SG11201508398TA - Silicon wafer polishing composition - Google Patents
Silicon wafer polishing compositionInfo
- Publication number
- SG11201508398TA SG11201508398TA SG11201508398TA SG11201508398TA SG11201508398TA SG 11201508398T A SG11201508398T A SG 11201508398TA SG 11201508398T A SG11201508398T A SG 11201508398TA SG 11201508398T A SG11201508398T A SG 11201508398TA SG 11201508398T A SG11201508398T A SG 11201508398TA
- Authority
- SG
- Singapore
- Prior art keywords
- silicon wafer
- polishing composition
- wafer polishing
- composition
- silicon
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Composite Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013120328 | 2013-06-07 | ||
| JP2014010836 | 2014-01-23 | ||
| PCT/JP2014/062176 WO2014196299A1 (ja) | 2013-06-07 | 2014-05-02 | シリコンウエハ研磨用組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201508398TA true SG11201508398TA (en) | 2015-11-27 |
Family
ID=52007952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201508398TA SG11201508398TA (en) | 2013-06-07 | 2014-05-02 | Silicon wafer polishing composition |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US20160122591A1 (enExample) |
| EP (1) | EP3007213B1 (enExample) |
| JP (2) | JP6037416B2 (enExample) |
| KR (1) | KR102239045B1 (enExample) |
| CN (1) | CN105264647B (enExample) |
| SG (1) | SG11201508398TA (enExample) |
| TW (1) | TWI650410B (enExample) |
| WO (1) | WO2014196299A1 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6403324B2 (ja) * | 2014-12-25 | 2018-10-10 | 花王株式会社 | シリコンウェーハ用研磨液組成物 |
| JP6366139B2 (ja) * | 2014-12-25 | 2018-08-01 | 花王株式会社 | シリコンウェーハ用研磨液組成物の製造方法 |
| US10748778B2 (en) | 2015-02-12 | 2020-08-18 | Fujimi Incorporated | Method for polishing silicon wafer and surface treatment composition |
| WO2016129215A1 (ja) * | 2015-02-12 | 2016-08-18 | 株式会社フジミインコーポレーテッド | シリコンウェーハの研磨方法および表面処理組成物 |
| CN107735471B (zh) * | 2015-07-10 | 2021-02-12 | 费罗公司 | 用于抛光有机聚合物基眼用基材的浆液组合物和添加剂以及方法 |
| JP6801964B2 (ja) * | 2016-01-19 | 2020-12-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びシリコン基板の研磨方法 |
| JP6892434B2 (ja) * | 2016-02-29 | 2021-06-23 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびこれを用いた研磨方法 |
| SG11201901590SA (en) * | 2016-09-21 | 2019-03-28 | Fujimi Inc | Composition for surface treatment |
| CN110462797B (zh) * | 2017-03-31 | 2023-09-22 | 福吉米株式会社 | 研磨用组合物 |
| JP6916039B2 (ja) * | 2017-06-05 | 2021-08-11 | Ａｔシリカ株式会社 | 研磨用組成物 |
| EP3708630A4 (en) | 2017-11-06 | 2021-08-18 | Fujimi Incorporated | COMPOSITION FOR POLISHING, AND METHOD FOR MANUFACTURING THE SAME |
| JP7353051B2 (ja) * | 2019-03-26 | 2023-09-29 | 株式会社フジミインコーポレーテッド | シリコンウェーハ研磨用組成物 |
| JP7356248B2 (ja) * | 2019-03-28 | 2023-10-04 | 株式会社フジミインコーポレーテッド | リンス用組成物およびリンス方法 |
| CN110922897B (zh) * | 2019-11-18 | 2024-03-08 | 宁波日晟新材料有限公司 | 一种用于硅化合物的低雾值无损伤抛光液及其制备方法 |
| JP7512035B2 (ja) * | 2019-12-24 | 2024-07-08 | ニッタ・デュポン株式会社 | 研磨用組成物 |
| JP7752601B2 (ja) * | 2020-03-13 | 2025-10-10 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| WO2021182155A1 (ja) * | 2020-03-13 | 2021-09-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
| JP7562453B2 (ja) | 2021-03-12 | 2024-10-07 | キオクシア株式会社 | 研磨液、研磨装置、及び研磨方法 |
| EP4355836A4 (en) * | 2021-06-14 | 2025-04-09 | Entegris, Inc. | SANDING HARD SUBSTRATES |
| JPWO2023181928A1 (enExample) | 2022-03-23 | 2023-09-28 | ||
| JPWO2024195575A1 (enExample) * | 2023-03-20 | 2024-09-26 | ||
| WO2025115883A1 (ja) * | 2023-11-28 | 2025-06-05 | 大阪有機化学工業株式会社 | 研磨組成物 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100447551B1 (ko) * | 1999-01-18 | 2004-09-08 | 가부시끼가이샤 도시바 | 복합 입자 및 그의 제조 방법, 수계 분산체, 화학 기계연마용 수계 분산체 조성물 및 반도체 장치의 제조 방법 |
| KR20010046395A (ko) * | 1999-11-12 | 2001-06-15 | 안복현 | 연마용 조성물 |
| WO2004068570A1 (ja) * | 2003-01-31 | 2004-08-12 | Hitachi Chemical Co., Ltd. | Cmp研磨剤及び研磨方法 |
| TWI361218B (en) * | 2005-04-14 | 2012-04-01 | Showa Denko Kk | Polishing composition |
| EP1956642A4 (en) | 2005-11-11 | 2011-04-06 | Hitachi Chemical Co Ltd | POLISHING AGENT FOR SILICONE OXIDE, LIQUID ADDITIVE AND POLISHING PROCESS |
| KR20090020709A (ko) * | 2006-07-28 | 2009-02-26 | 쇼와 덴코 가부시키가이샤 | 연마 조성물 |
| JP2008091524A (ja) * | 2006-09-29 | 2008-04-17 | Fujifilm Corp | 金属用研磨液 |
| JP2008181955A (ja) * | 2007-01-23 | 2008-08-07 | Fujifilm Corp | 金属用研磨液及びそれを用いた研磨方法 |
| JP2009123880A (ja) * | 2007-11-14 | 2009-06-04 | Showa Denko Kk | 研磨組成物 |
| KR101564673B1 (ko) * | 2008-02-01 | 2015-10-30 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물 및 이를 이용한 연마 방법 |
| US20110081780A1 (en) * | 2008-02-18 | 2011-04-07 | Jsr Corporation | Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method |
| JP5207002B2 (ja) * | 2008-02-27 | 2013-06-12 | Ｊｓｒ株式会社 | 化学機械研磨用水系分散体およびそれを用いた化学機械研磨方法、化学機械研磨用水系分散体の再生方法 |
| CN102017091B (zh) * | 2008-04-23 | 2014-10-29 | 日立化成株式会社 | 研磨剂及使用该研磨剂的基板研磨方法 |
| KR101277342B1 (ko) * | 2009-04-20 | 2013-06-20 | 히타치가세이가부시끼가이샤 | 반도체 기판용 연마액 및 반도체 기판의 연마 방법 |
| KR20120048562A (ko) | 2009-07-15 | 2012-05-15 | 램 리써치 코포레이션 | 진보된 기판 세정을 위한 재료 및 시스템 |
| US9536752B2 (en) * | 2009-11-11 | 2017-01-03 | Kuraray Co., Ltd. | Slurry for chemical mechanical polishing and polishing method for substrate using same |
| JP4772156B1 (ja) | 2010-07-05 | 2011-09-14 | 花王株式会社 | シリコンウエハ用研磨液組成物 |
| SG192220A1 (en) * | 2011-02-03 | 2013-09-30 | Nitta Haas Inc | Polishing composition and polishing method using the same |
| CN108831830B (zh) * | 2012-02-21 | 2024-05-17 | 株式会社力森诺科 | 研磨剂、研磨剂组和基体的研磨方法 |
| JP5822356B2 (ja) * | 2012-04-17 | 2015-11-24 | 花王株式会社 | シリコンウェーハ用研磨液組成物 |
-
2014
- 2014-05-02 JP JP2015521346A patent/JP6037416B2/ja active Active
- 2014-05-02 EP EP14807048.5A patent/EP3007213B1/en active Active
- 2014-05-02 SG SG11201508398TA patent/SG11201508398TA/en unknown
- 2014-05-02 CN CN201480032514.3A patent/CN105264647B/zh active Active
- 2014-05-02 KR KR1020157034595A patent/KR102239045B1/ko active Active
- 2014-05-02 US US14/895,318 patent/US20160122591A1/en not_active Abandoned
- 2014-05-02 WO PCT/JP2014/062176 patent/WO2014196299A1/ja not_active Ceased
- 2014-05-21 TW TW103117769A patent/TWI650410B/zh active
-
2016
- 2016-07-08 JP JP2016135649A patent/JP6360108B2/ja active Active
-
2017
- 2017-05-23 US US15/602,679 patent/US10745588B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI650410B (zh) | 2019-02-11 |
| TW201510197A (zh) | 2015-03-16 |
| JP6360108B2 (ja) | 2018-07-18 |
| US20160122591A1 (en) | 2016-05-05 |
| JP2016201557A (ja) | 2016-12-01 |
| JPWO2014196299A1 (ja) | 2017-02-23 |
| EP3007213A4 (en) | 2017-02-22 |
| CN105264647B (zh) | 2018-01-09 |
| KR102239045B1 (ko) | 2021-04-12 |
| EP3007213B1 (en) | 2020-03-18 |
| US10745588B2 (en) | 2020-08-18 |
| KR20160013896A (ko) | 2016-02-05 |
| JP6037416B2 (ja) | 2016-12-07 |
| CN105264647A (zh) | 2016-01-20 |
| US20170253767A1 (en) | 2017-09-07 |
| EP3007213A1 (en) | 2016-04-13 |
| WO2014196299A1 (ja) | 2014-12-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG11201508398TA (en) | Silicon wafer polishing composition | |
| EP3062337A4 (en) | Polishing liquid composition for silicon wafers | |
| EP2840591A4 (en) | COMPOSITION FOR A SILICON WAFER POLISH LIQUID | |
| SG10201406877WA (en) | Method for chemical mechanical polishing silicon wafers | |
| ZA201604565B (en) | Abrasive cleaning composition | |
| SG11201609077VA (en) | Composition for polishing silicon wafers | |
| SG11201407916RA (en) | Polishing solution composition for wafers | |
| TWI563660B (en) | Semiconductor device | |
| SG11201604650SA (en) | Semiconductor device | |
| SG10201601511RA (en) | Semiconductor device | |
| EP3055376A4 (en) | Mixed abrasive polishing compositions | |
| GB2514918B (en) | Nitride semiconductor substrate | |
| GB201510735D0 (en) | Semiconductor device | |
| SG11201704360UA (en) | Method for polishing silicon wafer | |
| SG11201601941SA (en) | Polishing composition | |
| SG10201704400YA (en) | Doping media for the local doping of silicon wafers | |
| SG11201601847WA (en) | Polishing composition | |
| EP3010037A4 (en) | Silicon carbide semiconductor device manufacturing method | |
| SG11201603049WA (en) | Semiconductor device fabrication | |
| SG11201505900XA (en) | Polishing pad | |
| EP3096348A4 (en) | Wafer grinding device | |
| SG11201505490RA (en) | Surface selective polishing compositions | |
| SG11201705202PA (en) | Polishing solution composition for silicon oxide film polishing | |
| SG11201603413PA (en) | Semiconductor device | |
| IL240809B (en) | Chemical mechanical polishing preparations containing polyethylene imine |