SG11201401906SA - Resin composition, and prepreg and laminate using the same - Google Patents
Resin composition, and prepreg and laminate using the sameInfo
- Publication number
- SG11201401906SA SG11201401906SA SG11201401906SA SG11201401906SA SG11201401906SA SG 11201401906S A SG11201401906S A SG 11201401906SA SG 11201401906S A SG11201401906S A SG 11201401906SA SG 11201401906S A SG11201401906S A SG 11201401906SA SG 11201401906S A SG11201401906S A SG 11201401906SA
- Authority
- SG
- Singapore
- Prior art keywords
- prepreg
- laminate
- same
- resin composition
- resin
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
- C08G73/065—Preparatory processes
- C08G73/0655—Preparatory processes from polycyanurates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
- Y10T442/2475—Coating or impregnation is electrical insulation-providing, -improving, or -increasing, or conductivity-reducing
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011243162 | 2011-11-07 | ||
PCT/JP2012/077738 WO2013069479A1 (ja) | 2011-11-07 | 2012-10-26 | 樹脂組成物、これを用いたプリプレグ及び積層板 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201401906SA true SG11201401906SA (en) | 2014-10-30 |
Family
ID=48289859
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201401906SA SG11201401906SA (en) | 2011-11-07 | 2012-10-26 | Resin composition, and prepreg and laminate using the same |
Country Status (8)
Country | Link |
---|---|
US (1) | US9775238B2 (zh) |
EP (1) | EP2778198B1 (zh) |
JP (1) | JP6103486B2 (zh) |
KR (1) | KR101945076B1 (zh) |
CN (1) | CN103917596A (zh) |
SG (1) | SG11201401906SA (zh) |
TW (1) | TWI605078B (zh) |
WO (1) | WO2013069479A1 (zh) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG10201504246UA (en) * | 2010-06-02 | 2015-06-29 | Mitsubishi Gas Chemical Co | Resin composition, and prepreg and laminated sheet using the same |
TW201414756A (zh) * | 2012-06-14 | 2014-04-16 | Zeon Corp | 架橋性樹脂成形體、架橋樹脂成形體以及層積體 |
EP3012294B1 (en) * | 2013-06-18 | 2020-09-16 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, resin sheet and metal foil-clad laminate |
KR101668855B1 (ko) * | 2013-09-30 | 2016-10-28 | 주식회사 엘지화학 | 반도체 패키지용 열경화성 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |
KR102172293B1 (ko) * | 2014-05-30 | 2020-10-30 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 포함하는 인쇄회로기판 |
US9879163B2 (en) | 2014-06-06 | 2018-01-30 | General Electric Company | Composition for bonding windings or core laminates in an electrical machine, and associated method |
US9911521B2 (en) | 2014-06-06 | 2018-03-06 | General Electric Company | Curable composition for electrical machine, and associated method |
EP3170868B1 (en) * | 2014-07-18 | 2019-04-24 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, metal foil-clad laminate and printed wiring board |
JP6493404B2 (ja) * | 2014-07-18 | 2019-04-03 | 三菱瓦斯化学株式会社 | 積層体の製造方法及び半導体素子搭載用基板の製造方法 |
WO2016147735A1 (ja) * | 2015-03-18 | 2016-09-22 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート、及びプリント配線板 |
CN107207855B (zh) * | 2015-03-31 | 2018-09-11 | 三菱瓦斯化学株式会社 | 印刷电路板用树脂组合物、预浸料、树脂复合片和覆金属箔层叠板 |
US20180148622A1 (en) * | 2015-05-25 | 2018-05-31 | Hitachi Chemical Company, Ltd. | Resin composition, resin sheet, prepreg, insulator, resin sheet cured product, and heat dissipator |
JP6523079B2 (ja) * | 2015-07-06 | 2019-05-29 | 株式会社トクヤマ | 窒化アルミニウム複合フィラーおよびこれを含む樹脂組成物 |
US20180208820A1 (en) * | 2015-07-21 | 2018-07-26 | Sumitomo Bakelite Co., Ltd. | Thermal conductive resin composition, thermal conductive sheet, and semiconductor device |
WO2017047452A1 (ja) * | 2015-09-16 | 2017-03-23 | 大日精化工業株式会社 | アルミナ系熱伝導性酸化物及びその製造方法 |
CN107663373B (zh) * | 2016-07-27 | 2019-11-29 | 北京联合涂层技术有限公司 | 一种改性hBN填充氰酸酯树脂基复合材料的工艺方法 |
EP3375822B1 (en) | 2016-08-24 | 2020-03-11 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, metal foil-clad laminated board, resin sheet, and printed wiring board |
WO2018147053A1 (ja) | 2017-02-07 | 2018-08-16 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板 |
KR102057255B1 (ko) | 2017-03-22 | 2019-12-18 | 주식회사 엘지화학 | 반도체 패키지용 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |
WO2018174447A1 (ko) * | 2017-03-22 | 2018-09-27 | 주식회사 엘지화학 | 반도체 패키지용 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |
CN108034247A (zh) * | 2017-12-14 | 2018-05-15 | 深圳先进技术研究院 | 一种液态塑封材料及其制备方法 |
EP3578606A1 (en) * | 2018-06-06 | 2019-12-11 | Jotun A/S | Particulate coating composition |
US10759697B1 (en) | 2019-06-11 | 2020-09-01 | MSB Global, Inc. | Curable formulations for structural and non-structural applications |
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JPH07165949A (ja) | 1993-11-10 | 1995-06-27 | Hitachi Chem Co Ltd | 高誘電率プリプレグおよび積層板 |
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WO2011010672A1 (ja) * | 2009-07-24 | 2011-01-27 | 住友ベークライト株式会社 | 樹脂組成物、樹脂シート、プリプレグ、金属張積層板、プリント配線板及び半導体装置 |
KR101708941B1 (ko) * | 2009-10-14 | 2017-02-21 | 스미토모 베이클리트 컴퍼니 리미티드 | 에폭시 수지 조성물, 프리프레그, 금속 부착 적층판, 프린트 배선판 및 반도체 장치 |
JP2010174242A (ja) * | 2009-12-28 | 2010-08-12 | Sumitomo Bakelite Co Ltd | ビフェニルアラルキル型シアン酸エステル樹脂、並びにビフェニルアラルキル型シアン酸エステル樹脂を含む樹脂組成物、及び、当該樹脂組成物を用いてなるプリプレグ、積層板、樹脂シート、多層プリント配線板、並びに半導体装置 |
CN101967264A (zh) * | 2010-08-31 | 2011-02-09 | 广东生益科技股份有限公司 | 环氧树脂组合物及使用其制作的高频电路基板 |
JP2012158637A (ja) * | 2011-01-31 | 2012-08-23 | Sumitomo Bakelite Co Ltd | プリント配線板用樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板及び半導体装置 |
WO2012121224A1 (ja) * | 2011-03-07 | 2012-09-13 | 三菱瓦斯化学株式会社 | 樹脂組成物ならびにこれを用いたプリプレグおよび積層板 |
JP2012211269A (ja) * | 2011-03-31 | 2012-11-01 | Sekisui Chem Co Ltd | 予備硬化物、粗化予備硬化物及び積層体 |
US9512329B2 (en) | 2011-05-27 | 2016-12-06 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, and laminate |
SG10201602081SA (en) * | 2011-05-31 | 2016-04-28 | Mitsubishi Gas Chemical Co | Resin composition, prepreg, and laminate |
-
2012
- 2012-10-26 SG SG11201401906SA patent/SG11201401906SA/en unknown
- 2012-10-26 CN CN201280054753.XA patent/CN103917596A/zh active Pending
- 2012-10-26 EP EP12847461.6A patent/EP2778198B1/en active Active
- 2012-10-26 JP JP2013542924A patent/JP6103486B2/ja active Active
- 2012-10-26 US US14/356,266 patent/US9775238B2/en active Active
- 2012-10-26 WO PCT/JP2012/077738 patent/WO2013069479A1/ja active Application Filing
- 2012-10-26 KR KR1020147011976A patent/KR101945076B1/ko active IP Right Grant
- 2012-11-06 TW TW101141211A patent/TWI605078B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201326276A (zh) | 2013-07-01 |
TWI605078B (zh) | 2017-11-11 |
US9775238B2 (en) | 2017-09-26 |
CN103917596A (zh) | 2014-07-09 |
KR101945076B1 (ko) | 2019-02-01 |
EP2778198A1 (en) | 2014-09-17 |
JP6103486B2 (ja) | 2017-03-29 |
EP2778198B1 (en) | 2018-02-14 |
KR20140090991A (ko) | 2014-07-18 |
WO2013069479A1 (ja) | 2013-05-16 |
EP2778198A4 (en) | 2015-06-24 |
JPWO2013069479A1 (ja) | 2015-04-02 |
US20140349089A1 (en) | 2014-11-27 |
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