfr e cmet para o tratamento do cancro
SG11201609962UA (en) Molecular sieve ssz-99
GB201408467D0 (en) Inks
IL248180A0 (en) Ionines are stable in the presence of hydroxide
GB201402646D0 (en) Polymers
EP3227121A4 (en) Printhead
GB201401854D0 (en) Molecular recognition
GB201418068D0 (en) Polymer
GB201407092D0 (en) Polymers
RS59406B1 (sr) Poboljšano biovezivo
GB201402404D0 (en) Polymer
EP2993051A4 (en) PRINTER
GB2559497B (en) Functional wall-tie
GB2523854B (en) Circuitry
GB201414109D0 (en) Improved inks
GB201420463D0 (en) Griptape letters
AU5285P (en) FLOMANRER Mandevilla sanderi
GB201420970D0 (en) eGURE, egure, Egure
GB201421030D0 (en) Up