HK1221241A1 - 樹脂組合物、預浸料、層叠片以及覆有金屬箔的層叠板 - Google Patents

樹脂組合物、預浸料、層叠片以及覆有金屬箔的層叠板

Info

Publication number
HK1221241A1
HK1221241A1 HK16109355.2A HK16109355A HK1221241A1 HK 1221241 A1 HK1221241 A1 HK 1221241A1 HK 16109355 A HK16109355 A HK 16109355A HK 1221241 A1 HK1221241 A1 HK 1221241A1
Authority
HK
Hong Kong
Prior art keywords
prepreg
foil
metal
resin composition
laminated sheet
Prior art date
Application number
HK16109355.2A
Other languages
English (en)
Inventor
有井健治
小林宇志
十龜政伸
馬渕義則
三島裕之
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of HK1221241A1 publication Critical patent/HK1221241A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
    • C08G73/065—Preparatory processes
    • C08G73/0655—Preparatory processes from polycyanurates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
HK16109355.2A 2013-10-25 2016-08-05 樹脂組合物、預浸料、層叠片以及覆有金屬箔的層叠板 HK1221241A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013222023 2013-10-25
PCT/JP2014/077870 WO2015060266A1 (ja) 2013-10-25 2014-10-20 樹脂組成物、プリプレグ、積層シート及び金属箔張り積層板

Publications (1)

Publication Number Publication Date
HK1221241A1 true HK1221241A1 (zh) 2017-05-26

Family

ID=52992860

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16109355.2A HK1221241A1 (zh) 2013-10-25 2016-08-05 樹脂組合物、預浸料、層叠片以及覆有金屬箔的層叠板

Country Status (9)

Country Link
US (1) US20160237246A1 (zh)
EP (1) EP3061789B1 (zh)
JP (1) JP6512102B2 (zh)
KR (1) KR102136518B1 (zh)
CN (1) CN105705578B (zh)
HK (1) HK1221241A1 (zh)
SG (1) SG11201602284SA (zh)
TW (1) TWI636089B (zh)
WO (1) WO2015060266A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201700803VA (en) 2015-02-03 2017-03-30 Mitsubishi Gas Chemical Co Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board
WO2017006896A1 (ja) 2015-07-06 2017-01-12 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、レジンシート、金属箔張積層板及びプリント配線板
KR102330406B1 (ko) * 2015-07-06 2021-11-23 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 그것을 사용한 프리프레그, 레진 시트, 적층판, 및 프린트 배선판
WO2017006897A1 (ja) * 2015-07-06 2017-01-12 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、レジンシート、金属箔張積層板及びプリント配線板
JP6465463B1 (ja) * 2017-08-21 2019-02-06 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1248668B (de) 1963-02-16 1967-08-31 Farbenfabriken Bayer Aktienge Seilschaft Leverkusen Verfahren zur Herstellung von aromatischen Cyansaureestern
US4931545A (en) 1989-05-03 1990-06-05 Hi-Tek Polymers, Inc. Flame retardant polycyanate ester blend
JPH06271669A (ja) 1993-03-19 1994-09-27 Sumitomo Bakelite Co Ltd 難燃性低誘電率熱硬化性樹脂組成物
JP3319061B2 (ja) 1993-08-20 2002-08-26 住友化学工業株式会社 シアネート化合物の製造方法
JP2991054B2 (ja) 1994-09-20 1999-12-20 住友化学工業株式会社 シアネート化合物の製造方法
US5756592A (en) 1995-11-27 1998-05-26 Alliedsignal, Inc. Process for the production of cyanate ester resins having unique composition
AU5751298A (en) 1996-11-29 1998-06-22 Lonza A.G. Method for producing arylcyanates
JPH11124433A (ja) 1997-10-22 1999-05-11 Mitsubishi Gas Chem Co Inc フェノールノボラック型シアン酸エステルプレポリマー
JP2000191776A (ja) 1998-12-24 2000-07-11 Mitsubishi Gas Chem Co Inc シアン酸エステル・コ−プレポリマー
JP3081996U (ja) 2001-05-22 2001-11-22 日本ザンパック株式会社 冷凍固形食品用容器
US20050182203A1 (en) * 2004-02-18 2005-08-18 Yuuichi Sugano Novel cyanate ester compound, flame-retardant resin composition, and cured product thereof
JP4407823B2 (ja) * 2004-02-18 2010-02-03 三菱瓦斯化学株式会社 新規なシアネートエステル化合物、難燃性樹脂組成物、およびその硬化物
JP4997727B2 (ja) * 2005-08-12 2012-08-08 三菱瓦斯化学株式会社 難燃性樹脂組成物、並びにこれを用いたプリプレグ及び積層板
JP4843944B2 (ja) * 2005-01-13 2011-12-21 三菱瓦斯化学株式会社 樹脂組成物並びにこれを用いたプリプレグ及び積層板
JP4784198B2 (ja) * 2005-08-11 2011-10-05 三菱瓦斯化学株式会社 熱硬化性樹脂組成物
JP5026727B2 (ja) 2006-04-03 2012-09-19 三菱瓦斯化学株式会社 高純度シアン酸エステルの製造方法
JP5233710B2 (ja) * 2008-02-12 2013-07-10 三菱瓦斯化学株式会社 樹脂組成物、プリプレグおよび金属箔張り積層板
US10017660B2 (en) * 2010-06-02 2018-07-10 Mitsubishi Gas Chemical Company, Inc. Resin composition, and prepreg and laminated sheet using the same
JP5954586B2 (ja) * 2011-05-31 2016-07-20 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ及び積層板
US20150034369A1 (en) * 2011-07-14 2015-02-05 Mitsubishi Gas Chemical Company, Inc. Resin composition for printed wiring boards
SG11201502157VA (en) * 2012-10-26 2015-05-28 Mitsubishi Gas Chemical Co Method for producing cyanogen halide, cyanateester compound and method for producing the same,and resin composition
JP5966903B2 (ja) * 2012-12-13 2016-08-10 Dic株式会社 シアン酸エステル樹脂、硬化性樹脂組成物、その硬化物、プリプレグ、回路基板、半導体封止材料、及びビルドアップフィルム
JP6111776B2 (ja) * 2013-03-25 2017-04-12 Dic株式会社 シアン酸エステル樹脂、硬化性樹脂組成物、その硬化物、プリプレグ、回路基板、半導体封止材料、及びビルドアップフィルム

Also Published As

Publication number Publication date
KR102136518B1 (ko) 2020-07-22
JP6512102B2 (ja) 2019-05-15
US20160237246A1 (en) 2016-08-18
TW201522488A (zh) 2015-06-16
SG11201602284SA (en) 2016-05-30
JPWO2015060266A1 (ja) 2017-03-09
TWI636089B (zh) 2018-09-21
CN105705578B (zh) 2017-10-20
EP3061789A4 (en) 2017-06-14
EP3061789B1 (en) 2018-05-30
EP3061789A1 (en) 2016-08-31
KR20160078372A (ko) 2016-07-04
WO2015060266A1 (ja) 2015-04-30
CN105705578A (zh) 2016-06-22

Similar Documents

Publication Publication Date Title
EP3216834A4 (en) Resin composition, prepreg, metal-foil-clad laminated board, resin composite sheet, and printed circuit board
SG11201509672RA (en) Resin composition, prepreg, resin sheet and metal foil-clad laminate
SG11201502925UA (en) Resin composition, prepreg, laminate and printed-wiring board
SG11201406174PA (en) Resin composition, prepreg, and laminate
SG11201505058PA (en) Resin composition, prepreg, laminate, metal foil-clad laminate, and printed-wiring board
EP3045489A4 (en) PRE-IMPREGNATED THERMOPLASTIC AND LAMINATE
SG11201404727XA (en) Resin composition, prepreg, resin sheet, and metal foil-clad laminate
EP2684904A4 (en) RESIN COMPOSITION, AND PRE-IMPREGNATED AND LAMINATE SHEET CONTAINING THE SAME
SG11201509490PA (en) Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same
SG10201602081SA (en) Resin composition, prepreg, and laminate
SG11201401906SA (en) Resin composition, and prepreg and laminate using the same
EP2829568A4 (en) PREPREG AND LAMINATED BOARD
EP2716676A4 (en) RESIN COMPOSITION, PREPREG AND LAMINATE
EP2690120A4 (en) RESIN COMPOSITION, PRE-IMPREGNATED AND RESIN SHEET, AND LAMINATE PLATED WITH METALLIC FOIL
HK1212720A1 (zh) 樹脂組合物、預浸料和薄膜
EP3115418A4 (en) Resin composition, prepreg, resin sheet, metal-foil-clad laminated plate, and printed wiring board
EP3219758A4 (en) Thermosetting resin composition and prepreg and laminated board prepared therefrom
SG11201405224QA (en) Resin composition, prepreg, and metal foil-clad laminate
EP2774938A4 (en) RESIN COMPOSITION, PREPREG AND LAMINATED FOIL
EP2896653A4 (en) EPOXY RESIN COMPOSITION AND PRE-IMPREGNATED AND COPPER LAMINATE MANUFACTURED USING THE COMPOSITION
EP2918637A4 (en) RESIN COMPOSITION AND LAMINATE FOR PRINTED CIRCUIT BOARD COMPRISING THE COMPOSITION
SG10201509881VA (en) Resin composition, prepreg, and laminate
HK1221241A1 (zh) 樹脂組合物、預浸料、層叠片以及覆有金屬箔的層叠板
EP3006479A4 (en) COMPOSITION, ADHESIVE, ADHESIVE AND LAMINATE
SG11201501112TA (en) Resin sheet, support with resin layer, laminate and metal foil-clad laminate