SG11201509490PA - Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same - Google Patents
Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the sameInfo
- Publication number
- SG11201509490PA SG11201509490PA SG11201509490PA SG11201509490PA SG11201509490PA SG 11201509490P A SG11201509490P A SG 11201509490PA SG 11201509490P A SG11201509490P A SG 11201509490PA SG 11201509490P A SG11201509490P A SG 11201509490PA SG 11201509490P A SG11201509490P A SG 11201509490PA
- Authority
- SG
- Singapore
- Prior art keywords
- wiring board
- printed wiring
- prepreg
- metal foil
- same
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
- C08K5/5477—Silicon-containing compounds containing nitrogen containing nitrogen in a heterocyclic ring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/304—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/02—Polyglycidyl ethers of bis-phenols
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013116901 | 2013-06-03 | ||
PCT/JP2014/064624 WO2014196501A1 (fr) | 2013-06-03 | 2014-06-02 | Composition de résine pour carte de circuit imprimé ainsi que pré-imprégné mettant en œuvre celle-ci, feuille de résine, plaque stratifiée revêtue d'une feuille de métal, et carte de circuit imprimé |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201509490PA true SG11201509490PA (en) | 2015-12-30 |
Family
ID=52008143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201509490PA SG11201509490PA (en) | 2013-06-03 | 2014-06-02 | Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same |
Country Status (8)
Country | Link |
---|---|
US (1) | US9905328B2 (fr) |
EP (1) | EP3006503B1 (fr) |
JP (1) | JP6481610B2 (fr) |
KR (1) | KR102147632B1 (fr) |
CN (1) | CN105264013B (fr) |
SG (1) | SG11201509490PA (fr) |
TW (1) | TWI631009B (fr) |
WO (1) | WO2014196501A1 (fr) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016010964A (ja) * | 2014-06-03 | 2016-01-21 | 三菱瓦斯化学株式会社 | 樹脂シート及びプリント配線板 |
CN107406582B (zh) * | 2015-03-31 | 2020-01-17 | 三菱瓦斯化学株式会社 | 氰酸酯化合物、包含该化合物的固化性树脂组合物和其固化物 |
WO2016190323A1 (fr) * | 2015-05-25 | 2016-12-01 | 日立化成株式会社 | Composition de résine, feuille de résine, préimprégné, matériau isolant, article durci à base d'une feuille de résine, et élément de dissipation de chaleur |
EP3321319B1 (fr) * | 2015-07-06 | 2022-10-05 | Mitsubishi Gas Chemical Company, Inc. | Composition de résine et prépreg, feuille de résine, plaque stratifiée et carte de circuit imprimé |
WO2017006896A1 (fr) * | 2015-07-06 | 2017-01-12 | 三菱瓦斯化学株式会社 | Composition de résine, pré-imprégné, feuille de résine, plaque stratifiée recouverte d'une feuille métallique, et carte de circuit imprimé |
CN107535056B (zh) * | 2015-07-06 | 2020-12-04 | 三菱瓦斯化学株式会社 | 印刷电路板的制造方法、和树脂组合物 |
WO2017006895A1 (fr) * | 2015-07-06 | 2017-01-12 | 三菱瓦斯化学株式会社 | Composition de résine, préimprégné mettant en œuvre celle-ci, feuille de résine, plaque stratifiée, et carte de circuit imprimé |
JP7320338B2 (ja) * | 2015-07-06 | 2023-08-03 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、及びプリント配線板 |
WO2017006888A1 (fr) * | 2015-07-06 | 2017-01-12 | 三菱瓦斯化学株式会社 | Composition de résine, pré-imprégné ou feuille de résine mettant en œuvre cette composition, plaque stratifiée mettant en œuvre ceux-ci, et carte de circuit imprimé |
JP6531910B2 (ja) * | 2015-10-09 | 2019-06-19 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板 |
JP6761572B2 (ja) * | 2015-11-11 | 2020-09-30 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板 |
WO2017130721A1 (fr) * | 2016-01-27 | 2017-08-03 | 株式会社新技術研究所 | Article en cuivre ou alliage de cuivre contenant une résine polyester à surface modifiée, et procédé de fabrication de celui-ci |
WO2018003314A1 (fr) * | 2016-06-29 | 2018-01-04 | 三菱瓦斯化学株式会社 | Composition de résine, feuille de résine, carte de circuit imprimé multicouche et dispositif semi-conducteur |
SG11201811809SA (en) * | 2016-07-05 | 2019-02-27 | Hitachi Chemical Co Ltd | Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board |
WO2018124161A1 (fr) * | 2016-12-28 | 2018-07-05 | 三菱瓦斯化学株式会社 | Composition de résine de carte de circuit imprimé, préimprégné, feuille de résine, plaque stratifiée, plaque stratifiée avec gainage de feuille métallique, carte de circuit imprimé, et carte de circuit imprimé multicouche |
KR102026591B1 (ko) * | 2016-12-28 | 2019-09-27 | 미츠비시 가스 가가쿠 가부시키가이샤 | 프리프레그, 적층판, 금속박 피복 적층판, 프린트 배선판, 및 다층 프린트 배선판 |
JP6519965B2 (ja) * | 2017-02-07 | 2019-05-29 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板 |
TWI761512B (zh) * | 2017-05-15 | 2022-04-21 | 日商三菱瓦斯化學股份有限公司 | 微影用膜形成材料、微影用膜形成用組成物、微影用下層膜及圖型形成方法 |
JP6511614B2 (ja) | 2017-08-02 | 2019-05-15 | 株式会社新技術研究所 | 金属と樹脂の複合材 |
US11114833B2 (en) | 2017-12-28 | 2021-09-07 | Furukawa Electric Co., Ltd. | Wire exterior body and exterior-covered wire harness |
WO2019189466A1 (fr) * | 2018-03-28 | 2019-10-03 | 積水化学工業株式会社 | Matériau de résine et carte de câblage imprimée multicouche |
JP6516115B1 (ja) * | 2018-05-16 | 2019-05-22 | 山栄化学株式会社 | 溶解性・非溶解性粒子含有硬化性樹脂組成物 |
JP7322877B2 (ja) * | 2018-06-01 | 2023-08-08 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート、及びプリント配線板 |
KR20220011112A (ko) * | 2019-05-20 | 2022-01-27 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 프리프레그, 지지체가 형성된 레진 시트, 금속박 피복 적층판, 및 프린트 배선판 |
TWI733145B (zh) * | 2019-07-24 | 2021-07-11 | 宏泰電工股份有限公司 | 印刷電路板用樹脂組成物、預浸材、覆金屬基板及印刷電路板 |
JP6907393B1 (ja) * | 2020-08-05 | 2021-07-21 | 信越化学工業株式会社 | 熱硬化性樹脂組成物及び半導体装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS646782A (en) | 1987-06-29 | 1989-01-11 | Toshiba Corp | Radiation exposure management terminal equipment |
JPH0768256B2 (ja) * | 1991-08-01 | 1995-07-26 | 株式会社ジャパンエナジー | 新規イミダゾールシラン化合物及びその製造方法並びにそれを用いる金属表面処理剤 |
JP3436634B2 (ja) | 1996-04-30 | 2003-08-11 | 株式会社ジャパンエナジー | 表面処理剤および樹脂添加剤 |
US7045461B2 (en) * | 2000-01-07 | 2006-05-16 | Nikkon Materials Co., Ltd. | Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these |
JP3536014B2 (ja) | 2000-04-07 | 2004-06-07 | 株式会社日鉱マテリアルズ | イミダゾール有機モノカルボン酸塩誘導体反応生成物及びその製造方法、並びにそれを用いる表面処理剤、樹脂添加剤および樹脂組成物 |
JP2003318499A (ja) | 2002-04-23 | 2003-11-07 | Matsushita Electric Works Ltd | 内層回路用プリプレグ、内層回路用金属張積層板及び多層プリント配線板 |
JP4016782B2 (ja) | 2002-09-25 | 2007-12-05 | 松下電工株式会社 | プリント配線板用エポキシ樹脂組成物、プリプレグ、金属張積層板、多層プリント配線板 |
JP4617838B2 (ja) * | 2003-12-25 | 2011-01-26 | チッソ株式会社 | 液晶性(メタ)アクリレート誘導体およびそれらを含む組成物 |
JP4810875B2 (ja) * | 2004-06-09 | 2011-11-09 | 三菱瓦斯化学株式会社 | 硬化性樹脂組成物 |
US7892651B2 (en) * | 2004-09-14 | 2011-02-22 | Mitsubishi Gas Chemical Company, Inc. | Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate |
US20110189432A1 (en) * | 2008-07-29 | 2011-08-04 | Sekisui Chemical Co., Ltd. | Epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer laminate |
WO2010035452A1 (fr) * | 2008-09-24 | 2010-04-01 | 積水化学工業株式会社 | Composition de résine, corps durci et corps multicouche |
EP2716709B1 (fr) | 2011-05-31 | 2019-09-11 | Mitsubishi Gas Chemical Company, Inc. | Composition de résine, préimprégné et stratifié |
WO2013008684A1 (fr) * | 2011-07-14 | 2013-01-17 | 三菱瓦斯化学株式会社 | Composition à base de résine pour plaquettes de circuits imprimés |
CN104685979B (zh) * | 2012-09-27 | 2018-11-16 | 积水化学工业株式会社 | 多层基板的制造方法、多层绝缘膜及多层基板 |
-
2014
- 2014-06-02 JP JP2015521439A patent/JP6481610B2/ja active Active
- 2014-06-02 EP EP14807917.1A patent/EP3006503B1/fr not_active Not-in-force
- 2014-06-02 WO PCT/JP2014/064624 patent/WO2014196501A1/fr active Application Filing
- 2014-06-02 SG SG11201509490PA patent/SG11201509490PA/en unknown
- 2014-06-02 US US14/890,714 patent/US9905328B2/en active Active
- 2014-06-02 CN CN201480031840.2A patent/CN105264013B/zh not_active Expired - Fee Related
- 2014-06-02 KR KR1020157034758A patent/KR102147632B1/ko active IP Right Grant
- 2014-06-03 TW TW103119260A patent/TWI631009B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPWO2014196501A1 (ja) | 2017-02-23 |
JP6481610B2 (ja) | 2019-03-13 |
KR20160014643A (ko) | 2016-02-11 |
EP3006503A1 (fr) | 2016-04-13 |
TWI631009B (zh) | 2018-08-01 |
WO2014196501A1 (fr) | 2014-12-11 |
US20160125971A1 (en) | 2016-05-05 |
EP3006503B1 (fr) | 2019-05-08 |
EP3006503A4 (fr) | 2017-02-22 |
US9905328B2 (en) | 2018-02-27 |
KR102147632B1 (ko) | 2020-08-25 |
CN105264013A (zh) | 2016-01-20 |
CN105264013B (zh) | 2018-07-03 |
TW201504039A (zh) | 2015-02-01 |
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