SG11201408151XA - Electric contact and socket for electric parts - Google Patents
Electric contact and socket for electric partsInfo
- Publication number
- SG11201408151XA SG11201408151XA SG11201408151XA SG11201408151XA SG11201408151XA SG 11201408151X A SG11201408151X A SG 11201408151XA SG 11201408151X A SG11201408151X A SG 11201408151XA SG 11201408151X A SG11201408151X A SG 11201408151XA SG 11201408151X A SG11201408151X A SG 11201408151XA
- Authority
- SG
- Singapore
- Prior art keywords
- lllll
- layer
- llll
- electrical
- socket
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/04—Alloys based on a platinum group metal
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12875—Platinum group metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12896—Ag-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12944—Ni-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Measuring Leads Or Probes (AREA)
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Error Detection And Correction (AREA)
- Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
- Compression Or Coding Systems Of Tv Signals (AREA)
- Contacts (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012128666 | 2012-06-06 | ||
PCT/JP2013/064708 WO2013183484A1 (ja) | 2012-06-06 | 2013-05-28 | 電気接触子及び電気部品用ソケット |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201408151XA true SG11201408151XA (en) | 2015-01-29 |
Family
ID=49711877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201408151XA SG11201408151XA (en) | 2012-06-06 | 2013-05-28 | Electric contact and socket for electric parts |
Country Status (9)
Country | Link |
---|---|
US (1) | US10096923B2 (zh) |
EP (1) | EP2860533B1 (zh) |
JP (2) | JP6502667B2 (zh) |
CN (1) | CN104364660B (zh) |
MY (1) | MY176738A (zh) |
PH (1) | PH12014502715B1 (zh) |
SG (1) | SG11201408151XA (zh) |
TW (1) | TWI590533B (zh) |
WO (1) | WO2013183484A1 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014182976A (ja) * | 2013-03-21 | 2014-09-29 | Enplas Corp | 電気接触子及び電気部品用ソケット |
JP6330689B2 (ja) * | 2015-02-19 | 2018-05-30 | 株式会社オートネットワーク技術研究所 | 電気接点対およびコネクタ用端子対 |
US9847468B1 (en) * | 2016-06-20 | 2017-12-19 | Asm Technology Singapore Pte Ltd | Plated lead frame including doped silver layer |
JP6733491B2 (ja) * | 2016-10-20 | 2020-07-29 | 株式会社オートネットワーク技術研究所 | 接続端子および接続端子の製造方法 |
JP6881972B2 (ja) * | 2016-12-27 | 2021-06-02 | 株式会社エンプラス | 電気接触子及び電気部品用ソケット |
JP2018107011A (ja) * | 2016-12-27 | 2018-07-05 | 株式会社エンプラス | 電気接触子及び電気部品用ソケット |
CN112510434A (zh) * | 2019-09-16 | 2021-03-16 | 康普技术有限责任公司 | 具有轴向浮动的内接触部的同轴连接器 |
KR102080832B1 (ko) * | 2019-10-02 | 2020-02-24 | 황동원 | 스프링 콘택트 및 스프링 콘택트 내장형 테스트 소켓 |
JP6892621B1 (ja) * | 2020-09-10 | 2021-06-23 | 千住金属工業株式会社 | 核材料、電子部品及びバンプ電極の形成方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5568849A (en) * | 1978-11-17 | 1980-05-23 | Matsushita Electric Ind Co Ltd | Commutator of small dc motor |
US4529667A (en) * | 1983-04-06 | 1985-07-16 | The Furukawa Electric Company, Ltd. | Silver-coated electric composite materials |
US5139891A (en) * | 1991-07-01 | 1992-08-18 | Olin Corporation | Palladium alloys having utility in electrical applications |
JPH0555656A (ja) * | 1991-08-29 | 1993-03-05 | Toyota Motor Corp | 圧電素子の電極構造 |
JP2895793B2 (ja) * | 1995-02-24 | 1999-05-24 | マブチモーター株式会社 | 摺動接点材料及びクラッド複合材ならびにそれらからなるコンミテータ及びそのコンミテータを使用した直流小型モータ |
US5849424A (en) * | 1996-05-15 | 1998-12-15 | Dowa Mining Co., Ltd. | Hard coated copper alloys, process for production thereof and connector terminals made therefrom |
ES2171088T3 (es) * | 1998-06-10 | 2002-08-16 | Heraeus Gmbh W C | Procedimiento para producir un sustrato exento de plomo. |
US6150041A (en) * | 1999-06-25 | 2000-11-21 | Delphi Technologies, Inc. | Thick-film circuits and metallization process |
JP3880877B2 (ja) * | 2002-03-29 | 2007-02-14 | Dowaホールディングス株式会社 | めっきを施した銅または銅合金およびその製造方法 |
CN100486046C (zh) * | 2005-04-20 | 2009-05-06 | 爱斯佩克株式会社 | Ic插座 |
JP4632358B2 (ja) * | 2005-06-08 | 2011-02-16 | 三菱マテリアル株式会社 | チップ型ヒューズ |
JP4653586B2 (ja) | 2005-07-29 | 2011-03-16 | 株式会社東芝 | 電子機器 |
USRE45924E1 (en) * | 2005-09-22 | 2016-03-15 | Enplas Corporation | Electric contact and socket for electrical part |
JP2007271472A (ja) * | 2006-03-31 | 2007-10-18 | Kanai Hiroaki | 異種金属接合型プローブピンとその製造方法 |
JP2008078032A (ja) * | 2006-09-22 | 2008-04-03 | Alps Electric Co Ltd | 接続装置 |
JP4834023B2 (ja) * | 2007-03-27 | 2011-12-07 | 古河電気工業株式会社 | 可動接点部品用銀被覆材およびその製造方法 |
JP4834022B2 (ja) | 2007-03-27 | 2011-12-07 | 古河電気工業株式会社 | 可動接点部品用銀被覆材およびその製造方法 |
JP2009122087A (ja) * | 2007-10-25 | 2009-06-04 | Micronics Japan Co Ltd | プローブカード及びプローブシステム並びに電子デバイスの位置合わせ方法 |
US20090246911A1 (en) * | 2008-03-27 | 2009-10-01 | Ibiden, Co., Ltd. | Substrate for mounting electronic components and its method of manufacture |
JP4808794B2 (ja) * | 2008-03-28 | 2011-11-02 | パナソニック株式会社 | 半導体検査装置 |
JP5657881B2 (ja) * | 2009-12-09 | 2015-01-21 | 株式会社徳力本店 | プローブピン用材料 |
JP5036892B2 (ja) * | 2010-05-10 | 2012-09-26 | 株式会社神戸製鋼所 | コンタクトプローブ |
-
2013
- 2013-05-28 MY MYPI2014703636A patent/MY176738A/en unknown
- 2013-05-28 CN CN201380029941.1A patent/CN104364660B/zh active Active
- 2013-05-28 US US14/405,974 patent/US10096923B2/en active Active
- 2013-05-28 JP JP2014519931A patent/JP6502667B2/ja active Active
- 2013-05-28 SG SG11201408151XA patent/SG11201408151XA/en unknown
- 2013-05-28 EP EP13801082.2A patent/EP2860533B1/en active Active
- 2013-05-28 WO PCT/JP2013/064708 patent/WO2013183484A1/ja active Application Filing
- 2013-05-31 TW TW102119291A patent/TWI590533B/zh active
-
2014
- 2014-12-04 PH PH12014502715A patent/PH12014502715B1/en unknown
-
2018
- 2018-04-09 JP JP2018074933A patent/JP2018112561A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP2860533B1 (en) | 2020-12-02 |
JP2018112561A (ja) | 2018-07-19 |
TWI590533B (zh) | 2017-07-01 |
EP2860533A4 (en) | 2016-05-25 |
PH12014502715A1 (en) | 2015-02-02 |
CN104364660B (zh) | 2018-09-21 |
MY176738A (en) | 2020-08-20 |
JP6502667B2 (ja) | 2019-04-17 |
US20150126081A1 (en) | 2015-05-07 |
JPWO2013183484A1 (ja) | 2016-01-28 |
WO2013183484A1 (ja) | 2013-12-12 |
EP2860533A1 (en) | 2015-04-15 |
US10096923B2 (en) | 2018-10-09 |
PH12014502715B1 (en) | 2015-02-02 |
CN104364660A (zh) | 2015-02-18 |
TW201409852A (zh) | 2014-03-01 |
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