SG108920A1 - Semiconductor integrated circuit device, production and operation method thereof - Google Patents
Semiconductor integrated circuit device, production and operation method thereofInfo
- Publication number
- SG108920A1 SG108920A1 SG200302610A SG200302610A SG108920A1 SG 108920 A1 SG108920 A1 SG 108920A1 SG 200302610 A SG200302610 A SG 200302610A SG 200302610 A SG200302610 A SG 200302610A SG 108920 A1 SG108920 A1 SG 108920A1
- Authority
- SG
- Singapore
- Prior art keywords
- production
- integrated circuit
- semiconductor integrated
- circuit device
- operation method
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0425—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a merged floating gate and select transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
- Read Only Memory (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20024299A JP4012341B2 (ja) | 1999-07-14 | 1999-07-14 | 半導体集積回路装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG108920A1 true SG108920A1 (en) | 2005-02-28 |
Family
ID=16421170
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200003919A SG118065A1 (en) | 1999-07-14 | 2000-07-13 | Semiconductor integrated circuit device productionand operation method thereof |
SG200302610A SG108920A1 (en) | 1999-07-14 | 2000-07-13 | Semiconductor integrated circuit device, production and operation method thereof |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200003919A SG118065A1 (en) | 1999-07-14 | 2000-07-13 | Semiconductor integrated circuit device productionand operation method thereof |
Country Status (7)
Country | Link |
---|---|
US (2) | US6438028B1 (ja) |
EP (1) | EP1069619A3 (ja) |
JP (1) | JP4012341B2 (ja) |
KR (1) | KR100650470B1 (ja) |
CN (1) | CN100369253C (ja) |
SG (2) | SG118065A1 (ja) |
TW (1) | TW454353B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100650470B1 (ko) * | 1999-07-14 | 2006-11-28 | 가부시키가이샤 히타치세이사쿠쇼 | 반도체 집적 회로 장치와 그 제조 방법 및 그 동작 방법 |
Families Citing this family (70)
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WO2002056316A1 (fr) | 2001-01-12 | 2002-07-18 | Hitachi, Ltd. | Memoire remanente a semi-conducteur |
JP2003086717A (ja) | 2001-09-12 | 2003-03-20 | Mitsubishi Electric Corp | 不揮発性半導体記憶装置、不揮発性半導体記憶装置の書き込み方法及び不揮発性半導体記憶装置の消去方法 |
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JP2003168748A (ja) | 2001-11-30 | 2003-06-13 | Hitachi Ltd | 不揮発性半導体記憶装置およびその製造方法 |
JP2003188290A (ja) | 2001-12-19 | 2003-07-04 | Mitsubishi Electric Corp | 不揮発性半導体記憶装置およびその製造方法 |
JP4050548B2 (ja) | 2002-04-18 | 2008-02-20 | 株式会社ルネサステクノロジ | 半導体記憶装置 |
KR100479455B1 (ko) * | 2002-05-31 | 2005-03-30 | 하이맥스 테크놀로지스, 인코포레이티드 | 디코더의 배치와 그 방법 |
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US20040129986A1 (en) | 2002-11-28 | 2004-07-08 | Renesas Technology Corp. | Nonvolatile semiconductor memory device and manufacturing method thereof |
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JP5039099B2 (ja) * | 2003-04-04 | 2012-10-03 | ルネサスエレクトロニクス株式会社 | 不揮発性半導体記憶装置 |
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US7023045B2 (en) * | 2003-08-20 | 2006-04-04 | Macronix International Co., Ltd. | Layout of a flash memory having symmetric select transistors |
JP2005085903A (ja) * | 2003-09-05 | 2005-03-31 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP2005209931A (ja) | 2004-01-23 | 2005-08-04 | Renesas Technology Corp | 不揮発性半導体記憶装置およびその製造方法 |
JP2005251859A (ja) * | 2004-03-02 | 2005-09-15 | Renesas Technology Corp | 不揮発性半導体記憶装置 |
US7518179B2 (en) * | 2004-10-08 | 2009-04-14 | Freescale Semiconductor, Inc. | Virtual ground memory array and method therefor |
US7064030B2 (en) * | 2004-10-08 | 2006-06-20 | Freescale Semiconductor, Inc. | Method for forming a multi-bit non-volatile memory device |
US20060076604A1 (en) * | 2004-10-08 | 2006-04-13 | Prinz Erwin J | Virtual ground memory array and method therefor |
US7638850B2 (en) | 2004-10-14 | 2009-12-29 | Saifun Semiconductors Ltd. | Non-volatile memory structure and method of fabrication |
JP2006121009A (ja) * | 2004-10-25 | 2006-05-11 | Renesas Technology Corp | 半導体記憶装置およびその製造方法 |
JP4895823B2 (ja) * | 2004-12-28 | 2012-03-14 | スパンション エルエルシー | 半導体装置 |
JP2006222203A (ja) | 2005-02-09 | 2006-08-24 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP4679964B2 (ja) * | 2005-05-17 | 2011-05-11 | ルネサスエレクトロニクス株式会社 | 不揮発性半導体記憶装置 |
JP4892199B2 (ja) | 2005-06-06 | 2012-03-07 | ルネサスエレクトロニクス株式会社 | 不揮発性半導体記憶装置の製造方法 |
US7157345B1 (en) * | 2005-06-29 | 2007-01-02 | Freescale Semiconductor, Inc. | Source side injection storage device and method therefor |
US7132329B1 (en) * | 2005-06-29 | 2006-11-07 | Freescale Semiconductor, Inc. | Source side injection storage device with spacer gates and method therefor |
JP2007027760A (ja) * | 2005-07-18 | 2007-02-01 | Saifun Semiconductors Ltd | 高密度不揮発性メモリアレイ及び製造方法 |
US7112490B1 (en) * | 2005-07-25 | 2006-09-26 | Freescale Semiconductor, Inc. | Hot carrier injection programmable structure including discontinuous storage elements and spacer control gates in a trench |
US7619275B2 (en) * | 2005-07-25 | 2009-11-17 | Freescale Semiconductor, Inc. | Process for forming an electronic device including discontinuous storage elements |
US7262997B2 (en) * | 2005-07-25 | 2007-08-28 | Freescale Semiconductor, Inc. | Process for operating an electronic device including a memory array and conductive lines |
US7642594B2 (en) * | 2005-07-25 | 2010-01-05 | Freescale Semiconductor, Inc | Electronic device including gate lines, bit lines, or a combination thereof |
US7582929B2 (en) * | 2005-07-25 | 2009-09-01 | Freescale Semiconductor, Inc | Electronic device including discontinuous storage elements |
US7619270B2 (en) * | 2005-07-25 | 2009-11-17 | Freescale Semiconductor, Inc. | Electronic device including discontinuous storage elements |
KR100706791B1 (ko) * | 2005-07-29 | 2007-04-12 | 삼성전자주식회사 | 비휘발성 기억 장치, 그 형성 방법 및 동작 방법 |
US8921193B2 (en) * | 2006-01-17 | 2014-12-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pre-gate dielectric process using hydrogen annealing |
JP2007207380A (ja) | 2006-02-03 | 2007-08-16 | Renesas Technology Corp | 不揮発性半導体記憶装置 |
US7592224B2 (en) | 2006-03-30 | 2009-09-22 | Freescale Semiconductor, Inc | Method of fabricating a storage device including decontinuous storage elements within and between trenches |
US7598561B2 (en) * | 2006-05-05 | 2009-10-06 | Silicon Storage Technolgy, Inc. | NOR flash memory |
JP4856488B2 (ja) * | 2006-07-27 | 2012-01-18 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US7518912B2 (en) * | 2006-08-25 | 2009-04-14 | Powerchip Semiconductor Corp. | Multi-level non-volatile memory |
JP4364225B2 (ja) | 2006-09-15 | 2009-11-11 | 株式会社東芝 | 半導体装置およびその製造方法 |
KR100855978B1 (ko) * | 2006-11-03 | 2008-09-02 | 삼성전자주식회사 | 비휘발성 메모리 소자, 그 적층 구조, 그 동작 방법, 그제조방법 및 비휘발성 메모리 소자를 이용한 시스템 |
US7651916B2 (en) * | 2007-01-24 | 2010-01-26 | Freescale Semiconductor, Inc | Electronic device including trenches and discontinuous storage elements and processes of forming and using the same |
US7572699B2 (en) * | 2007-01-24 | 2009-08-11 | Freescale Semiconductor, Inc | Process of forming an electronic device including fins and discontinuous storage elements |
US7838922B2 (en) * | 2007-01-24 | 2010-11-23 | Freescale Semiconductor, Inc. | Electronic device including trenches and discontinuous storage elements |
US7535758B2 (en) * | 2007-02-06 | 2009-05-19 | Maxim Integrated Products, Inc. | One or multiple-times programmable device |
US7773429B2 (en) | 2007-02-22 | 2010-08-10 | Hynix Semiconductor Inc. | Non-volatile memory device and driving method thereof |
KR100854871B1 (ko) * | 2007-05-07 | 2008-08-28 | 주식회사 하이닉스반도체 | 비휘발성 메모리 소자 및 이를 이용한 프로그램 방법 |
JP5164400B2 (ja) * | 2007-03-12 | 2013-03-21 | ルネサスエレクトロニクス株式会社 | 不揮発性半導体記憶装置 |
US7719359B1 (en) | 2007-07-31 | 2010-05-18 | Maxim Integrated Products, Inc. | Low noise variable gain amplifier |
US8320191B2 (en) | 2007-08-30 | 2012-11-27 | Infineon Technologies Ag | Memory cell arrangement, method for controlling a memory cell, memory array and electronic device |
US8355278B2 (en) * | 2007-10-05 | 2013-01-15 | Micron Technology, Inc. | Reducing effects of program disturb in a memory device |
JP2010050208A (ja) * | 2008-08-20 | 2010-03-04 | Renesas Technology Corp | 半導体記憶装置 |
JP2010267341A (ja) * | 2009-05-15 | 2010-11-25 | Renesas Electronics Corp | 半導体装置 |
JP2011044222A (ja) * | 2009-07-22 | 2011-03-03 | Toshiba Corp | Nand型フラッシュメモリ |
US8488388B2 (en) * | 2011-11-01 | 2013-07-16 | Silicon Storage Technology, Inc. | Method of programming a split gate non-volatile floating gate memory cell having a separate erase gate |
WO2014151781A1 (en) * | 2013-03-15 | 2014-09-25 | Microchip Technology Incorporated | Eeprom memory cell with low voltage read path and high voltage erase/write path |
CN103811061B (zh) * | 2014-03-05 | 2016-08-24 | 上海华虹宏力半导体制造有限公司 | Eeprom及其存储阵列 |
US10074438B2 (en) * | 2016-06-10 | 2018-09-11 | Cypress Semiconductor Corporation | Methods and devices for reducing program disturb in non-volatile memory cell arrays |
US9997253B1 (en) | 2016-12-08 | 2018-06-12 | Cypress Semiconductor Corporation | Non-volatile memory array with memory gate line and source line scrambling |
US10930731B2 (en) * | 2018-10-19 | 2021-02-23 | Mediatek Singapore Pte. Ltd. | Integrated circuit device |
US10998325B2 (en) * | 2018-12-03 | 2021-05-04 | Silicon Storage Technology, Inc. | Memory cell with floating gate, coupling gate and erase gate, and method of making same |
CN112951833B (zh) * | 2019-12-11 | 2023-06-16 | 力旺电子股份有限公司 | 具隔离阱区的存储单元及其相关非挥发性存储器 |
US11309324B2 (en) * | 2020-07-28 | 2022-04-19 | Globalfoundries Singapore Pte. Ltd. | Compact memory cell with a shared conductive word line and methods of making such a memory cell |
Citations (3)
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EP0326465A1 (fr) * | 1988-01-26 | 1989-08-02 | STMicroelectronics S.A. | Mémoire EEPROM à grille flottante avec transistor de sélection de ligne de source |
US5097444A (en) * | 1989-11-29 | 1992-03-17 | Rohm Corporation | Tunnel EEPROM with overerase protection |
DE19500380A1 (de) * | 1994-05-20 | 1995-11-23 | Mitsubishi Electric Corp | Aktivmatrix-Flüssigkristallanzeige und Herstellungsverfahren dafür |
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JPH0671067B2 (ja) | 1985-11-20 | 1994-09-07 | 株式会社日立製作所 | 半導体装置 |
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JP2001217423A (ja) * | 2000-02-01 | 2001-08-10 | Sony Corp | 薄膜半導体装置及び表示装置とその製造方法 |
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-
1999
- 1999-07-14 JP JP20024299A patent/JP4012341B2/ja not_active Expired - Fee Related
-
2000
- 2000-06-21 TW TW089112207A patent/TW454353B/zh not_active IP Right Cessation
- 2000-07-11 EP EP00114845A patent/EP1069619A3/en not_active Withdrawn
- 2000-07-13 SG SG200003919A patent/SG118065A1/en unknown
- 2000-07-13 US US09/616,072 patent/US6438028B1/en not_active Expired - Lifetime
- 2000-07-13 SG SG200302610A patent/SG108920A1/en unknown
- 2000-07-13 KR KR1020000040173A patent/KR100650470B1/ko not_active IP Right Cessation
- 2000-07-14 CN CNB001202537A patent/CN100369253C/zh not_active Expired - Fee Related
-
2002
- 2002-07-30 US US10/206,982 patent/US6687156B2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0326465A1 (fr) * | 1988-01-26 | 1989-08-02 | STMicroelectronics S.A. | Mémoire EEPROM à grille flottante avec transistor de sélection de ligne de source |
US5097444A (en) * | 1989-11-29 | 1992-03-17 | Rohm Corporation | Tunnel EEPROM with overerase protection |
DE19500380A1 (de) * | 1994-05-20 | 1995-11-23 | Mitsubishi Electric Corp | Aktivmatrix-Flüssigkristallanzeige und Herstellungsverfahren dafür |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100650470B1 (ko) * | 1999-07-14 | 2006-11-28 | 가부시키가이샤 히타치세이사쿠쇼 | 반도체 집적 회로 장치와 그 제조 방법 및 그 동작 방법 |
Also Published As
Publication number | Publication date |
---|---|
CN1281258A (zh) | 2001-01-24 |
EP1069619A3 (en) | 2003-05-14 |
SG118065A1 (en) | 2006-01-27 |
US6687156B2 (en) | 2004-02-03 |
TW454353B (en) | 2001-09-11 |
EP1069619A2 (en) | 2001-01-17 |
US20020191458A1 (en) | 2002-12-19 |
CN100369253C (zh) | 2008-02-13 |
KR20010029937A (ko) | 2001-04-16 |
US6438028B1 (en) | 2002-08-20 |
KR100650470B1 (ko) | 2006-11-28 |
JP4012341B2 (ja) | 2007-11-21 |
JP2001028428A (ja) | 2001-01-30 |
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