SG11201403191PA - Abrasive material regeneration method and regenerated abrasive material - Google Patents

Abrasive material regeneration method and regenerated abrasive material

Info

Publication number
SG11201403191PA
SG11201403191PA SG11201403191PA SG11201403191PA SG11201403191PA SG 11201403191P A SG11201403191P A SG 11201403191PA SG 11201403191P A SG11201403191P A SG 11201403191PA SG 11201403191P A SG11201403191P A SG 11201403191PA SG 11201403191P A SG11201403191P A SG 11201403191PA
Authority
SG
Singapore
Prior art keywords
abrasive material
regeneration method
regenerated
material regeneration
regenerated abrasive
Prior art date
Application number
SG11201403191PA
Other languages
English (en)
Inventor
Atsushi Takahashi
Yuuki Nagai
Akihiro Maezawa
Original Assignee
Konica Minolta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Inc filed Critical Konica Minolta Inc
Publication of SG11201403191PA publication Critical patent/SG11201403191PA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/52—Treatment of water, waste water, or sewage by flocculation or precipitation of suspended impurities
    • C02F1/5236—Treatment of water, waste water, or sewage by flocculation or precipitation of suspended impurities using inorganic agents
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/66—Treatment of water, waste water, or sewage by neutralisation; pH adjustment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K23/00—Use of substances as emulsifying, wetting, dispersing, or foam-producing agents
    • C09K23/002—Inorganic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2101/00—Nature of the contaminant
    • C02F2101/10—Inorganic compounds
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/12—Nature of the water, waste water, sewage or sludge to be treated from the silicate or ceramic industries, e.g. waste waters from cement or glass factories
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/34—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32
    • C02F2103/346—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32 from semiconductor processing, e.g. waste water from polishing of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Water Supply & Treatment (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Hydrology & Water Resources (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Treatment Of Sludge (AREA)
  • Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)
  • Mixers With Rotating Receptacles And Mixers With Vibration Mechanisms (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201403191PA 2011-12-22 2012-12-05 Abrasive material regeneration method and regenerated abrasive material SG11201403191PA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011282037 2011-12-22
JP2011282041 2011-12-22
PCT/JP2012/081463 WO2013094399A1 (ja) 2011-12-22 2012-12-05 研磨材再生方法及び再生研磨材

Publications (1)

Publication Number Publication Date
SG11201403191PA true SG11201403191PA (en) 2014-08-28

Family

ID=48668298

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201403191PA SG11201403191PA (en) 2011-12-22 2012-12-05 Abrasive material regeneration method and regenerated abrasive material

Country Status (9)

Country Link
US (1) US9796894B2 (zh)
EP (1) EP2796243B1 (zh)
JP (1) JP5858050B2 (zh)
KR (1) KR20140102697A (zh)
CN (1) CN104010770B (zh)
MY (1) MY177685A (zh)
PH (1) PH12014501375B1 (zh)
SG (1) SG11201403191PA (zh)
WO (1) WO2013094399A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013132713A (ja) * 2011-12-26 2013-07-08 Tosoh Corp 循環再使用研磨剤スラリー中からの異物分離除去方法と異物分離除去装置
US10017675B2 (en) * 2011-12-27 2018-07-10 Konica Minolta, Inc. Method for separating polishing material and regenerated polishing material
SG11201404446VA (en) * 2012-02-16 2014-11-27 Konica Minolta Inc Abrasive regeneration method
EP2815846B1 (en) * 2012-02-17 2018-09-26 Konica Minolta, Inc. Abrasive regeneration method
JP6372059B2 (ja) * 2013-08-08 2018-08-15 コニカミノルタ株式会社 セリウム砥粒の回収方法
JP6172030B2 (ja) * 2014-04-03 2017-08-02 信越半導体株式会社 ワークの切断方法及び加工液
DE102014015549A1 (de) * 2014-10-22 2016-04-28 Thyssenkrupp Ag Mahlanlage zum Zerkleinern von Mahlgut sowie Verfahren zum Zerkleinern von Mahlgut
JP6233296B2 (ja) * 2014-12-26 2017-11-22 株式会社Sumco 砥粒の評価方法、および、シリコンウェーハの製造方法
WO2017098986A1 (ja) * 2015-12-09 2017-06-15 コニカミノルタ株式会社 研磨材スラリーの再生方法
CN107652898A (zh) * 2017-08-31 2018-02-02 安徽青花坊瓷业股份有限公司 一种日用陶瓷餐具振动抛光用研磨材料
KR102670426B1 (ko) * 2020-01-15 2024-06-03 오씨아이 주식회사 흄드 실리카로부터 단일 응집체를 분리 및 포집하는 방법 및 단일 응집체의 형상 분류 방법
JP2022172678A (ja) * 2021-05-06 2022-11-17 コニカミノルタ株式会社 再生研磨剤スラリーの調製方法及び研磨剤スラリー
CN113304664B (zh) * 2021-05-31 2023-09-05 广州兰德环保资源科技有限公司 一种通过高频超声波作用和层流沉降优化的乳化装置
US11938586B2 (en) * 2021-08-27 2024-03-26 Taiwan Semiconductor Manufacturing Company Ltd. Slurry monitoring device, CMP system and method of in-line monitoring a slurry
CN115282692B (zh) * 2022-07-19 2024-03-08 江阴萃科智能制造技术有限公司 一种磨抛设备研磨液过滤循环方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1997114A (en) * 1930-09-29 1935-04-09 Martin Michael James Filtration and clarification of water
US2816824A (en) * 1953-12-28 1957-12-17 Corning Glass Works Cerium oxide polishing composition
US4419246A (en) * 1982-09-30 1983-12-06 E. I. Du Pont De Nemours & Co. Removal of heavy metal ions
JPH06254764A (ja) 1993-03-03 1994-09-13 Asahi Glass Co Ltd 研磨液の再生方法
US5593339A (en) * 1993-08-12 1997-01-14 Church & Dwight Co., Inc. Slurry cleaning process
JP3249373B2 (ja) * 1996-02-21 2002-01-21 信越半導体株式会社 水溶性スラリー廃液の再利用システム
US5664990A (en) 1996-07-29 1997-09-09 Integrated Process Equipment Corp. Slurry recycling in CMP apparatus
CA2263241C (en) * 1996-09-30 2004-11-16 Masato Yoshida Cerium oxide abrasive and method of abrading substrates
JPH1110540A (ja) * 1997-06-23 1999-01-19 Speedfam Co Ltd Ｃｍｐ装置のスラリリサイクルシステム及びその方法
JPH1150168A (ja) 1997-07-31 1999-02-23 Canon Inc 光学ガラス汚泥からレアアースメタル成分を回収する方法
JP3134189B2 (ja) 1997-09-18 2001-02-13 福島県 研磨材の回収方法
JP3426149B2 (ja) * 1998-12-25 2003-07-14 富士通株式会社 半導体製造における研磨廃液再利用方法及び再利用装置
JP2002534564A (ja) * 1999-01-15 2002-10-15 ナルコ ケミカル カンパニー 半導体廃水から金属イオンを沈殿させ、同時にマイクロフィルターの運転を向上させる組成物および方法
JP4168520B2 (ja) * 1999-03-12 2008-10-22 栗田工業株式会社 Ｃｍｐ排液の処理方法
JP3316484B2 (ja) * 1999-05-27 2002-08-19 三洋電機株式会社 半導体装置の製造方法
US6746309B2 (en) * 1999-05-27 2004-06-08 Sanyo Electric Co., Ltd. Method of fabricating a semiconductor device
DE19960380C2 (de) * 1999-12-14 2002-05-29 Fraunhofer Ges Forschung Verfahren zum Fraktionieren einer Zerspanungssuspension
JP2001308043A (ja) * 2000-04-26 2001-11-02 Hitachi Chem Co Ltd Ｃｍｐ研磨剤及び基板の研磨方法
SG115439A1 (en) 2001-12-28 2005-10-28 Jetsis Int Pte Ltd Method and apparatus for abrasive recycling and waste separation system
JP3557197B2 (ja) * 2002-05-17 2004-08-25 三洋電機株式会社 コロイド溶液の濾過方法
JP2004306210A (ja) * 2003-04-08 2004-11-04 Speedfam Co Ltd ガラス研磨における排出水中の酸化セリウム系研磨剤と水を再利用するための処理方法とその処理装置
WO2005090511A1 (ja) * 2004-03-19 2005-09-29 Tytemn Corporation 研磨用組成物および研磨方法
JP5012026B2 (ja) * 2004-11-08 2012-08-29 旭硝子株式会社 ＣｅＯ２微粒子の製造方法
ITRM20050329A1 (it) 2005-06-24 2006-12-25 Guido Fragiacomo Procedimento per il trattamento di sospensioni abrasive esauste per il recupero delle loro componenti riciclabili e relativo impianto.
JP4729428B2 (ja) 2006-04-07 2011-07-20 Ａｇｃセイミケミカル株式会社 セリウム系研磨剤の再生方法
JP2010167551A (ja) * 2008-12-26 2010-08-05 Nomura Micro Sci Co Ltd 使用済みスラリーの再生方法
JP2010214515A (ja) 2009-03-16 2010-09-30 Fukushima Univ ガラス研磨材の製造方法
US20110070811A1 (en) * 2009-03-25 2011-03-24 Applied Materials, Inc. Point of use recycling system for cmp slurry
JP5511261B2 (ja) 2009-08-19 2014-06-04 宇部マテリアルズ株式会社 分級装置
KR101245276B1 (ko) * 2010-03-12 2013-03-19 주식회사 엘지화학 산화세륨 연마재의 재생 방법
US20140144846A1 (en) * 2012-11-26 2014-05-29 Memc Singapore, Pte. Ltd (Uen200614797D) Methods For The Recycling of Wire-Saw Cutting Fluid

Also Published As

Publication number Publication date
JP5858050B2 (ja) 2016-02-10
JPWO2013094399A1 (ja) 2015-04-27
US9796894B2 (en) 2017-10-24
CN104010770B (zh) 2017-07-21
WO2013094399A1 (ja) 2013-06-27
KR20140102697A (ko) 2014-08-22
EP2796243A4 (en) 2015-09-09
MY177685A (en) 2020-09-23
EP2796243B1 (en) 2017-05-17
US20140331567A1 (en) 2014-11-13
PH12014501375A1 (en) 2014-09-22
PH12014501375B1 (en) 2014-09-22
EP2796243A1 (en) 2014-10-29
CN104010770A (zh) 2014-08-27

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