SG10201801373RA - Substrate polisher and polishing method - Google Patents
Substrate polisher and polishing methodInfo
- Publication number
- SG10201801373RA SG10201801373RA SG10201801373RA SG10201801373RA SG10201801373RA SG 10201801373R A SG10201801373R A SG 10201801373RA SG 10201801373R A SG10201801373R A SG 10201801373RA SG 10201801373R A SG10201801373R A SG 10201801373RA SG 10201801373R A SG10201801373R A SG 10201801373RA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- polisher
- polishing
- polishing member
- polishing method
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 8
- 238000005498 polishing Methods 0.000 title abstract 7
- 238000000034 method Methods 0.000 title abstract 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
- B24B21/12—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving a contact wheel or roller pressing the belt against the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0084—Other grinding machines or devices the grinding wheel support being angularly adjustable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017031243A JP2018134710A (ja) | 2017-02-22 | 2017-02-22 | 基板の研磨装置および研磨方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201801373RA true SG10201801373RA (en) | 2018-09-27 |
Family
ID=63166818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201801373RA SG10201801373RA (en) | 2017-02-22 | 2018-02-20 | Substrate polisher and polishing method |
Country Status (6)
Country | Link |
---|---|
US (1) | US20180236630A1 (zh) |
JP (1) | JP2018134710A (zh) |
KR (1) | KR20180097136A (zh) |
CN (1) | CN108453618A (zh) |
SG (1) | SG10201801373RA (zh) |
TW (1) | TW201900338A (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6884015B2 (ja) * | 2017-03-22 | 2021-06-09 | 株式会社荏原製作所 | 基板の研磨装置および研磨方法 |
CN109227388A (zh) * | 2018-09-19 | 2019-01-18 | 大连理工大学 | 一种环抛机盘面修整系统及其工作方法 |
JP7145084B2 (ja) | 2019-01-11 | 2022-09-30 | 株式会社荏原製作所 | 基板処理装置および基板処理装置において部分研磨されるべき領域を特定する方法 |
US11235454B2 (en) * | 2019-01-14 | 2022-02-01 | Dynabrade, Inc. | Spring loaded adjustable head |
JP7317532B2 (ja) * | 2019-03-19 | 2023-07-31 | キオクシア株式会社 | 研磨装置及び研磨方法 |
TWI834195B (zh) * | 2019-04-18 | 2024-03-01 | 美商應用材料股份有限公司 | Cmp期間基於溫度的原位邊緣不對稱校正的電腦可讀取儲存媒體 |
TWI797501B (zh) | 2019-11-22 | 2023-04-01 | 美商應用材料股份有限公司 | 在拋光墊中使用溝槽的晶圓邊緣不對稱校正 |
JP7442314B2 (ja) * | 2019-12-24 | 2024-03-04 | 東京エレクトロン株式会社 | 基板処理装置、および基板処理方法 |
JP7387471B2 (ja) * | 2020-02-05 | 2023-11-28 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
JP7341918B2 (ja) * | 2020-02-06 | 2023-09-11 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
CN111482891A (zh) * | 2020-04-20 | 2020-08-04 | 北京烁科精微电子装备有限公司 | 一种化学机械平坦化设备 |
JP2022033603A (ja) * | 2020-08-17 | 2022-03-02 | キオクシア株式会社 | 研磨装置および研磨方法 |
CN114012605B (zh) * | 2022-01-05 | 2022-05-17 | 杭州众硅电子科技有限公司 | 一种抛光垫修整装置 |
CN116460667B (zh) * | 2022-12-30 | 2023-11-07 | 北京创思工贸有限公司 | 氟化钙光学零件的加工方法 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3943666A (en) * | 1974-07-31 | 1976-03-16 | Dysan Corporation | Method and apparatus for burnishing flexible recording material |
US4347689A (en) * | 1980-10-20 | 1982-09-07 | Verbatim Corporation | Method for burnishing |
JPS59173555U (ja) * | 1984-01-17 | 1984-11-20 | 株式会社ノリタケカンパニーリミテド | 研削砥石を傾斜させた研削装置に用いられる傾斜フランジ |
US4958463A (en) * | 1988-06-06 | 1990-09-25 | United Technologies Corporation | Optical surface quality improving arrangement |
JPH033765A (ja) * | 1989-05-29 | 1991-01-09 | Sony Corp | 剛性基板の表面処理方法 |
JPH04322964A (ja) * | 1991-04-22 | 1992-11-12 | Amada Washino Co Ltd | 研削制御装置 |
JPH074750B2 (ja) * | 1992-12-03 | 1995-01-25 | 株式会社松田精機 | フイルム研磨材を用いた平面研磨装置 |
JP3020800B2 (ja) * | 1994-05-16 | 2000-03-15 | 株式会社ノリタケカンパニーリミテド | 疵取り用研削装置 |
JPH0811042A (ja) * | 1994-06-30 | 1996-01-16 | Nippondenso Co Ltd | 平面研削加工方法 |
JPH0947947A (ja) * | 1994-08-30 | 1997-02-18 | Seiko Seiki Co Ltd | 研削装置、並びに研削方法、並びに半導体装置及び半導体基板の製造方法 |
JPH08108360A (ja) * | 1994-10-11 | 1996-04-30 | Fuji Photo Film Co Ltd | ガラス基板の研磨装置 |
JPH10329015A (ja) * | 1997-03-24 | 1998-12-15 | Canon Inc | 研磨装置および研磨方法 |
JPH11285978A (ja) * | 1998-04-03 | 1999-10-19 | Ebara Corp | 砥石の保持構造及び研磨装置 |
JP3652163B2 (ja) * | 1999-03-15 | 2005-05-25 | キヤノン株式会社 | 研磨方法 |
JP2001353659A (ja) * | 2000-06-16 | 2001-12-25 | Okamoto Machine Tool Works Ltd | 研磨ウエハの研磨合否判定方法 |
US6811680B2 (en) * | 2001-03-14 | 2004-11-02 | Applied Materials Inc. | Planarization of substrates using electrochemical mechanical polishing |
JP2003282493A (ja) * | 2001-08-14 | 2003-10-03 | Sony Corp | 研磨装置および研磨方法 |
US6875086B2 (en) * | 2003-01-10 | 2005-04-05 | Intel Corporation | Surface planarization |
CN1822905A (zh) * | 2003-06-06 | 2006-08-23 | P.C.T.系统公司 | 用兆频声波能量处理基片的方法和设备 |
JP2005177925A (ja) * | 2003-12-19 | 2005-07-07 | Olympus Corp | 研磨加工方法 |
JP4406772B2 (ja) * | 2005-04-01 | 2010-02-03 | 株式会社サンシン | 板状部材表面傷修復装置 |
JP2009190109A (ja) * | 2008-02-13 | 2009-08-27 | Lasertec Corp | 基板保持装置及び基板加工装置 |
JP5369478B2 (ja) * | 2008-04-11 | 2013-12-18 | 株式会社ニコン | 研磨装置 |
US9393669B2 (en) * | 2011-10-21 | 2016-07-19 | Strasbaugh | Systems and methods of processing substrates |
US10065288B2 (en) | 2012-02-14 | 2018-09-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing (CMP) platform for local profile control |
CN103231303B (zh) * | 2013-05-15 | 2016-02-24 | 清华大学 | 化学机械抛光设备 |
-
2017
- 2017-02-22 JP JP2017031243A patent/JP2018134710A/ja active Pending
-
2018
- 2018-02-12 TW TW107104944A patent/TW201900338A/zh unknown
- 2018-02-14 CN CN201810151773.8A patent/CN108453618A/zh active Pending
- 2018-02-19 KR KR1020180019296A patent/KR20180097136A/ko not_active Application Discontinuation
- 2018-02-20 SG SG10201801373RA patent/SG10201801373RA/en unknown
- 2018-02-20 US US15/900,140 patent/US20180236630A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2018134710A (ja) | 2018-08-30 |
US20180236630A1 (en) | 2018-08-23 |
KR20180097136A (ko) | 2018-08-30 |
TW201900338A (zh) | 2019-01-01 |
CN108453618A (zh) | 2018-08-28 |
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