SG11201509897WA - Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method - Google Patents
Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing methodInfo
- Publication number
- SG11201509897WA SG11201509897WA SG11201509897WA SG11201509897WA SG11201509897WA SG 11201509897W A SG11201509897W A SG 11201509897WA SG 11201509897W A SG11201509897W A SG 11201509897WA SG 11201509897W A SG11201509897W A SG 11201509897WA SG 11201509897W A SG11201509897W A SG 11201509897WA
- Authority
- SG
- Singapore
- Prior art keywords
- coated substrate
- reflectivemask
- reflectivefilm
- multilayer
- semiconductor device
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/023—Optical properties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/416—Reflective
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2551/00—Optical elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013202494 | 2013-09-27 | ||
| PCT/JP2014/074993 WO2015046095A1 (ja) | 2013-09-27 | 2014-09-22 | 導電膜付き基板、多層反射膜付き基板、反射型マスクブランク及び反射型マスク、並びに半導体装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201509897WA true SG11201509897WA (en) | 2016-04-28 |
Family
ID=52743232
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201509897WA SG11201509897WA (en) | 2013-09-27 | 2014-09-22 | Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method |
| SG10201911502WA SG10201911502WA (en) | 2013-09-27 | 2014-09-22 | Conductive film coated substrate, multilayer reflective film coated substrate, reflective mask blank, reflective mask, and semiconductor device manufacturing method |
| SG10201805079YA SG10201805079YA (en) | 2013-09-27 | 2014-09-22 | Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201911502WA SG10201911502WA (en) | 2013-09-27 | 2014-09-22 | Conductive film coated substrate, multilayer reflective film coated substrate, reflective mask blank, reflective mask, and semiconductor device manufacturing method |
| SG10201805079YA SG10201805079YA (en) | 2013-09-27 | 2014-09-22 | Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US9746762B2 (enExample) |
| JP (3) | JP5729847B2 (enExample) |
| KR (3) | KR102127907B1 (enExample) |
| SG (3) | SG11201509897WA (enExample) |
| TW (3) | TWI626503B (enExample) |
| WO (1) | WO2015046095A1 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6314019B2 (ja) * | 2014-03-31 | 2018-04-18 | ニッタ・ハース株式会社 | 半導体基板の研磨方法 |
| JP6069609B2 (ja) * | 2015-03-26 | 2017-02-01 | 株式会社リガク | 二重湾曲ｘ線集光素子およびその構成体、二重湾曲ｘ線分光素子およびその構成体の製造方法 |
| US10606166B2 (en) * | 2015-06-17 | 2020-03-31 | Hoya Corporation | Substrate with electrically conductive film, substrate with multilayer reflective film, reflective mask blank, reflective mask, and method of manufacturing semiconductor device |
| JP6873758B2 (ja) * | 2016-03-28 | 2021-05-19 | Hoya株式会社 | 基板の製造方法、多層反射膜付き基板の製造方法、マスクブランクの製造方法、及び転写用マスクの製造方法 |
| KR102393311B1 (ko) * | 2016-03-31 | 2022-05-02 | 호야 가부시키가이샤 | 반사형 마스크 블랭크의 제조 방법, 반사형 마스크 블랭크, 반사형 마스크의 제조 방법, 반사형 마스크, 및 반도체 장치의 제조 방법 |
| US9870612B2 (en) * | 2016-06-06 | 2018-01-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for repairing a mask |
| SG11201903409SA (en) * | 2016-10-21 | 2019-05-30 | Hoya Corp | Reflective mask blank, method of manufacturing reflective mask and method of manufacturing semiconductor device |
| WO2018135467A1 (ja) * | 2017-01-17 | 2018-07-26 | Hoya株式会社 | 反射型マスクブランク、反射型マスク及びその製造方法、並びに半導体装置の製造方法 |
| SG10201911903XA (en) * | 2017-02-27 | 2020-02-27 | Hoya Corp | Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device |
| SG11201913862WA (en) * | 2017-07-05 | 2020-01-30 | Toppan Printing Co Ltd | Reflective photomask blank and reflective photomask |
| US11531264B2 (en) * | 2018-05-25 | 2022-12-20 | Hoya Corporation | Reflective mask blank, reflective mask and manufacturing method thereof, and semiconductor device manufacturing method |
| WO2020095959A1 (ja) * | 2018-11-07 | 2020-05-14 | Hoya株式会社 | 多層反射膜付き基板、反射型マスクブランク、反射型マスクの製造方法、及び半導体装置の製造方法 |
| JP7250511B2 (ja) | 2018-12-27 | 2023-04-03 | Hoya株式会社 | 反射型マスクブランク、反射型マスク、及び半導体装置の製造方法 |
| DE102019100839B4 (de) * | 2019-01-14 | 2024-11-14 | Advanced Mask Technology Center Gmbh & Co. Kg | Fotomaskenanordnung mit reflektierender fotomaske und verfahren zum herstellen einer reflektierenden fotomaske |
| JP7263872B2 (ja) | 2019-03-25 | 2023-04-25 | 株式会社デンソー | ドリルの製造方法 |
| JP7350571B2 (ja) * | 2019-08-30 | 2023-09-26 | Hoya株式会社 | 導電膜付基板、反射型マスクブランク及び反射型マスク、並びに半導体デバイスの製造方法 |
| JP7271760B2 (ja) * | 2020-03-27 | 2023-05-11 | Hoya株式会社 | 多層反射膜付き基板、反射型マスクブランク、反射型マスク、及び半導体デバイスの製造方法 |
| KR102464780B1 (ko) * | 2020-09-02 | 2022-11-09 | 주식회사 에스앤에스텍 | 도전막을 구비하는 블랭크마스크 및 이를 이용하여 제작된 포토마스크 |
| JP7420027B2 (ja) * | 2020-09-10 | 2024-01-23 | 信越化学工業株式会社 | Ｅｕｖマスクブランク用多層反射膜付き基板、その製造方法及びｅｕｖマスクブランク |
| US20220137500A1 (en) * | 2020-10-30 | 2022-05-05 | AGC Inc. | Glass substrate for euvl, and mask blank for euvl |
| KR20220058424A (ko) * | 2020-10-30 | 2022-05-09 | 에이지씨 가부시키가이샤 | Euvl용 유리 기판, 및 euvl용 마스크 블랭크 |
| WO2022176749A1 (ja) * | 2021-02-16 | 2022-08-25 | Ａｇｃ株式会社 | Ｅｕｖリソグラフィ用反射型マスクブランク、ｅｕｖリソグラフィ用反射型マスク、およびそれらの製造方法 |
| JP7589633B2 (ja) * | 2021-04-19 | 2024-11-26 | Ａｇｃ株式会社 | 多層反射膜付き基板の検査方法、及び反射型マスクブランクの製造方法 |
| JP2025509018A (ja) * | 2022-03-25 | 2025-04-11 | フォトロニクス・インコーポレイテッド | フォトマスク表面処理のためのシステム、方法、及びプログラム製品 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0696434A (ja) * | 1992-07-31 | 1994-04-08 | Sony Corp | 磁気記録媒体及び磁気記録媒体の評価方法 |
| JPH0785463A (ja) | 1993-09-20 | 1995-03-31 | A G Technol Kk | 磁気ディスク |
| JPH10283626A (ja) * | 1997-02-09 | 1998-10-23 | Hoya Corp | 磁気記録媒体及びその製造方法 |
| JP2002288823A (ja) | 2002-03-14 | 2002-10-04 | Nippon Sheet Glass Co Ltd | 情報記録媒体用基板の製造方法 |
| JP2004199846A (ja) | 2002-10-23 | 2004-07-15 | Nippon Sheet Glass Co Ltd | 磁気記録媒体用ガラス基板及びその製造方法 |
| US7678511B2 (en) * | 2006-01-12 | 2010-03-16 | Asahi Glass Company, Limited | Reflective-type mask blank for EUV lithography |
| JP2007272995A (ja) | 2006-03-31 | 2007-10-18 | Hoya Corp | 磁気ディスク装置および非磁性基板の良否判定方法、磁気ディスク、並びに磁気ディスク装置 |
| KR101585696B1 (ko) * | 2006-12-15 | 2016-01-14 | 아사히 가라스 가부시키가이샤 | Ｅｕｖ 리소그래피용 반사형 마스크 블랭크, 및 그 마스크 블랭크용의 기능막이 형성된 기판 |
| MY170436A (en) * | 2008-06-30 | 2019-07-31 | Hoya Corp | Substrate for magnetic disk and magnetic disk |
| JP5481299B2 (ja) | 2010-07-22 | 2014-04-23 | 矢崎総業株式会社 | 導通検査治具の動作制御構造 |
| JP5533395B2 (ja) * | 2010-07-26 | 2014-06-25 | 旭硝子株式会社 | Ｅｕｖリソグラフィ用反射型マスクブランクの製造方法 |
| WO2012105698A1 (ja) | 2011-02-04 | 2012-08-09 | 旭硝子株式会社 | 導電膜付基板、多層反射膜付基板、およびｅｕｖリソグラフィ用反射型マスクブランク |
| JP6125772B2 (ja) | 2011-09-28 | 2017-05-10 | Hoya株式会社 | 反射型マスクブランク、反射型マスクおよび反射型マスクの製造方法 |
| JP5950535B2 (ja) * | 2011-10-25 | 2016-07-13 | 凸版印刷株式会社 | 反射型マスクブランクおよび反射型マスク |
| JP5949777B2 (ja) | 2011-10-28 | 2016-07-13 | 旭硝子株式会社 | Ｅｕｖリソグラフィ用反射型マスクブランクの製造方法 |
| KR102165129B1 (ko) | 2012-03-30 | 2020-10-13 | 호야 가부시키가이샤 | 마스크 블랭크용 기판, 다층 반사막 부착 기판, 반사형 마스크 블랭크, 반사형 마스크, 투과형 마스크 블랭크, 투과형 마스크 및 반도체 장치의 제조 방법 |
-
2014
- 2014-09-22 KR KR1020207012491A patent/KR102127907B1/ko active Active
- 2014-09-22 SG SG11201509897WA patent/SG11201509897WA/en unknown
- 2014-09-22 SG SG10201911502WA patent/SG10201911502WA/en unknown
- 2014-09-22 SG SG10201805079YA patent/SG10201805079YA/en unknown
- 2014-09-22 US US14/896,411 patent/US9746762B2/en active Active
- 2014-09-22 KR KR1020157035761A patent/KR101877896B1/ko active Active
- 2014-09-22 WO PCT/JP2014/074993 patent/WO2015046095A1/ja not_active Ceased
- 2014-09-22 KR KR1020177030201A patent/KR102107799B1/ko active Active
- 2014-09-25 JP JP2014194957A patent/JP5729847B2/ja active Active
- 2014-09-26 TW TW105103579A patent/TWI626503B/zh active
- 2014-09-26 TW TW103133627A patent/TWI530754B/zh active
- 2014-09-26 TW TW107112766A patent/TWI652542B/zh active
-
2015
- 2015-04-03 JP JP2015076651A patent/JP6465720B2/ja active Active
-
2017
- 2017-07-21 US US15/655,932 patent/US10209614B2/en active Active
-
2018
- 2018-12-28 US US16/235,334 patent/US10527927B2/en active Active
-
2019
- 2019-01-08 JP JP2019001198A patent/JP6630005B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015046095A1 (ja) | 2015-04-02 |
| TWI652542B (zh) | 2019-03-01 |
| TW201516556A (zh) | 2015-05-01 |
| KR102107799B1 (ko) | 2020-05-07 |
| TW201826009A (zh) | 2018-07-16 |
| US10527927B2 (en) | 2020-01-07 |
| KR20200047800A (ko) | 2020-05-07 |
| JP5729847B2 (ja) | 2015-06-03 |
| KR20170120718A (ko) | 2017-10-31 |
| US9746762B2 (en) | 2017-08-29 |
| SG10201911502WA (en) | 2020-02-27 |
| KR102127907B1 (ko) | 2020-06-29 |
| US20170315439A1 (en) | 2017-11-02 |
| KR20160061913A (ko) | 2016-06-01 |
| JP6630005B2 (ja) | 2020-01-15 |
| JP6465720B2 (ja) | 2019-02-06 |
| US20160124298A1 (en) | 2016-05-05 |
| TW201617728A (zh) | 2016-05-16 |
| US20190155141A1 (en) | 2019-05-23 |
| JP2015156034A (ja) | 2015-08-27 |
| TWI530754B (zh) | 2016-04-21 |
| US10209614B2 (en) | 2019-02-19 |
| TWI626503B (zh) | 2018-06-11 |
| KR101877896B1 (ko) | 2018-07-12 |
| JP2019056939A (ja) | 2019-04-11 |
| JP2015088742A (ja) | 2015-05-07 |
| SG10201805079YA (en) | 2018-07-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG10201911502WA (en) | Conductive film coated substrate, multilayer reflective film coated substrate, reflective mask blank, reflective mask, and semiconductor device manufacturing method | |
| SG10201911400WA (en) | Substrate with electrically conductive film, substrate with multilayer reflective film, reflective mask blank, reflective mask, and method of manufacturing semiconductor device | |
| SG11201505056WA (en) | Substrate for mask blank, substrate with multilayer reflective film, reflective mask blank, reflective mask, method of manufacturing for substrate for mask blank, method of manufacturing for substrate with multilayer reflective film, and method of manufacturing semiconductor device | |
| SG11201508899TA (en) | Reflective mask blank, method for manufacturing reflective mask blank, reflective mask, and method for manufacturing semiconductor device | |
| EP3018696B8 (en) | Manufacturing method for semiconductor substrate | |
| SG11202005918UA (en) | Substrate with conductive film, substrate with multilayer reflective film, reflective mask blank, reflective mask, and semiconductor device manufacturing method | |
| EP3065165A4 (en) | Substrate-holding apparatus, exposure apparatus, and device manufacturing method | |
| EP3032576A4 (en) | Oxide semiconductor layer and production method therefor, oxide semiconductor precursor, oxide semiconductor layer, semiconductor element, and electronic device | |
| EP3031789A4 (en) | Circuit substrate and semiconductor device | |
| EP3026716A4 (en) | Semiconductor light emitting element and method for manufacturing same | |
| EP3041046A4 (en) | Mounting substrate wafer, multilayer ceramic substrate, mounting substrate, chip module, and mounting substrate wafer manufacturing method | |
| SG11201601300TA (en) | Adhesive film and method for manufacturing semiconductor device | |
| EP3088181A4 (en) | Multilayered film and method for manufacturing same | |
| SG11201509848PA (en) | Multilayer coating film, and method for forming multilayer coating film | |
| EP3007212A4 (en) | Semiconductor wafer protection film and production method for semiconductor device | |
| SG11202002853TA (en) | Substrate with a multilayer reflective film, reflective mask blank, reflective mask and method of manufacturing semiconductor device | |
| SG11201508901XA (en) | Reflective mask blank and method for manufacturing same, reflective mask, and method for manufacturing semiconductor device | |
| SG11201505421SA (en) | Method for manufacturing mask blank substrate, method for manufacturing mask blank and method for manufacturing transfer mask | |
| EP3057144A4 (en) | Method for producing substrate for semiconductor light emitting elements, method for manufacturing semiconductor light emitting element, substrate for semiconductor light emitting elements, and semiconductor light emitting element | |
| SG10202112738PA (en) | Substrate with multilayer reflective film, reflective mask blank, reflective mask, and method of manufacturing semiconductor device | |
| EP3010043A4 (en) | Semiconductor device and manufacturing method therefor | |
| SG11201510022SA (en) | Apparatus and method for taping adhesive film on semiconductor substrate | |
| EP3197251A4 (en) | Layered body, substrate for semiconductor element mounting, and method for manufacturing said body and substrate | |
| EP3032587A4 (en) | Semiconductor element, method for manufacturing same, and semiconductor integrated circuit | |
| EP3309822A4 (en) | Electronic-device-protecting film, electronic-device-protecting member, method for manufacturing electronic device, and method for manufacturing package |