SG11201601568VA - Method for evaluating polishing pad and method for polishing wafer - Google Patents

Method for evaluating polishing pad and method for polishing wafer

Info

Publication number
SG11201601568VA
SG11201601568VA SG11201601568VA SG11201601568VA SG11201601568VA SG 11201601568V A SG11201601568V A SG 11201601568VA SG 11201601568V A SG11201601568V A SG 11201601568VA SG 11201601568V A SG11201601568V A SG 11201601568VA SG 11201601568V A SG11201601568V A SG 11201601568VA
Authority
SG
Singapore
Prior art keywords
polishing
evaluating
wafer
polishing pad
pad
Prior art date
Application number
SG11201601568VA
Inventor
Yuki Tanaka
Kazuya Sato
Syuichi Kobayashi
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of SG11201601568VA publication Critical patent/SG11201601568VA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
SG11201601568VA 2013-09-19 2014-08-22 Method for evaluating polishing pad and method for polishing wafer SG11201601568VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013194400A JP5967044B2 (en) 2013-09-19 2013-09-19 Polishing pad evaluation method and wafer polishing method
PCT/JP2014/004319 WO2015040795A1 (en) 2013-09-19 2014-08-22 Polishing-pad evaluation method and wafer polishing method

Publications (1)

Publication Number Publication Date
SG11201601568VA true SG11201601568VA (en) 2016-04-28

Family

ID=52688467

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201601568VA SG11201601568VA (en) 2013-09-19 2014-08-22 Method for evaluating polishing pad and method for polishing wafer

Country Status (8)

Country Link
US (1) US10118272B2 (en)
JP (1) JP5967044B2 (en)
KR (1) KR102185646B1 (en)
CN (1) CN105531799B (en)
DE (1) DE112014003792B4 (en)
SG (1) SG11201601568VA (en)
TW (1) TWI644351B (en)
WO (1) WO2015040795A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017058769A1 (en) * 2015-09-28 2017-04-06 Saint-Gobain Abrasives, Inc. Method and apparatus for evaluating bonded abrasive article performance during a cut-off grinding operation
CN107685288B (en) * 2017-09-05 2019-05-10 南京航空航天大学 A kind of free abrasive grain track-detecting method
CN108145594A (en) * 2017-12-21 2018-06-12 上海华力微电子有限公司 The monitoring method and monitoring device of useful time of grinding pad
JP6822518B2 (en) * 2019-05-14 2021-01-27 株式会社Sumco Polishing pad management method and polishing pad management system
US11145556B2 (en) * 2019-11-21 2021-10-12 Carl Zeiss Smt Gmbh Method and device for inspection of semiconductor samples
CN114012604B (en) * 2021-10-27 2024-01-09 长鑫存储技术有限公司 Method, system, electronic equipment and storage medium for cleaning polishing pad

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5934974A (en) * 1997-11-05 1999-08-10 Aplex Group In-situ monitoring of polishing pad wear
JPH11260769A (en) 1998-03-10 1999-09-24 Komatsu Electronic Metals Co Ltd Method for evaluating polishing cloth of semiconductor wafer and manufacture using the method
JP2002150547A (en) 2000-11-06 2002-05-24 Nippon Sheet Glass Co Ltd Method for manufacturing glass substrate for information recording medium
KR100932741B1 (en) 2002-03-28 2009-12-21 신에쯔 한도타이 가부시키가이샤 Wafer double side polishing device and double side polishing method
JP3935757B2 (en) * 2002-03-28 2007-06-27 信越半導体株式会社 Wafer double-side polishing apparatus and double-side polishing method
US6702646B1 (en) * 2002-07-01 2004-03-09 Nevmet Corporation Method and apparatus for monitoring polishing plate condition
JP2005169593A (en) * 2003-12-15 2005-06-30 Nikon Corp Polishing device, polishing method, manufacturing method of semiconductor device using the method, and semiconductor device manufactured by the method
JP4597634B2 (en) * 2004-11-01 2010-12-15 株式会社荏原製作所 Top ring, substrate polishing apparatus and polishing method
KR101044739B1 (en) 2004-11-01 2011-06-28 가부시키가이샤 에바라 세이사꾸쇼 Polishing apparatus and polishing method
JP2008068338A (en) * 2006-09-12 2008-03-27 Fujitsu Ltd Polisher, polishing method and manufacturing method of semiconductor device
TW200914202A (en) 2007-09-19 2009-04-01 Powerchip Semiconductor Corp Polishing pad conditioner and method for conditioning polishing pad
JP2011035321A (en) * 2009-08-05 2011-02-17 Renesas Electronics Corp Cmp device
JP2011071215A (en) 2009-09-24 2011-04-07 Toshiba Corp Polishing method and semiconductor-device manufacturing method
JP5511600B2 (en) * 2010-09-09 2014-06-04 株式会社荏原製作所 Polishing equipment
JP5291746B2 (en) * 2011-03-22 2013-09-18 株式会社荏原製作所 Polishing equipment

Also Published As

Publication number Publication date
CN105531799A (en) 2016-04-27
JP2015060985A (en) 2015-03-30
US10118272B2 (en) 2018-11-06
TW201528355A (en) 2015-07-16
JP5967044B2 (en) 2016-08-10
CN105531799B (en) 2018-08-28
WO2015040795A1 (en) 2015-03-26
TWI644351B (en) 2018-12-11
KR102185646B1 (en) 2020-12-02
US20160193711A1 (en) 2016-07-07
DE112014003792T5 (en) 2016-05-19
KR20160055805A (en) 2016-05-18
DE112014003792B4 (en) 2024-04-25

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