SG10201707975VA - Testing apparatus and method for microcircuit and wafer level ic testing - Google Patents

Testing apparatus and method for microcircuit and wafer level ic testing

Info

Publication number
SG10201707975VA
SG10201707975VA SG10201707975VA SG10201707975VA SG10201707975VA SG 10201707975V A SG10201707975V A SG 10201707975VA SG 10201707975V A SG10201707975V A SG 10201707975VA SG 10201707975V A SG10201707975V A SG 10201707975VA SG 10201707975V A SG10201707975V A SG 10201707975VA
Authority
SG
Singapore
Prior art keywords
testing
microcircuit
wafer level
testing apparatus
wafer
Prior art date
Application number
SG10201707975VA
Other languages
English (en)
Inventor
John Debauche
Dan Campion
Michael Andres
Steve Rott
Jeffrey Sherry
Brian Halvorson
Brian Eshult
Original Assignee
Johnstech Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnstech Int Corp filed Critical Johnstech Int Corp
Publication of SG10201707975VA publication Critical patent/SG10201707975VA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
SG10201707975VA 2013-07-11 2014-07-10 Testing apparatus and method for microcircuit and wafer level ic testing SG10201707975VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361845042P 2013-07-11 2013-07-11
US201462019300P 2014-06-30 2014-06-30

Publications (1)

Publication Number Publication Date
SG10201707975VA true SG10201707975VA (en) 2017-10-30

Family

ID=52276617

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201707975VA SG10201707975VA (en) 2013-07-11 2014-07-10 Testing apparatus and method for microcircuit and wafer level ic testing
SG11201510255QA SG11201510255QA (en) 2013-07-11 2014-07-10 Testing apparatus for wafer level ic testing

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201510255QA SG11201510255QA (en) 2013-07-11 2014-07-10 Testing apparatus for wafer level ic testing

Country Status (9)

Country Link
US (1) US9696347B2 (de)
EP (1) EP3019879A4 (de)
CN (1) CN105358991B (de)
HK (1) HK1215604A1 (de)
MY (1) MY174175A (de)
PH (1) PH12016500056B1 (de)
SG (2) SG10201707975VA (de)
TW (1) TWI640789B (de)
WO (1) WO2015006625A2 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI521212B (zh) * 2014-03-10 2016-02-11 A method and a method of assembling a vertical probe device, and a vertical probe device
TWI651539B (zh) * 2014-03-10 2019-02-21 美商瓊斯科技國際公司 晶圓級積體電路探針陣列及建構方法
TW201636622A (zh) 2015-03-13 2016-10-16 探針科技公司 包含在不同操作條件下於各導孔中具改良式滑動及於測試頭中正確夾握之垂直探針的測試頭
TWI704352B (zh) * 2015-03-13 2020-09-11 義大利商探針科技公司 測試頭之接觸探針
WO2016156002A1 (en) 2015-03-31 2016-10-06 Technoprobe S.P.A. Contact probe and corresponding testing head with vertical probes, particularly for high frequency applications
US10274515B1 (en) * 2015-08-07 2019-04-30 Johnstech International Corporation Waveguide integrated testing
US10067164B2 (en) 2015-08-24 2018-09-04 Johnstech International Corporation Testing apparatus and method for microcircuit testing with conical bias pad and conductive test pin rings
TWI564569B (zh) * 2015-09-21 2017-01-01 旺矽科技股份有限公司 探針結構及其製造方法
JP6407128B2 (ja) * 2015-11-18 2018-10-17 三菱電機株式会社 半導体装置の評価装置および半導体装置の評価方法
TWI576591B (zh) * 2016-02-03 2017-04-01 京元電子股份有限公司 探針卡組裝結構與其組裝方法、以及由該探針卡組裝結構取出斷針的方法
KR101882209B1 (ko) 2016-03-23 2018-07-27 리노공업주식회사 동축 테스트소켓 조립체
US10598696B2 (en) * 2016-03-28 2020-03-24 Intel Corporation Probe pins with etched tips for electrical die test
KR20190013732A (ko) * 2016-05-31 2019-02-11 니혼덴산리드가부시키가이샤 접촉 도전 지그, 및 검사 장치
WO2018093109A2 (en) * 2016-11-21 2018-05-24 Leeno Industrial Inc. Probe for testing device
KR102015798B1 (ko) * 2016-11-21 2019-08-29 리노공업주식회사 검사장치용 프로브
IT201700017037A1 (it) * 2017-02-15 2018-08-15 Technoprobe Spa Scheda di misura per applicazioni ad alta frequenza
IT201700021400A1 (it) * 2017-02-24 2018-08-24 Technoprobe Spa Testa di misura a sonde verticali con migliorate proprietà in frequenza
CN108241078B (zh) 2017-05-18 2020-06-02 苏州韬盛电子科技有限公司 垂直探针卡
TWI641839B (zh) * 2017-08-18 2018-11-21 中華精測科技股份有限公司 偵測裝置
KR101962644B1 (ko) * 2017-08-23 2019-03-28 리노공업주식회사 검사프로브 및 이를 사용한 검사장치
US10725091B2 (en) * 2017-08-28 2020-07-28 Teradyne, Inc. Automated test system having multiple stages
WO2019116512A1 (ja) * 2017-12-14 2019-06-20 オムロン株式会社 ソケット、検査治具、検査ユニットおよび検査装置
TWI638168B (zh) * 2018-04-03 2018-10-11 中華精測科技股份有限公司 探針卡裝置及探針座
WO2020053784A1 (en) * 2018-09-11 2020-03-19 Magicmotorsport Di Bogdan Jan Skutkiewicz Probe for tools for carrying out tests on electrical and/or electronic circuits and assembly comprising the probe
US10734296B2 (en) * 2018-12-28 2020-08-04 Micron Technology, Inc. Electrical device with test pads encased within the packaging material
TWI724482B (zh) * 2019-08-01 2021-04-11 迅得機械股份有限公司 探針模組
IT201900024889A1 (it) * 2019-12-19 2021-06-19 Technoprobe Spa Sonda di contatto per applicazioni ad alta frequenza con migliorata portata di corrente
TWI762320B (zh) * 2020-05-26 2022-04-21 中華精測科技股份有限公司 彈簧探針
CN111983424A (zh) * 2020-07-30 2020-11-24 华润赛美科微电子(深圳)有限公司 测试治具及测试设备
US11293976B1 (en) * 2020-09-25 2022-04-05 Essai, Inc. Integrated circuit device test tooling with dual angle cavities
CN112630539B (zh) * 2020-12-14 2024-03-29 深圳市燕麦科技股份有限公司 一种用于fpc性能测试的测试针模以及测试装置
CN113058883B (zh) * 2021-03-25 2023-09-12 中国电子科技集团公司第三十八研究所 一种多工位集成联动式自动化检测机构
KR102597311B1 (ko) * 2021-08-24 2023-11-02 윌테크놀러지(주) 미세피치 대응이 가능한 프로브 카드
CN114200278B (zh) * 2021-11-29 2022-12-27 强一半导体（苏州）有限公司 一种薄膜探针卡及其探针头
WO2024062560A1 (ja) * 2022-09-21 2024-03-28 日本電子材料株式会社 プローブカード用プローブ

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5066907A (en) * 1990-02-06 1991-11-19 Cerprobe Corporation Probe system for device and circuit testing
US5632631A (en) 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
KR0135244B1 (en) * 1994-07-12 1998-04-25 Hyundai Electronics Ind Probe card
JPH11344510A (ja) * 1998-06-02 1999-12-14 Advantest Corp プローブカード、プローブ及び半導体試験装置
US6579804B1 (en) * 1998-11-30 2003-06-17 Advantest, Corp. Contact structure and production method thereof and probe contact assembly using same
US6759861B2 (en) * 2002-07-30 2004-07-06 Intel Corporation Thin film probe card contact drive system
JP2004132971A (ja) * 2002-09-17 2004-04-30 Iwasaki Correspond Industry Co Ltd プローブカード
DE112005003580B4 (de) * 2005-05-23 2013-05-16 Kabushiki Kaisha Nihon Micronics Sondenanordnung, Verfahren zu ihrer Herstellung und elektrische Verbindungsvorrichtung
US8026600B2 (en) * 2008-01-02 2011-09-27 Samsung Electronics Co., Ltd. Controlled impedance structures for high density interconnections
US20090166065A1 (en) 2008-01-02 2009-07-02 Clayton James E Thin multi-chip flex module
JP2010091349A (ja) * 2008-10-06 2010-04-22 Japan Electronic Materials Corp 垂直型プローブカード
CN201266222Y (zh) * 2008-10-10 2009-07-01 环隆电气股份有限公司 测试装置
CN101750525B (zh) * 2008-12-22 2012-07-04 京元电子股份有限公司 测试插座的制作方法及其所使用的弹性测试探针
US20130002285A1 (en) 2010-03-10 2013-01-03 Johnstech International Corporation Electrically Conductive Pins For Microcircuit Tester
IT1395561B1 (it) * 2009-09-03 2012-09-28 Applied Materials Inc Apparato di collaudo e relativo procedimento
TWI534432B (zh) * 2010-09-07 2016-05-21 瓊斯科技國際公司 用於微電路測試器之電氣傳導針腳
US9702904B2 (en) * 2011-03-21 2017-07-11 Formfactor, Inc. Non-linear vertical leaf spring
US8723538B2 (en) * 2011-06-17 2014-05-13 Taiwan Semiconductor Manufacturing Company, Ltd. Probe head formation methods employing guide plate raising assembly mechanism
KR102069145B1 (ko) * 2012-06-20 2020-02-11 존스테크 인터내셔널 코포레이션 웨이퍼 레벨 집적 회로 콘택터 및 공법
JP5156973B1 (ja) 2012-08-24 2013-03-06 株式会社クローバーテクノロジー 異方導電性部材

Also Published As

Publication number Publication date
WO2015006625A2 (en) 2015-01-15
SG11201510255QA (en) 2016-01-28
TWI640789B (zh) 2018-11-11
WO2015006625A3 (en) 2015-03-12
EP3019879A4 (de) 2017-08-16
US9696347B2 (en) 2017-07-04
HK1215604A1 (zh) 2016-09-02
CN105358991A (zh) 2016-02-24
PH12016500056A1 (en) 2016-03-28
TW201512678A (zh) 2015-04-01
CN105358991B (zh) 2019-03-19
MY174175A (en) 2020-03-12
US20150015287A1 (en) 2015-01-15
EP3019879A2 (de) 2016-05-18
PH12016500056B1 (en) 2016-03-28

Similar Documents

Publication Publication Date Title
HK1215604A1 (zh) 用於微電路和晶圓級 測試的測試裝置和方法
SG11201708695PA (en) Pre-alignment device and method for wafer
HK1200546A1 (en) Test apparatus and test method based on dfdau dfdau
SG10201501282VA (en) Semiconductor device and method of forming encapsulatedwafer level chip scale package (ewlcsp)
SG11201405431TA (en) Method and apparatus for manufacturing semiconductor device
SG11201802518XA (en) Wafer inspection device and wafer inspection method
SG11201503659QA (en) Method and apparatus for cleaning semiconductor wafer
EP3050135A4 (de) Vorrichtung und techniken zur verkapselung einer elektronischen vorrichtung
SG11201802520YA (en) Wafer inspection method and wafer inspection device
KR102365046B9 (ko) 식각 조성물, 식각 방법 및 반도체 소자
IL242526B (en) Test device and method, substrates for their use and method of making a device
SG11201605303XA (en) Silicon wafer pre-alignment device and method therefor
SG10201605928TA (en) Test wafer and using method therefor
SG10201604835TA (en) Semiconductor device inspection device and semiconductor device inspection method
SG11201604486XA (en) Semiconductor wafer processing methods and apparatus
GB2508447B (en) Method and apparatus for testing electronic systems
SG11201607222RA (en) High-planarity probe card for a testing apparatus for electronic devices
SG11201700713QA (en) Device inspection method, probe card, interposer, and inspection apparatus
EP2948620A4 (de) Vorrichtung und verfahren zum ausrichten von bohrlochmessungen
TWI563559B (en) Method and apparatus for substrate rinsing and drying
SG11201601568VA (en) Method for evaluating polishing pad and method for polishing wafer
SG2013084975A (en) An apparatus and method for inspecting asemiconductor package
SG11201705393QA (en) Pre-alignment measuring device and method
GB201304422D0 (en) Test and Method Apparatus
SG11201608239RA (en) Semiconductor wafer weighing apparatus and methods