SG11201403175PA - Method for separating polishing material and regenerated polishing material - Google Patents

Method for separating polishing material and regenerated polishing material

Info

Publication number
SG11201403175PA
SG11201403175PA SG11201403175PA SG11201403175PA SG11201403175PA SG 11201403175P A SG11201403175P A SG 11201403175PA SG 11201403175P A SG11201403175P A SG 11201403175PA SG 11201403175P A SG11201403175P A SG 11201403175PA SG 11201403175P A SG11201403175P A SG 11201403175PA
Authority
SG
Singapore
Prior art keywords
polishing material
separating
regenerated
regenerated polishing
polishing
Prior art date
Application number
SG11201403175PA
Inventor
Atsushi Takahashi
Yuuki Nagai
Akihiro Maezawa
Original Assignee
Konica Minolta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Inc filed Critical Konica Minolta Inc
Publication of SG11201403175PA publication Critical patent/SG11201403175PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D11/00—Solvent extraction
    • B01D11/02—Solvent extraction of solids
    • B01D11/0215—Solid material in other stationary receptacles
    • B01D11/0223—Moving bed of solid material
    • B01D11/0242—Moving bed of solid material in towers, e.g. comprising contacting elements
    • B01D11/0246—Moving bed of solid material in towers, e.g. comprising contacting elements comprising rotating means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D21/00—Separation of suspended solid particles from liquids by sedimentation
    • B01D21/01—Separation of suspended solid particles from liquids by sedimentation using flocculating agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/52—Treatment of water, waste water, or sewage by flocculation or precipitation of suspended impurities
    • C02F1/5209—Regulation methods for flocculation or precipitation
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/52—Treatment of water, waste water, or sewage by flocculation or precipitation of suspended impurities
    • C02F1/5236—Treatment of water, waste water, or sewage by flocculation or precipitation of suspended impurities using inorganic agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D21/00—Separation of suspended solid particles from liquids by sedimentation
    • B01D21/02—Settling tanks with single outlets for the separated liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2221/00—Applications of separation devices
    • B01D2221/14—Separation devices for workshops, car or semiconductor industry, e.g. for separating chips and other machining residues
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Environmental & Geological Engineering (AREA)
  • Water Supply & Treatment (AREA)
  • Hydrology & Water Resources (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG11201403175PA 2011-12-27 2012-12-17 Method for separating polishing material and regenerated polishing material SG11201403175PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011285033 2011-12-27
PCT/JP2012/082607 WO2013099666A1 (en) 2011-12-27 2012-12-17 Method for separating polishing material and regenerated polishing material

Publications (1)

Publication Number Publication Date
SG11201403175PA true SG11201403175PA (en) 2014-08-28

Family

ID=48697158

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201403175PA SG11201403175PA (en) 2011-12-27 2012-12-17 Method for separating polishing material and regenerated polishing material

Country Status (9)

Country Link
US (1) US10017675B2 (en)
EP (1) EP2799185B1 (en)
JP (1) JP6044551B2 (en)
KR (1) KR20140102696A (en)
CN (1) CN104023915B (en)
MY (1) MY176270A (en)
PH (1) PH12014501377A1 (en)
SG (1) SG11201403175PA (en)
WO (1) WO2013099666A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9701878B2 (en) 2012-02-16 2017-07-11 Konica Minolta, Inc. Abrasive regeneration method
DE102014015549A1 (en) * 2014-10-22 2016-04-28 Thyssenkrupp Ag Grinding plant for comminuting regrind and method for comminuting regrind
US11244834B2 (en) * 2018-07-31 2022-02-08 Taiwan Semiconductor Manufacturing Co., Ltd. Slurry recycling for chemical mechanical polishing system
US11642754B2 (en) * 2018-08-30 2023-05-09 Taiwan Semiconductor Manufacturing Co., Ltd. Slurry recycling for chemical mechanical polishing system
JP2022172678A (en) * 2021-05-06 2022-11-17 コニカミノルタ株式会社 Method for preparing recycled/regenerated polishing agent slurry and polishing agent slurry

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US4419246A (en) * 1982-09-30 1983-12-06 E. I. Du Pont De Nemours & Co. Removal of heavy metal ions
JPH06254764A (en) 1993-03-03 1994-09-13 Asahi Glass Co Ltd Regenerating method for polishing liquid
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JP3426149B2 (en) * 1998-12-25 2003-07-14 富士通株式会社 Method and apparatus for recycling polishing waste liquid in semiconductor manufacturing
WO2000041974A1 (en) * 1999-01-15 2000-07-20 Nalco Chemical Company Composition and method for simultaneously precipitating metal ions from semiconductor wastewater and enhancing microfilter operation
JP4168520B2 (en) * 1999-03-12 2008-10-22 栗田工業株式会社 Method for treating CMP drainage
US6746309B2 (en) * 1999-05-27 2004-06-08 Sanyo Electric Co., Ltd. Method of fabricating a semiconductor device
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Also Published As

Publication number Publication date
US10017675B2 (en) 2018-07-10
PH12014501377B1 (en) 2014-09-22
US20150013235A1 (en) 2015-01-15
MY176270A (en) 2020-07-25
CN104023915B (en) 2017-07-21
PH12014501377A1 (en) 2014-09-22
CN104023915A (en) 2014-09-03
KR20140102696A (en) 2014-08-22
WO2013099666A1 (en) 2013-07-04
EP2799185B1 (en) 2017-02-01
JP6044551B2 (en) 2016-12-14
JPWO2013099666A1 (en) 2015-05-07
EP2799185A1 (en) 2014-11-05
EP2799185A4 (en) 2015-08-12

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