KR101729610B1 - 투명한 기초 레이어 위에 구멍 또는 개구를 가지고 있는 폴리싱면 레이어를 가진 폴리싱 패드 - Google Patents

투명한 기초 레이어 위에 구멍 또는 개구를 가지고 있는 폴리싱면 레이어를 가진 폴리싱 패드 Download PDF

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Publication number
KR101729610B1
KR101729610B1 KR1020167014345A KR20167014345A KR101729610B1 KR 101729610 B1 KR101729610 B1 KR 101729610B1 KR 1020167014345 A KR1020167014345 A KR 1020167014345A KR 20167014345 A KR20167014345 A KR 20167014345A KR 101729610 B1 KR101729610 B1 KR 101729610B1
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South Korea
Prior art keywords
polishing
base layer
surface layer
layer
polishing surface
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Korean (ko)
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KR20160068977A (ko
Inventor
폴 안드레 레페브레
윌리엄 씨 앨리슨
제임스 피 라카세
다이안 스코트
알렉산더 윌리엄 심슨
핑 후앙
레즐리 엠 샤른스
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넥스플래너 코퍼레이션
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Assigned to 캐보트 마이크로일렉트로닉스 코포레이션 reassignment 캐보트 마이크로일렉트로닉스 코포레이션 권리의 전부이전등록 Assignors: 넥스플래너 코퍼레이션
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H01L21/304—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B24D11/003—Manufacture of flexible abrasive materials without embedded abrasive particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/009—Tools not otherwise provided for

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
KR1020167014345A 2012-06-04 2013-05-29 투명한 기초 레이어 위에 구멍 또는 개구를 가지고 있는 폴리싱면 레이어를 가진 폴리싱 패드 Active KR101729610B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/488,149 2012-06-04
US13/488,149 US9597769B2 (en) 2012-06-04 2012-06-04 Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
PCT/US2013/043126 WO2013184465A1 (en) 2012-06-04 2013-05-29 Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020147036283A Division KR101655432B1 (ko) 2012-06-04 2013-05-29 투명한 기초 레이어 위에 구멍 또는 개구를 가지고 있는 폴리싱면 레이어를 가진 폴리싱 패드

Publications (2)

Publication Number Publication Date
KR20160068977A KR20160068977A (ko) 2016-06-15
KR101729610B1 true KR101729610B1 (ko) 2017-04-24

Family

ID=48607367

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020167014345A Active KR101729610B1 (ko) 2012-06-04 2013-05-29 투명한 기초 레이어 위에 구멍 또는 개구를 가지고 있는 폴리싱면 레이어를 가진 폴리싱 패드
KR1020147036283A Active KR101655432B1 (ko) 2012-06-04 2013-05-29 투명한 기초 레이어 위에 구멍 또는 개구를 가지고 있는 폴리싱면 레이어를 가진 폴리싱 패드
KR1020167007025A Active KR101700863B1 (ko) 2012-06-04 2013-05-29 투명한 기초 레이어 위에 구멍 또는 개구를 가지고 있는 폴리싱면 레이어를 가진 폴리싱 패드

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020147036283A Active KR101655432B1 (ko) 2012-06-04 2013-05-29 투명한 기초 레이어 위에 구멍 또는 개구를 가지고 있는 폴리싱면 레이어를 가진 폴리싱 패드
KR1020167007025A Active KR101700863B1 (ko) 2012-06-04 2013-05-29 투명한 기초 레이어 위에 구멍 또는 개구를 가지고 있는 폴리싱면 레이어를 가진 폴리싱 패드

Country Status (8)

Country Link
US (1) US9597769B2 (https=)
EP (1) EP2872291B1 (https=)
JP (2) JP5908169B2 (https=)
KR (3) KR101729610B1 (https=)
CN (1) CN104520068B (https=)
SG (2) SG11201407839PA (https=)
TW (2) TWI554364B (https=)
WO (1) WO2013184465A1 (https=)

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KR101945869B1 (ko) * 2017-08-07 2019-02-11 에스케이씨 주식회사 우수한 기밀성을 갖는 연마패드
CN109333386A (zh) * 2018-11-07 2019-02-15 智慧双创(深圳)科技有限公司 一种自锐性金刚石砂轮及其制备工艺
US11331767B2 (en) * 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
KR102248338B1 (ko) * 2019-10-01 2021-05-06 (주)앰스코 연마 대상물의 요철부에 삽입 가능한 연마부재
JP7348860B2 (ja) * 2020-02-26 2023-09-21 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
CN112720282B (zh) * 2020-12-31 2022-04-08 湖北鼎汇微电子材料有限公司 一种抛光垫
KR102488101B1 (ko) * 2021-05-04 2023-01-12 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
JP7441916B2 (ja) 2021-10-12 2024-03-01 エスケー エンパルス カンパニー リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
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JP2008546167A (ja) * 2005-02-18 2008-12-18 ネオパッド テクノロジーズ コーポレイション Ｃｍｐ用のカスタマイズされた研磨パッド、ならびにその製造方法および使用

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JP2016074086A (ja) 2016-05-12
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JP6209628B2 (ja) 2017-10-04
KR20160068977A (ko) 2016-06-15
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