SG11201400882QA - Nanowire sized opto-electronic structure and method for manufacturing the same - Google Patents
Nanowire sized opto-electronic structure and method for manufacturing the sameInfo
- Publication number
- SG11201400882QA SG11201400882QA SG11201400882QA SG11201400882QA SG11201400882QA SG 11201400882Q A SG11201400882Q A SG 11201400882QA SG 11201400882Q A SG11201400882Q A SG 11201400882QA SG 11201400882Q A SG11201400882Q A SG 11201400882QA SG 11201400882Q A SG11201400882Q A SG 11201400882QA
- Authority
- SG
- Singapore
- Prior art keywords
- manufacturing
- same
- electronic structure
- nanowire
- opto
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000002070 nanowire Substances 0.000 title 1
- 230000005693 optoelectronics Effects 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/405—Reflective materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/16—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
- H01L33/18—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous within the light emitting region
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161539117P | 2011-09-26 | 2011-09-26 | |
US13/251,555 US8350251B1 (en) | 2011-09-26 | 2011-10-03 | Nanowire sized opto-electronic structure and method for manufacturing the same |
PCT/US2012/057029 WO2013049008A2 (en) | 2011-09-26 | 2012-09-25 | Nanowire sized opto-electronic structure and method for manufacturing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201400882QA true SG11201400882QA (en) | 2014-04-28 |
Family
ID=47427882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201400882QA SG11201400882QA (en) | 2011-09-26 | 2012-09-25 | Nanowire sized opto-electronic structure and method for manufacturing the same |
Country Status (8)
Country | Link |
---|---|
US (3) | US8350251B1 (zh) |
EP (1) | EP2761678B1 (zh) |
JP (1) | JP6077549B2 (zh) |
KR (1) | KR101944327B1 (zh) |
CN (1) | CN104321887B (zh) |
SG (1) | SG11201400882QA (zh) |
TW (1) | TW201322490A (zh) |
WO (1) | WO2013049008A2 (zh) |
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US8350251B1 (en) | 2011-09-26 | 2013-01-08 | Glo Ab | Nanowire sized opto-electronic structure and method for manufacturing the same |
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US8964020B2 (en) * | 2007-04-25 | 2015-02-24 | Stc.Unm | Solid-state microscope for selectively imaging a sample |
US7867793B2 (en) | 2007-07-09 | 2011-01-11 | Koninklijke Philips Electronics N.V. | Substrate removal during LED formation |
KR100872678B1 (ko) | 2007-07-23 | 2008-12-10 | 엘지이노텍 주식회사 | 반도체 발광소자의 제조 방법 |
JP5097532B2 (ja) * | 2007-12-21 | 2012-12-12 | パナソニック株式会社 | 化合物半導体発光素子の製造方法 |
CN103022282B (zh) | 2008-07-07 | 2016-02-03 | 格罗有限公司 | 纳米结构led |
US7919780B2 (en) | 2008-08-05 | 2011-04-05 | Dicon Fiberoptics, Inc. | System for high efficiency solid-state light emissions and method of manufacture |
US8062916B2 (en) | 2008-11-06 | 2011-11-22 | Koninklijke Philips Electronics N.V. | Series connected flip chip LEDs with growth substrate removed |
US20100180950A1 (en) * | 2008-11-14 | 2010-07-22 | University Of Connecticut | Low-temperature surface doping/alloying/coating of large scale semiconductor nanowire arrays |
SE533531C2 (sv) | 2008-12-19 | 2010-10-19 | Glo Ab | Nanostrukturerad anordning |
JP5017399B2 (ja) * | 2010-03-09 | 2012-09-05 | 株式会社東芝 | 半導体発光装置および半導体発光装置の製造方法 |
AU2011268135B2 (en) | 2010-06-18 | 2014-06-12 | Glo Ab | Nanowire LED structure and method for manufacturing the same |
US8350251B1 (en) | 2011-09-26 | 2013-01-08 | Glo Ab | Nanowire sized opto-electronic structure and method for manufacturing the same |
-
2011
- 2011-10-03 US US13/251,555 patent/US8350251B1/en not_active Expired - Fee Related
-
2012
- 2012-09-25 CN CN201280055626.1A patent/CN104321887B/zh not_active Expired - Fee Related
- 2012-09-25 SG SG11201400882QA patent/SG11201400882QA/en unknown
- 2012-09-25 KR KR1020147008330A patent/KR101944327B1/ko active IP Right Grant
- 2012-09-25 WO PCT/US2012/057029 patent/WO2013049008A2/en active Application Filing
- 2012-09-25 JP JP2014532091A patent/JP6077549B2/ja active Active
- 2012-09-25 EP EP12834833.1A patent/EP2761678B1/en not_active Not-in-force
- 2012-09-26 TW TW101135418A patent/TW201322490A/zh unknown
- 2012-12-06 US US13/707,281 patent/US8937295B2/en active Active
-
2014
- 2014-12-16 US US14/572,123 patent/US9419183B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN104321887B (zh) | 2017-05-31 |
US8350251B1 (en) | 2013-01-08 |
WO2013049008A2 (en) | 2013-04-04 |
JP2014530504A (ja) | 2014-11-17 |
KR20140067076A (ko) | 2014-06-03 |
US20150207037A1 (en) | 2015-07-23 |
JP6077549B2 (ja) | 2017-02-08 |
US8937295B2 (en) | 2015-01-20 |
US9419183B2 (en) | 2016-08-16 |
CN104321887A (zh) | 2015-01-28 |
TW201322490A (zh) | 2013-06-01 |
EP2761678A4 (en) | 2015-06-17 |
US20130092900A1 (en) | 2013-04-18 |
WO2013049008A3 (en) | 2013-05-23 |
EP2761678B1 (en) | 2016-07-06 |
KR101944327B1 (ko) | 2019-01-31 |
EP2761678A2 (en) | 2014-08-06 |
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