SG11201401906SA - Resin composition, and prepreg and laminate using the same - Google Patents

Resin composition, and prepreg and laminate using the same

Info

Publication number
SG11201401906SA
SG11201401906SA SG11201401906SA SG11201401906SA SG11201401906SA SG 11201401906S A SG11201401906S A SG 11201401906SA SG 11201401906S A SG11201401906S A SG 11201401906SA SG 11201401906S A SG11201401906S A SG 11201401906SA SG 11201401906S A SG11201401906S A SG 11201401906SA
Authority
SG
Singapore
Prior art keywords
prepreg
laminate
same
resin composition
resin
Prior art date
Application number
SG11201401906SA
Other languages
English (en)
Inventor
Daisuke Ueyama
Masanobu Sogame
Chisato Saito
Yoshinori Mabuchi
Yoshihiro Kato
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of SG11201401906SA publication Critical patent/SG11201401906SA/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0622Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0638Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
    • C08G73/065Preparatory processes
    • C08G73/0655Preparatory processes from polycyanurates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12Unsaturated polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415Five-membered rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/003Additives being defined by their diameter
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24893Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2475Coating or impregnation is electrical insulation-providing, -improving, or -increasing, or conductivity-reducing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
SG11201401906SA 2011-11-07 2012-10-26 Resin composition, and prepreg and laminate using the same SG11201401906SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011243162 2011-11-07
PCT/JP2012/077738 WO2013069479A1 (ja) 2011-11-07 2012-10-26 樹脂組成物、これを用いたプリプレグ及び積層板

Publications (1)

Publication Number Publication Date
SG11201401906SA true SG11201401906SA (en) 2014-10-30

Family

ID=48289859

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201401906SA SG11201401906SA (en) 2011-11-07 2012-10-26 Resin composition, and prepreg and laminate using the same

Country Status (8)

Country Link
US (1) US9775238B2 (zh)
EP (1) EP2778198B1 (zh)
JP (1) JP6103486B2 (zh)
KR (1) KR101945076B1 (zh)
CN (1) CN103917596A (zh)
SG (1) SG11201401906SA (zh)
TW (1) TWI605078B (zh)
WO (1) WO2013069479A1 (zh)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG10201504246UA (en) * 2010-06-02 2015-06-29 Mitsubishi Gas Chemical Co Resin composition, and prepreg and laminated sheet using the same
TW201414756A (zh) * 2012-06-14 2014-04-16 Zeon Corp 架橋性樹脂成形體、架橋樹脂成形體以及層積體
EP3012294B1 (en) * 2013-06-18 2020-09-16 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, resin sheet and metal foil-clad laminate
KR101668855B1 (ko) * 2013-09-30 2016-10-28 주식회사 엘지화학 반도체 패키지용 열경화성 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판
KR102172293B1 (ko) * 2014-05-30 2020-10-30 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 포함하는 인쇄회로기판
US9879163B2 (en) 2014-06-06 2018-01-30 General Electric Company Composition for bonding windings or core laminates in an electrical machine, and associated method
US9911521B2 (en) 2014-06-06 2018-03-06 General Electric Company Curable composition for electrical machine, and associated method
EP3170868B1 (en) * 2014-07-18 2019-04-24 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, metal foil-clad laminate and printed wiring board
JP6493404B2 (ja) * 2014-07-18 2019-04-03 三菱瓦斯化学株式会社 積層体の製造方法及び半導体素子搭載用基板の製造方法
WO2016147735A1 (ja) * 2015-03-18 2016-09-22 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート、及びプリント配線板
CN107207855B (zh) * 2015-03-31 2018-09-11 三菱瓦斯化学株式会社 印刷电路板用树脂组合物、预浸料、树脂复合片和覆金属箔层叠板
US20180148622A1 (en) * 2015-05-25 2018-05-31 Hitachi Chemical Company, Ltd. Resin composition, resin sheet, prepreg, insulator, resin sheet cured product, and heat dissipator
JP6523079B2 (ja) * 2015-07-06 2019-05-29 株式会社トクヤマ 窒化アルミニウム複合フィラーおよびこれを含む樹脂組成物
US20180208820A1 (en) * 2015-07-21 2018-07-26 Sumitomo Bakelite Co., Ltd. Thermal conductive resin composition, thermal conductive sheet, and semiconductor device
WO2017047452A1 (ja) * 2015-09-16 2017-03-23 大日精化工業株式会社 アルミナ系熱伝導性酸化物及びその製造方法
CN107663373B (zh) * 2016-07-27 2019-11-29 北京联合涂层技术有限公司 一种改性hBN填充氰酸酯树脂基复合材料的工艺方法
EP3375822B1 (en) 2016-08-24 2020-03-11 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, metal foil-clad laminated board, resin sheet, and printed wiring board
WO2018147053A1 (ja) 2017-02-07 2018-08-16 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
KR102057255B1 (ko) 2017-03-22 2019-12-18 주식회사 엘지화학 반도체 패키지용 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판
WO2018174447A1 (ko) * 2017-03-22 2018-09-27 주식회사 엘지화학 반도체 패키지용 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판
CN108034247A (zh) * 2017-12-14 2018-05-15 深圳先进技术研究院 一种液态塑封材料及其制备方法
EP3578606A1 (en) * 2018-06-06 2019-12-11 Jotun A/S Particulate coating composition
US10759697B1 (en) 2019-06-11 2020-09-01 MSB Global, Inc. Curable formulations for structural and non-structural applications

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07165949A (ja) 1993-11-10 1995-06-27 Hitachi Chem Co Ltd 高誘電率プリプレグおよび積層板
JPH10146917A (ja) 1996-11-15 1998-06-02 Sumitomo Bakelite Co Ltd 印刷回路用積層板
JP2000344917A (ja) 1999-06-04 2000-12-12 Sumitomo Bakelite Co Ltd 難燃性プリプレグ及び積層板
JP5105657B2 (ja) 2000-04-14 2012-12-26 三菱瓦斯化学株式会社 プリプレグ及び積層板
JP2001348488A (ja) 2000-06-06 2001-12-18 Matsushita Electric Works Ltd 熱伝導性樹脂組成物、プリプレグ、放熱性回路基板及び放熱性発熱部品
JP4997727B2 (ja) 2005-08-12 2012-08-08 三菱瓦斯化学株式会社 難燃性樹脂組成物、並びにこれを用いたプリプレグ及び積層板
CN101432134B (zh) * 2006-04-25 2014-01-22 日立化成工业株式会社 带粘接层的导体箔、贴有导体的层叠板、印制线路板及多层线路板
JP5263705B2 (ja) * 2007-02-07 2013-08-14 三菱瓦斯化学株式会社 プリプレグ及び積層板
EP1961554B1 (en) * 2007-02-07 2010-01-27 Mitsubishi Gas Chemical Company, Inc. Prepreg and laminate
CN101652401B (zh) 2007-04-10 2012-09-05 住友电木株式会社 环氧树脂组合物、预浸料坯、层叠板、多层印刷线路板、半导体器件、绝缘树脂片、和制造多层印刷线路板的方法
JP5024205B2 (ja) * 2007-07-12 2012-09-12 三菱瓦斯化学株式会社 プリプレグ及び積層板
JP2009051978A (ja) 2007-08-28 2009-03-12 Panasonic Electric Works Co Ltd プリント配線板用エポキシ樹脂組成物、プリプレグ、金属箔張積層板、多層プリント配線板
JP5206600B2 (ja) 2008-06-30 2013-06-12 住友ベークライト株式会社 エポキシ樹脂組成物、プリプレグ、積層板、樹脂シート、多層プリント配線板、及び半導体装置
JP2010100803A (ja) * 2008-09-24 2010-05-06 Sekisui Chem Co Ltd エポキシ系樹脂組成物、シート状成形体、プリプレグ、硬化体、積層板及び多層積層板
WO2011010672A1 (ja) * 2009-07-24 2011-01-27 住友ベークライト株式会社 樹脂組成物、樹脂シート、プリプレグ、金属張積層板、プリント配線板及び半導体装置
KR101708941B1 (ko) * 2009-10-14 2017-02-21 스미토모 베이클리트 컴퍼니 리미티드 에폭시 수지 조성물, 프리프레그, 금속 부착 적층판, 프린트 배선판 및 반도체 장치
JP2010174242A (ja) * 2009-12-28 2010-08-12 Sumitomo Bakelite Co Ltd ビフェニルアラルキル型シアン酸エステル樹脂、並びにビフェニルアラルキル型シアン酸エステル樹脂を含む樹脂組成物、及び、当該樹脂組成物を用いてなるプリプレグ、積層板、樹脂シート、多層プリント配線板、並びに半導体装置
CN101967264A (zh) * 2010-08-31 2011-02-09 广东生益科技股份有限公司 环氧树脂组合物及使用其制作的高频电路基板
JP2012158637A (ja) * 2011-01-31 2012-08-23 Sumitomo Bakelite Co Ltd プリント配線板用樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板及び半導体装置
WO2012121224A1 (ja) * 2011-03-07 2012-09-13 三菱瓦斯化学株式会社 樹脂組成物ならびにこれを用いたプリプレグおよび積層板
JP2012211269A (ja) * 2011-03-31 2012-11-01 Sekisui Chem Co Ltd 予備硬化物、粗化予備硬化物及び積層体
US9512329B2 (en) 2011-05-27 2016-12-06 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, and laminate
SG10201602081SA (en) * 2011-05-31 2016-04-28 Mitsubishi Gas Chemical Co Resin composition, prepreg, and laminate

Also Published As

Publication number Publication date
TW201326276A (zh) 2013-07-01
TWI605078B (zh) 2017-11-11
US9775238B2 (en) 2017-09-26
CN103917596A (zh) 2014-07-09
KR101945076B1 (ko) 2019-02-01
EP2778198A1 (en) 2014-09-17
JP6103486B2 (ja) 2017-03-29
EP2778198B1 (en) 2018-02-14
KR20140090991A (ko) 2014-07-18
WO2013069479A1 (ja) 2013-05-16
EP2778198A4 (en) 2015-06-24
JPWO2013069479A1 (ja) 2015-04-02
US20140349089A1 (en) 2014-11-27

Similar Documents

Publication Publication Date Title
SG11201401906SA (en) Resin composition, and prepreg and laminate using the same
SG10201600443SA (en) Resin composition, and prepreg as well as laminate using the same
SG10201602081SA (en) Resin composition, prepreg, and laminate
EP2716676A4 (en) RESIN COMPOSITION, PREPREG AND LAMINATE
SG11201406174PA (en) Resin composition, prepreg, and laminate
SG10201504246UA (en) Resin composition, and prepreg and laminated sheet using the same
EP2557121A4 (en) RESIN COMPOSITION, PRE-IMPREGNATED AND LAMINATE
SG10201501469PA (en) Resin composition, prepreg, and laminated sheet
EP2612879A4 (en) POLYIMIDE RESIN COMPOSITION AND LAMINATE THEREWITH
EP2612885A4 (en) Resin composition, prepreg, and laminate
PL2750886T3 (pl) Skład laminatu, folia i związane metody
EP2657295A4 (en) HALOGEN-FREE HIGH TG HARS COMPOSITION AND PREPREG MADE FROM IT AND LAMINATE MANUFACTURED THEREFROM
HK1212720A1 (zh) 樹脂組合物、預浸料和薄膜
SG11201502925UA (en) Resin composition, prepreg, laminate and printed-wiring board
EP2690120A4 (en) RESIN COMPOSITION, PRE-IMPREGNATED AND RESIN SHEET, AND LAMINATE PLATED WITH METALLIC FOIL
SG11201404727XA (en) Resin composition, prepreg, resin sheet, and metal foil-clad laminate
SG11201401958TA (en) Resin composition, prepreg, and laminate
SG10201509881VA (en) Resin composition, prepreg, and laminate
EP2762507A4 (en) RESIN COMPOSITION, PREPREG AND LAMINATE CASED WITH METAL FOIL
SG11201405224QA (en) Resin composition, prepreg, and metal foil-clad laminate
EP2770000A4 (en) BY ARTICULAR RADIATION HARDENABLE ARTIFICIAL RESIN COMPOSITION, ADHESIVE AND LAYERING FOIL
EP2735580A4 (en) POLYIMIDE RESIN, RESIN COMPOSITION, AND LAMINATED FILM USING THE SAME
SG10201600489PA (en) Resin composition, prepreg, and metal foil-clad laminate
EP2896653A4 (en) EPOXY RESIN COMPOSITION AND PRE-IMPREGNATED AND COPPER LAMINATE MANUFACTURED USING THE COMPOSITION
SG10201602082QA (en) Resin composition, and prepreg and metal foil-clad laminate using the same