SG11201404444TA - Abrasive regeneration method - Google Patents

Abrasive regeneration method

Info

Publication number
SG11201404444TA
SG11201404444TA SG11201404444TA SG11201404444TA SG11201404444TA SG 11201404444T A SG11201404444T A SG 11201404444TA SG 11201404444T A SG11201404444T A SG 11201404444TA SG 11201404444T A SG11201404444T A SG 11201404444TA SG 11201404444T A SG11201404444T A SG 11201404444TA
Authority
SG
Singapore
Prior art keywords
regeneration method
abrasive regeneration
abrasive
regeneration
Prior art date
Application number
SG11201404444TA
Inventor
Yuuki Nagai
Akihiro Maezawa
Atsushi Takahashi
Original Assignee
Konica Minolta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Inc filed Critical Konica Minolta Inc
Publication of SG11201404444TA publication Critical patent/SG11201404444TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D21/00—Separation of suspended solid particles from liquids by sedimentation
    • B01D21/02—Settling tanks with single outlets for the separated liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2221/00—Applications of separation devices
    • B01D2221/14—Separation devices for workshops, car or semiconductor industry, e.g. for separating chips and other machining residues
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F11/00—Treatment of sludge; Devices therefor
    • C02F11/12—Treatment of sludge; Devices therefor by de-watering, drying or thickening
    • C02F11/14—Treatment of sludge; Devices therefor by de-watering, drying or thickening with addition of chemical agents
    • C02F11/143—Treatment of sludge; Devices therefor by de-watering, drying or thickening with addition of chemical agents using inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F11/00—Treatment of sludge; Devices therefor
    • C02F11/12—Treatment of sludge; Devices therefor by de-watering, drying or thickening
    • C02F11/14—Treatment of sludge; Devices therefor by de-watering, drying or thickening with addition of chemical agents
    • C02F11/147—Treatment of sludge; Devices therefor by de-watering, drying or thickening with addition of chemical agents using organic substances
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/12—Nature of the water, waste water, sewage or sludge to be treated from the silicate or ceramic industries, e.g. waste waters from cement or glass factories
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201404444TA 2012-02-17 2013-02-14 Abrasive regeneration method SG11201404444TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012032250 2012-02-17
PCT/JP2013/053468 WO2013122123A1 (en) 2012-02-17 2013-02-14 Abrasive regeneration method

Publications (1)

Publication Number Publication Date
SG11201404444TA true SG11201404444TA (en) 2014-10-30

Family

ID=48984232

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201404444TA SG11201404444TA (en) 2012-02-17 2013-02-14 Abrasive regeneration method

Country Status (8)

Country Link
US (1) US9802337B2 (en)
EP (1) EP2815846B1 (en)
JP (1) JP6107668B2 (en)
CN (1) CN104114324B (en)
MY (1) MY175053A (en)
PH (1) PH12014501857B1 (en)
SG (1) SG11201404444TA (en)
WO (1) WO2013122123A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10017675B2 (en) * 2011-12-27 2018-07-10 Konica Minolta, Inc. Method for separating polishing material and regenerated polishing material
WO2017098986A1 (en) * 2015-12-09 2017-06-15 コニカミノルタ株式会社 Method for regenerating abrasive slurry
JP6384001B1 (en) * 2017-05-25 2018-09-05 株式会社三井Ｅ＆Ｓマシナリー Abrasive recovery system in ultrasonic processing equipment
KR102379162B1 (en) * 2017-08-23 2022-03-25 에스케이실트론 주식회사 Wafer Lapping Apparatus And And Recycling Method Using Thereof
WO2019181498A1 (en) * 2018-03-23 2019-09-26 コニカミノルタ株式会社 Polishing agent recycle processing system and polishing agent recovery/regeneration method
US20200047299A1 (en) * 2018-08-07 2020-02-13 Illinois Tool Works Inc. Coolant recapture and recirculation in material removal systems
JP2022172678A (en) * 2021-05-06 2022-11-17 コニカミノルタ株式会社 Method for preparing recycled/regenerated polishing agent slurry and polishing agent slurry
CN115415277B (en) * 2021-05-12 2024-07-23 上海交通大学 Secondary aluminum ash innocent treatment method

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2665737B2 (en) 1986-05-27 1997-10-22 宇部興産株式会社 Production method of fine particle inorganic filler dispersion
JPH06254764A (en) 1993-03-03 1994-09-13 Asahi Glass Co Ltd Regenerating method for polishing liquid
US5772900A (en) * 1994-06-22 1998-06-30 Noritake Co., Limited Method and apparatus for reclaiming used working fluid
US5827114A (en) * 1996-09-25 1998-10-27 Church & Dwight Co., Inc. Slurry blasting process
JPH1133560A (en) * 1997-07-15 1999-02-09 Kurita Water Ind Ltd Flocculation treatment of cmp waste solution
JPH1150168A (en) 1997-07-31 1999-02-23 Canon Inc Recovery of rare earth metal component from optical glass sludge
JP3134189B2 (en) 1997-09-18 2001-02-13 福島県 How to collect abrasives
IT1299540B1 (en) * 1998-07-01 2000-03-16 Memc Electronic Materials PROCEDURE TO SEPARATE AND REGENERATE WASTE ABRASIVE BASED ON GLYCOL AND SILICON CARBIDE FOR THE PURPOSE OF THEIR REUSE
JP4168520B2 (en) 1999-03-12 2008-10-22 栗田工業株式会社 Method for treating CMP drainage
JP2001308041A (en) 2000-04-18 2001-11-02 Asahi Kasei Corp Composition for metal film polishing on semiconductor substrate
KR101088594B1 (en) 2003-03-18 2011-12-06 노무라마이크로사이엔스가부시키가이샤 Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry
ITRM20050329A1 (en) 2005-06-24 2006-12-25 Guido Fragiacomo PROCEDURE FOR TREATING ABRASIVE SUSPENSIONS EXHAUSTED FOR THE RECOVERY OF THEIR RECYCLABLE COMPONENTS AND ITS PLANT.
WO2007105714A1 (en) * 2006-03-13 2007-09-20 Showa Denko K.K. Method of recovering rare earth element from composition containing rare earth fluoride
JP2008188723A (en) * 2007-02-06 2008-08-21 Mitsubishi Electric Corp Recycling method for used slurry
JP5090191B2 (en) * 2008-01-24 2012-12-05 三和油化工業株式会社 Method for recovering dispersion medium from waste slurry slurry
JP2010214515A (en) 2009-03-16 2010-09-30 Fukushima Univ Method of manufacturing glass abrasive material
JP5511261B2 (en) 2009-08-19 2014-06-04 宇部マテリアルズ株式会社 Classification device
WO2013094399A1 (en) * 2011-12-22 2013-06-27 コニカミノルタ株式会社 Abrasive material regeneration method and regenerated abrasive material
WO2014017531A1 (en) * 2012-07-25 2014-01-30 コニカミノルタ株式会社 Polishing-material reclamation method
CN110065006A (en) * 2012-07-25 2019-07-30 柯尼卡美能达株式会社 Grinding-material regeneration method

Also Published As

Publication number Publication date
EP2815846A1 (en) 2014-12-24
CN104114324B (en) 2017-11-28
PH12014501857A1 (en) 2014-11-17
JP6107668B2 (en) 2017-04-05
US9802337B2 (en) 2017-10-31
JPWO2013122123A1 (en) 2015-05-18
EP2815846A4 (en) 2015-11-04
MY175053A (en) 2020-06-03
US20150306788A1 (en) 2015-10-29
EP2815846B1 (en) 2018-09-26
WO2013122123A1 (en) 2013-08-22
CN104114324A (en) 2014-10-22
PH12014501857B1 (en) 2014-11-17

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