SG11201700713QA - Device inspection method, probe card, interposer, and inspection apparatus - Google Patents

Device inspection method, probe card, interposer, and inspection apparatus

Info

Publication number
SG11201700713QA
SG11201700713QA SG11201700713QA SG11201700713QA SG11201700713QA SG 11201700713Q A SG11201700713Q A SG 11201700713QA SG 11201700713Q A SG11201700713Q A SG 11201700713QA SG 11201700713Q A SG11201700713Q A SG 11201700713QA SG 11201700713Q A SG11201700713Q A SG 11201700713QA
Authority
SG
Singapore
Prior art keywords
interposer
probe card
inspection apparatus
inspection method
inspection
Prior art date
Application number
SG11201700713QA
Inventor
Tetsuya Kagami
Kanji Suzuki
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG11201700713QA publication Critical patent/SG11201700713QA/en

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/10Test algorithms, e.g. memory scan [MScan] algorithms; Test patterns, e.g. checkerboard patterns 
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • G11C29/56004Pattern generation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889Interfaces, e.g. between probe and tester
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • G11C29/56008Error analysis, representation of errors
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • G11C29/56012Timing aspects, clock generation, synchronisation
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • G11C29/56016Apparatus features
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • G11C2029/5602Interface to device under test

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG11201700713QA 2014-08-01 2015-06-10 Device inspection method, probe card, interposer, and inspection apparatus SG11201700713QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014157753A JP2016035957A (en) 2014-08-01 2014-08-01 Device inspecting method, probe card, interposer, and inspecting device
PCT/JP2015/066660 WO2016017292A1 (en) 2014-08-01 2015-06-10 Device inspection method, probe card, interposer, and inspection apparatus

Publications (1)

Publication Number Publication Date
SG11201700713QA true SG11201700713QA (en) 2017-03-30

Family

ID=55217197

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201700713QA SG11201700713QA (en) 2014-08-01 2015-06-10 Device inspection method, probe card, interposer, and inspection apparatus

Country Status (7)

Country Link
US (1) US20170256324A1 (en)
JP (1) JP2016035957A (en)
KR (1) KR20170038050A (en)
CN (1) CN106662613A (en)
SG (1) SG11201700713QA (en)
TW (1) TWI660183B (en)
WO (1) WO2016017292A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6738236B2 (en) * 2016-08-12 2020-08-12 東京エレクトロン株式会社 Device inspection circuit, device inspection device and probe card
US10333260B2 (en) * 2016-08-31 2019-06-25 Semiconductor Components Industries, Llc High contact resistance detection
JP2018194356A (en) * 2017-05-15 2018-12-06 東京エレクトロン株式会社 Device inspection method
US10677815B2 (en) * 2018-06-08 2020-06-09 Teradyne, Inc. Test system having distributed resources
KR102577446B1 (en) * 2019-02-12 2023-09-11 삼성전자주식회사 A test board, a method for fabricating the test board, a device test apparatus using the test board, and a method for fabricating a semiconductor device using the test board
US11899550B2 (en) * 2020-03-31 2024-02-13 Advantest Corporation Enhanced auxiliary memory mapped interface test systems and methods
KR20210147319A (en) 2020-05-28 2021-12-07 삼성전자주식회사 Burn in board test device and system
US11486926B1 (en) * 2020-12-04 2022-11-01 Xilinx, Inc. Wearout card use count
FR3130066A1 (en) * 2021-12-07 2023-06-09 Hprobe Memory test device and method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0743426B2 (en) * 1989-12-20 1995-05-15 三菱電機株式会社 Ultrasonic obstacle sensor
CA2174784C (en) * 1996-04-23 1999-07-13 George Guozhen Zhong Automatic multi-probe pwb tester
JPH11311661A (en) * 1998-04-30 1999-11-09 Nec Corp Semiconductor device-testing system and method therefor
JP2000346910A (en) * 1999-06-07 2000-12-15 Yamada Denon Kk Measuring device for parallelly and simultaneously testing a large number of ics
US6798225B2 (en) * 2002-05-08 2004-09-28 Formfactor, Inc. Tester channel to multiple IC terminals
DE10306620B4 (en) * 2003-02-18 2007-04-19 Infineon Technologies Ag Integrated test circuit in an integrated circuit
JP3767829B1 (en) * 2005-06-09 2006-04-19 エスティケイテクノロジー株式会社 Semiconductor device inspection equipment
WO2008044391A1 (en) * 2006-10-05 2008-04-17 Advantest Corporation Testing device, testing method, and manufacturing method
JP5193975B2 (en) * 2009-09-04 2013-05-08 富士通株式会社 Semiconductor test circuit, semiconductor test jig, semiconductor test apparatus, and semiconductor test method

Also Published As

Publication number Publication date
US20170256324A1 (en) 2017-09-07
WO2016017292A1 (en) 2016-02-04
KR20170038050A (en) 2017-04-05
CN106662613A (en) 2017-05-10
TW201617633A (en) 2016-05-16
TWI660183B (en) 2019-05-21
JP2016035957A (en) 2016-03-17

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