SG11201407839PA - Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer - Google Patents

Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer

Info

Publication number
SG11201407839PA
SG11201407839PA SG11201407839PA SG11201407839PA SG11201407839PA SG 11201407839P A SG11201407839P A SG 11201407839PA SG 11201407839P A SG11201407839P A SG 11201407839PA SG 11201407839P A SG11201407839P A SG 11201407839PA SG 11201407839P A SG11201407839P A SG 11201407839PA
Authority
SG
Singapore
Prior art keywords
polishing
oregon
layer
international
aperture
Prior art date
Application number
SG11201407839PA
Other languages
English (en)
Inventor
Paul Andre Lefevre
William C Allison
James P Lacasse
Diane Scott
Alexander William Simpson
Ping Huang
Leslie M Charns
Original Assignee
Nexplanar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nexplanar Corp filed Critical Nexplanar Corp
Publication of SG11201407839PA publication Critical patent/SG11201407839PA/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B24D11/003—Manufacture of flexible abrasive materials without embedded abrasive particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/009—Tools not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
SG11201407839PA 2012-06-04 2013-05-29 Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer SG11201407839PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/488,149 US9597769B2 (en) 2012-06-04 2012-06-04 Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
PCT/US2013/043126 WO2013184465A1 (en) 2012-06-04 2013-05-29 Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer

Publications (1)

Publication Number Publication Date
SG11201407839PA true SG11201407839PA (en) 2014-12-30

Family

ID=48607367

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201407839PA SG11201407839PA (en) 2012-06-04 2013-05-29 Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
SG10201602018WA SG10201602018WA (en) 2012-06-04 2013-05-29 Polishing Pad With Polishing Surface Layer Having An Aperture Or OpeningAbove A Transparent Foundation Layer

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201602018WA SG10201602018WA (en) 2012-06-04 2013-05-29 Polishing Pad With Polishing Surface Layer Having An Aperture Or OpeningAbove A Transparent Foundation Layer

Country Status (8)

Country Link
US (1) US9597769B2 (https=)
EP (1) EP2872291B1 (https=)
JP (2) JP5908169B2 (https=)
KR (3) KR101729610B1 (https=)
CN (1) CN104520068B (https=)
SG (2) SG11201407839PA (https=)
TW (2) TWI554364B (https=)
WO (1) WO2013184465A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109333386A (zh) * 2018-11-07 2019-02-15 智慧双创(深圳)科技有限公司 一种自锐性金刚石砂轮及其制备工艺

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US20140370788A1 (en) * 2013-06-13 2014-12-18 Cabot Microelectronics Corporation Low surface roughness polishing pad
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US10946495B2 (en) * 2015-01-30 2021-03-16 Cmc Materials, Inc. Low density polishing pad
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CN106926116B (zh) * 2017-01-23 2018-07-13 安徽禾臣新材料有限公司 Stn玻璃抛光用吸附垫
KR101945869B1 (ko) * 2017-08-07 2019-02-11 에스케이씨 주식회사 우수한 기밀성을 갖는 연마패드
US11331767B2 (en) * 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
KR102248338B1 (ko) * 2019-10-01 2021-05-06 (주)앰스코 연마 대상물의 요철부에 삽입 가능한 연마부재
JP7348860B2 (ja) * 2020-02-26 2023-09-21 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
CN112720282B (zh) * 2020-12-31 2022-04-08 湖北鼎汇微电子材料有限公司 一种抛光垫
KR102488101B1 (ko) * 2021-05-04 2023-01-12 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
JP7441916B2 (ja) 2021-10-12 2024-03-01 エスケー エンパルス カンパニー リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
USD1022364S1 (en) 2022-06-03 2024-04-09 Entegris, Inc. Polyvinyl alcohol pad
EP4533529A1 (en) * 2022-06-03 2025-04-09 Entegris, Inc. Devices for cleaning substrates and related methods
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109333386A (zh) * 2018-11-07 2019-02-15 智慧双创(深圳)科技有限公司 一种自锐性金刚石砂轮及其制备工艺

Also Published As

Publication number Publication date
US20130324020A1 (en) 2013-12-05
SG10201602018WA (en) 2016-04-28
TWI554364B (zh) 2016-10-21
EP2872291B1 (en) 2017-08-09
JP2016074086A (ja) 2016-05-12
JP2015517926A (ja) 2015-06-25
TW201404532A (zh) 2014-02-01
CN104520068A (zh) 2015-04-15
JP6209628B2 (ja) 2017-10-04
KR20160068977A (ko) 2016-06-15
JP5908169B2 (ja) 2016-04-26
TW201625381A (zh) 2016-07-16
WO2013184465A1 (en) 2013-12-12
TWI634968B (zh) 2018-09-11
KR20160036083A (ko) 2016-04-01
KR101729610B1 (ko) 2017-04-24
KR20150021540A (ko) 2015-03-02
EP2872291A1 (en) 2015-05-20
KR101700863B1 (ko) 2017-01-31
US9597769B2 (en) 2017-03-21
KR101655432B1 (ko) 2016-09-07
CN104520068B (zh) 2018-02-02

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