SG11201507903PA - Composite sheet for forming protective film - Google Patents

Composite sheet for forming protective film

Info

Publication number
SG11201507903PA
SG11201507903PA SG11201507903PA SG11201507903PA SG11201507903PA SG 11201507903P A SG11201507903P A SG 11201507903PA SG 11201507903P A SG11201507903P A SG 11201507903PA SG 11201507903P A SG11201507903P A SG 11201507903PA SG 11201507903P A SG11201507903P A SG 11201507903PA
Authority
SG
Singapore
Prior art keywords
protective film
composite sheet
forming protective
forming
composite
Prior art date
Application number
SG11201507903PA
Other languages
English (en)
Inventor
Hiroyuki Yoneyama
Naoya Saiki
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of SG11201507903PA publication Critical patent/SG11201507903PA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
SG11201507903PA 2013-03-27 2014-03-26 Composite sheet for forming protective film SG11201507903PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013066682 2013-03-27
PCT/JP2014/058699 WO2014157426A1 (ja) 2013-03-27 2014-03-26 保護膜形成用複合シート

Publications (1)

Publication Number Publication Date
SG11201507903PA true SG11201507903PA (en) 2015-10-29

Family

ID=51624389

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201507903PA SG11201507903PA (en) 2013-03-27 2014-03-26 Composite sheet for forming protective film

Country Status (9)

Country Link
US (1) US10030174B2 (zh)
EP (1) EP2980835B1 (zh)
JP (1) JP5774799B2 (zh)
KR (1) KR101570959B1 (zh)
CN (1) CN105074878B (zh)
PT (1) PT2980835T (zh)
SG (1) SG11201507903PA (zh)
TW (1) TWI542659B (zh)
WO (1) WO2014157426A1 (zh)

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WO2014157520A1 (ja) * 2013-03-28 2014-10-02 リンテック株式会社 保護膜形成用複合シート、保護膜付きチップ、及び保護膜付きチップの製造方法
KR20160001169A (ko) * 2014-06-26 2016-01-06 삼성전자주식회사 마킹층을 포함하는 반도체 패키지
JP6356054B2 (ja) * 2014-12-03 2018-07-11 リンテック株式会社 積層フィルムおよびこれを用いた粘着シート
JP6362526B2 (ja) * 2014-12-04 2018-07-25 古河電気工業株式会社 ウエハ加工用テープ
WO2016098697A1 (ja) * 2014-12-19 2016-06-23 リンテック株式会社 樹脂膜形成用シート積層体
WO2016143192A1 (ja) 2015-03-12 2016-09-15 リンテック株式会社 保護膜形成用フィルム
JP2016213236A (ja) * 2015-04-30 2016-12-15 日東電工株式会社 半導体装置用フィルム、及び、半導体装置の製造方法
WO2016195071A1 (ja) * 2015-06-05 2016-12-08 リンテック株式会社 保護膜形成用複合シート
TWI704996B (zh) * 2015-11-04 2020-09-21 日商琳得科股份有限公司 第一保護膜形成用片
ES2930455T3 (es) * 2015-11-09 2022-12-13 Furukawa Electric Co Ltd Cinta de protección de superficie con máscara integrada
JP6577341B2 (ja) * 2015-11-13 2019-09-18 日東電工株式会社 積層体および半導体装置の製造方法
US11774166B2 (en) 2015-11-25 2023-10-03 Riken Technos Corporation Door body
CN107406731A (zh) * 2016-01-06 2017-11-28 日东电工株式会社 带有剥离衬垫的石墨粘合带
EP3418342A4 (en) * 2016-02-19 2019-11-13 Riken Technos Corporation PRESSURE-SENSITIVE ADHESIVE AND ARTICLES CONTAINING SAME
CN108701597B (zh) * 2016-03-04 2023-03-31 琳得科株式会社 保护膜形成用复合片
JP6791647B2 (ja) * 2016-03-29 2020-11-25 リンテック株式会社 積層体および保護フィルム
CN105802221A (zh) * 2016-04-06 2016-07-27 汤卓群 一种用于生物材料表面改性的纳米聚合薄膜及其制备方法
KR102472267B1 (ko) * 2016-04-28 2022-11-30 린텍 가부시키가이샤 보호막이 형성된 반도체 칩의 제조 방법 및 반도체 장치의 제조 방법
TWI770021B (zh) * 2016-04-28 2022-07-11 日商琳得科股份有限公司 保護膜形成用複合片
CN109072009A (zh) * 2016-04-28 2018-12-21 琳得科株式会社 保护膜形成用膜及保护膜形成用复合片
JP6723644B2 (ja) * 2016-05-16 2020-07-15 株式会社ディスコ エキスパンドシート
JP2017123488A (ja) * 2017-03-17 2017-07-13 日東電工株式会社 半導体装置用フィルム、及び、半導体装置の製造方法
JP6582013B2 (ja) * 2017-03-31 2019-09-25 古河電気工業株式会社 剥離ライナー付マスク一体型表面保護テープ
CN111466014B (zh) * 2018-03-30 2024-01-02 琳得科株式会社 保护膜形成用复合片及其制造方法
JP2018148218A (ja) * 2018-04-18 2018-09-20 日東電工株式会社 半導体装置用フィルム、及び、半導体装置の製造方法
JP2021082767A (ja) 2019-11-21 2021-05-27 リンテック株式会社 キット、及び、そのキットを用いる第三積層体の製造方法
JP2021082768A (ja) 2019-11-21 2021-05-27 リンテック株式会社 キット、及び、そのキットを用いる第三積層体の製造方法
US20210197536A1 (en) * 2019-12-30 2021-07-01 Saint-Gobain Performance Plastics Corporation Multilayer protective film
TW202204150A (zh) * 2020-03-27 2022-02-01 日商琳得科股份有限公司 半導體裝置製造用片、半導體裝置製造用片的製造方法、以及具膜狀接著劑之半導體晶片的製造方法
CN114507486B (zh) * 2020-11-16 2024-02-20 象山激智新材料有限公司 一种耐高温保护膜及其制备方法
JP2022092286A (ja) 2020-12-10 2022-06-22 リンテック株式会社 保護膜付きワークの製造方法及び保護膜形成フィルム付きワークの製造方法
EP4310157A1 (en) * 2021-03-31 2024-01-24 Nissan Chemical Corporation Laminate, release agent composition, and method for manufacturing machined semiconductor substrate
JP2023102570A (ja) * 2022-01-12 2023-07-25 株式会社レゾナック 個片化体形成用積層フィルム及びその製造方法、並びに半導体装置の製造方法

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JP2011151362A (ja) 2009-12-24 2011-08-04 Nitto Denko Corp ダイシングテープ一体型半導体裏面用フィルム
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JP5681374B2 (ja) 2010-04-19 2015-03-04 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム
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JP2012033637A (ja) 2010-07-29 2012-02-16 Nitto Denko Corp ダイシングテープ一体型半導体裏面用フィルム及び半導体装置の製造方法
JP5744434B2 (ja) * 2010-07-29 2015-07-08 日東電工株式会社 加熱剥離シート一体型半導体裏面用フィルム、半導体素子の回収方法、及び半導体装置の製造方法
JP4904432B1 (ja) 2011-03-01 2012-03-28 古河電気工業株式会社 ウエハ加工用テープ
JP5727835B2 (ja) 2011-03-30 2015-06-03 リンテック株式会社 保護膜形成用フィルム、保護膜形成用シートおよび半導体チップの製造方法
JP2013021270A (ja) * 2011-07-14 2013-01-31 Nitto Denko Corp 半導体装置製造用フィルム

Also Published As

Publication number Publication date
JPWO2014157426A1 (ja) 2017-02-16
TWI542659B (zh) 2016-07-21
CN105074878B (zh) 2017-08-04
KR101570959B1 (ko) 2015-11-20
US10030174B2 (en) 2018-07-24
US20160046840A1 (en) 2016-02-18
WO2014157426A1 (ja) 2014-10-02
EP2980835A1 (en) 2016-02-03
EP2980835A4 (en) 2016-11-16
CN105074878A (zh) 2015-11-18
PT2980835T (pt) 2021-01-27
TW201444945A (zh) 2014-12-01
KR20150119899A (ko) 2015-10-26
EP2980835B1 (en) 2020-12-02
JP5774799B2 (ja) 2015-09-09

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