TWI554364B - 包含具有透明基準層上的隙縫或開孔之拋光表面層之拋光墊 - Google Patents

包含具有透明基準層上的隙縫或開孔之拋光表面層之拋光墊 Download PDF

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Publication number
TWI554364B
TWI554364B TW102119630A TW102119630A TWI554364B TW I554364 B TWI554364 B TW I554364B TW 102119630 A TW102119630 A TW 102119630A TW 102119630 A TW102119630 A TW 102119630A TW I554364 B TWI554364 B TW I554364B
Authority
TW
Taiwan
Prior art keywords
polishing
layer
reference layer
polishing pad
surface layer
Prior art date
Application number
TW102119630A
Other languages
English (en)
Chinese (zh)
Other versions
TW201404532A (zh
Inventor
保羅 安德烈 里伏瑞
威廉Ｃ 亞歷森
詹姆士Ｐ 拉凱斯
黛安 史考特
亞力山卓 威廉 辛普森
黃平
雷斯利Ｍ 查恩斯
Original Assignee
奈平科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 奈平科技股份有限公司 filed Critical 奈平科技股份有限公司
Publication of TW201404532A publication Critical patent/TW201404532A/zh
Application granted granted Critical
Publication of TWI554364B publication Critical patent/TWI554364B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B24D11/003—Manufacture of flexible abrasive materials without embedded abrasive particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/009—Tools not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW102119630A 2012-06-04 2013-06-03 包含具有透明基準層上的隙縫或開孔之拋光表面層之拋光墊 TWI554364B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/488,149 US9597769B2 (en) 2012-06-04 2012-06-04 Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer

Publications (2)

Publication Number Publication Date
TW201404532A TW201404532A (zh) 2014-02-01
TWI554364B true TWI554364B (zh) 2016-10-21

Family

ID=48607367

Family Applications (2)

Application Number Title Priority Date Filing Date
TW102119630A TWI554364B (zh) 2012-06-04 2013-06-03 包含具有透明基準層上的隙縫或開孔之拋光表面層之拋光墊
TW105111129A TWI634968B (zh) 2012-06-04 2013-06-03 包含具有透明基準層上的隙縫或開孔之拋光表面層之拋光墊

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW105111129A TWI634968B (zh) 2012-06-04 2013-06-03 包含具有透明基準層上的隙縫或開孔之拋光表面層之拋光墊

Country Status (8)

Country Link
US (1) US9597769B2 (https=)
EP (1) EP2872291B1 (https=)
JP (2) JP5908169B2 (https=)
KR (3) KR101729610B1 (https=)
CN (1) CN104520068B (https=)
SG (2) SG11201407839PA (https=)
TW (2) TWI554364B (https=)
WO (1) WO2013184465A1 (https=)

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US20140370788A1 (en) * 2013-06-13 2014-12-18 Cabot Microelectronics Corporation Low surface roughness polishing pad
SG11201608134YA (en) 2014-04-03 2016-10-28 3M Innovative Properties Co Polishing pads and systems and methods of making and using the same
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JP6354432B2 (ja) * 2014-08-04 2018-07-11 日本電気硝子株式会社 研磨パッド
US10086500B2 (en) * 2014-12-18 2018-10-02 Applied Materials, Inc. Method of manufacturing a UV curable CMP polishing pad
US10946495B2 (en) * 2015-01-30 2021-03-16 Cmc Materials, Inc. Low density polishing pad
TWI549781B (zh) * 2015-08-07 2016-09-21 智勝科技股份有限公司 研磨墊、研磨系統及研磨方法
US9868185B2 (en) 2015-11-03 2018-01-16 Cabot Microelectronics Corporation Polishing pad with foundation layer and window attached thereto
US10864612B2 (en) * 2016-12-14 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad and method of using
EP3571009A4 (en) * 2017-01-20 2021-01-20 Applied Materials, Inc. THIN PLASTIC POLISHING ITEM FOR CMP APPLICATIONS
CN106926116B (zh) * 2017-01-23 2018-07-13 安徽禾臣新材料有限公司 Stn玻璃抛光用吸附垫
KR101945869B1 (ko) * 2017-08-07 2019-02-11 에스케이씨 주식회사 우수한 기밀성을 갖는 연마패드
CN109333386A (zh) * 2018-11-07 2019-02-15 智慧双创(深圳)科技有限公司 一种自锐性金刚石砂轮及其制备工艺
US11331767B2 (en) * 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
KR102248338B1 (ko) * 2019-10-01 2021-05-06 (주)앰스코 연마 대상물의 요철부에 삽입 가능한 연마부재
JP7348860B2 (ja) * 2020-02-26 2023-09-21 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
CN112720282B (zh) * 2020-12-31 2022-04-08 湖北鼎汇微电子材料有限公司 一种抛光垫
KR102488101B1 (ko) * 2021-05-04 2023-01-12 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
JP7441916B2 (ja) 2021-10-12 2024-03-01 エスケー エンパルス カンパニー リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
USD1022364S1 (en) 2022-06-03 2024-04-09 Entegris, Inc. Polyvinyl alcohol pad
EP4533529A1 (en) * 2022-06-03 2025-04-09 Entegris, Inc. Devices for cleaning substrates and related methods
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Also Published As

Publication number Publication date
US20130324020A1 (en) 2013-12-05
SG10201602018WA (en) 2016-04-28
EP2872291B1 (en) 2017-08-09
JP2016074086A (ja) 2016-05-12
JP2015517926A (ja) 2015-06-25
TW201404532A (zh) 2014-02-01
CN104520068A (zh) 2015-04-15
JP6209628B2 (ja) 2017-10-04
KR20160068977A (ko) 2016-06-15
SG11201407839PA (en) 2014-12-30
JP5908169B2 (ja) 2016-04-26
TW201625381A (zh) 2016-07-16
WO2013184465A1 (en) 2013-12-12
TWI634968B (zh) 2018-09-11
KR20160036083A (ko) 2016-04-01
KR101729610B1 (ko) 2017-04-24
KR20150021540A (ko) 2015-03-02
EP2872291A1 (en) 2015-05-20
KR101700863B1 (ko) 2017-01-31
US9597769B2 (en) 2017-03-21
KR101655432B1 (ko) 2016-09-07
CN104520068B (zh) 2018-02-02

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