JP5908169B2 - 透明下地層の上方に開口部または開放部を有する研磨表面層を伴う研磨パッド - Google Patents

透明下地層の上方に開口部または開放部を有する研磨表面層を伴う研磨パッド Download PDF

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Publication number
JP5908169B2
JP5908169B2 JP2015515155A JP2015515155A JP5908169B2 JP 5908169 B2 JP5908169 B2 JP 5908169B2 JP 2015515155 A JP2015515155 A JP 2015515155A JP 2015515155 A JP2015515155 A JP 2015515155A JP 5908169 B2 JP5908169 B2 JP 5908169B2
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Japan
Prior art keywords
polishing
surface layer
polishing pad
underlayer
layer
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JP2015515155A
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English (en)
Japanese (ja)
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JP2015517926A (ja
Inventor
ポール アンドレ レフィーバー，
ポール アンドレ レフィーバー，
ウィリアム シー． アリソン，
ウィリアム シー． アリソン，
ジェイムズ ピー． ラカッセ，
ジェイムズ ピー． ラカッセ，
ダイアン スコット，
ダイアン スコット，
アレクサンダー ウィリアム シンプソン，
アレクサンダー ウィリアム シンプソン，
ピン フアン，
ピン フアン，
レスリー エム． チャーンズ，
レスリー エム． チャーンズ，
Original Assignee
ネクスプラナー コーポレイション
ネクスプラナー コーポレイション
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Publication of JP2015517926A publication Critical patent/JP2015517926A/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B24D11/003—Manufacture of flexible abrasive materials without embedded abrasive particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/009—Tools not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
JP2015515155A 2012-06-04 2013-05-29 透明下地層の上方に開口部または開放部を有する研磨表面層を伴う研磨パッド Active JP5908169B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/488,149 2012-06-04
US13/488,149 US9597769B2 (en) 2012-06-04 2012-06-04 Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
PCT/US2013/043126 WO2013184465A1 (en) 2012-06-04 2013-05-29 Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016014125A Division JP6209628B2 (ja) 2012-06-04 2016-01-28 透明下地層の上方に開口部または開放部を有する研磨表面層を伴う研磨パッド

Publications (2)

Publication Number Publication Date
JP2015517926A JP2015517926A (ja) 2015-06-25
JP5908169B2 true JP5908169B2 (ja) 2016-04-26

Family

ID=48607367

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015515155A Active JP5908169B2 (ja) 2012-06-04 2013-05-29 透明下地層の上方に開口部または開放部を有する研磨表面層を伴う研磨パッド
JP2016014125A Active JP6209628B2 (ja) 2012-06-04 2016-01-28 透明下地層の上方に開口部または開放部を有する研磨表面層を伴う研磨パッド

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2016014125A Active JP6209628B2 (ja) 2012-06-04 2016-01-28 透明下地層の上方に開口部または開放部を有する研磨表面層を伴う研磨パッド

Country Status (8)

Country Link
US (1) US9597769B2 (https=)
EP (1) EP2872291B1 (https=)
JP (2) JP5908169B2 (https=)
KR (3) KR101729610B1 (https=)
CN (1) CN104520068B (https=)
SG (2) SG11201407839PA (https=)
TW (2) TWI554364B (https=)
WO (1) WO2013184465A1 (https=)

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CN112720282B (zh) * 2020-12-31 2022-04-08 湖北鼎汇微电子材料有限公司 一种抛光垫
KR102488101B1 (ko) * 2021-05-04 2023-01-12 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
JP7441916B2 (ja) 2021-10-12 2024-03-01 エスケー エンパルス カンパニー リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
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Also Published As

Publication number Publication date
US20130324020A1 (en) 2013-12-05
SG10201602018WA (en) 2016-04-28
TWI554364B (zh) 2016-10-21
EP2872291B1 (en) 2017-08-09
JP2016074086A (ja) 2016-05-12
JP2015517926A (ja) 2015-06-25
TW201404532A (zh) 2014-02-01
CN104520068A (zh) 2015-04-15
JP6209628B2 (ja) 2017-10-04
KR20160068977A (ko) 2016-06-15
SG11201407839PA (en) 2014-12-30
TW201625381A (zh) 2016-07-16
WO2013184465A1 (en) 2013-12-12
TWI634968B (zh) 2018-09-11
KR20160036083A (ko) 2016-04-01
KR101729610B1 (ko) 2017-04-24
KR20150021540A (ko) 2015-03-02
EP2872291A1 (en) 2015-05-20
KR101700863B1 (ko) 2017-01-31
US9597769B2 (en) 2017-03-21
KR101655432B1 (ko) 2016-09-07
CN104520068B (zh) 2018-02-02

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