SG11201700713QA - Device inspection method, probe card, interposer, and inspection apparatus - Google Patents
Device inspection method, probe card, interposer, and inspection apparatusInfo
- Publication number
- SG11201700713QA SG11201700713QA SG11201700713QA SG11201700713QA SG11201700713QA SG 11201700713Q A SG11201700713Q A SG 11201700713QA SG 11201700713Q A SG11201700713Q A SG 11201700713QA SG 11201700713Q A SG11201700713Q A SG 11201700713QA SG 11201700713Q A SG11201700713Q A SG 11201700713QA
- Authority
- SG
- Singapore
- Prior art keywords
- interposer
- probe card
- inspection apparatus
- inspection method
- inspection
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/10—Test algorithms, e.g. memory scan [MScan] algorithms; Test patterns, e.g. checkerboard patterns
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
- G11C29/56004—Pattern generation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
- G11C29/56008—Error analysis, representation of errors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
- G11C29/56012—Timing aspects, clock generation, synchronisation
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
- G11C29/56016—Apparatus features
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
- G11C2029/5602—Interface to device under test
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014157753A JP2016035957A (en) | 2014-08-01 | 2014-08-01 | Device inspecting method, probe card, interposer, and inspecting device |
PCT/JP2015/066660 WO2016017292A1 (en) | 2014-08-01 | 2015-06-10 | Device inspection method, probe card, interposer, and inspection apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201700713QA true SG11201700713QA (en) | 2017-03-30 |
Family
ID=55217197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201700713QA SG11201700713QA (en) | 2014-08-01 | 2015-06-10 | Device inspection method, probe card, interposer, and inspection apparatus |
Country Status (7)
Country | Link |
---|---|
US (1) | US20170256324A1 (en) |
JP (1) | JP2016035957A (en) |
KR (1) | KR20170038050A (en) |
CN (1) | CN106662613A (en) |
SG (1) | SG11201700713QA (en) |
TW (1) | TWI660183B (en) |
WO (1) | WO2016017292A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6738236B2 (en) * | 2016-08-12 | 2020-08-12 | 東京エレクトロン株式会社 | Device inspection circuit, device inspection device and probe card |
US10333260B2 (en) * | 2016-08-31 | 2019-06-25 | Semiconductor Components Industries, Llc | High contact resistance detection |
JP2018194356A (en) * | 2017-05-15 | 2018-12-06 | 東京エレクトロン株式会社 | Device inspection method |
US10677815B2 (en) * | 2018-06-08 | 2020-06-09 | Teradyne, Inc. | Test system having distributed resources |
KR102577446B1 (en) * | 2019-02-12 | 2023-09-11 | 삼성전자주식회사 | A test board, a method for fabricating the test board, a device test apparatus using the test board, and a method for fabricating a semiconductor device using the test board |
US11899550B2 (en) * | 2020-03-31 | 2024-02-13 | Advantest Corporation | Enhanced auxiliary memory mapped interface test systems and methods |
KR20210147319A (en) | 2020-05-28 | 2021-12-07 | 삼성전자주식회사 | Burn in board test device and system |
US11486926B1 (en) * | 2020-12-04 | 2022-11-01 | Xilinx, Inc. | Wearout card use count |
FR3130066A1 (en) * | 2021-12-07 | 2023-06-09 | Hprobe | Memory test device and method |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0743426B2 (en) * | 1989-12-20 | 1995-05-15 | 三菱電機株式会社 | Ultrasonic obstacle sensor |
CA2174784C (en) * | 1996-04-23 | 1999-07-13 | George Guozhen Zhong | Automatic multi-probe pwb tester |
JPH11311661A (en) * | 1998-04-30 | 1999-11-09 | Nec Corp | Semiconductor device-testing system and method therefor |
JP2000346910A (en) * | 1999-06-07 | 2000-12-15 | Yamada Denon Kk | Measuring device for parallelly and simultaneously testing a large number of ics |
US6798225B2 (en) * | 2002-05-08 | 2004-09-28 | Formfactor, Inc. | Tester channel to multiple IC terminals |
DE10306620B4 (en) * | 2003-02-18 | 2007-04-19 | Infineon Technologies Ag | Integrated test circuit in an integrated circuit |
JP3767829B1 (en) * | 2005-06-09 | 2006-04-19 | エスティケイテクノロジー株式会社 | Semiconductor device inspection equipment |
WO2008044391A1 (en) * | 2006-10-05 | 2008-04-17 | Advantest Corporation | Testing device, testing method, and manufacturing method |
JP5193975B2 (en) * | 2009-09-04 | 2013-05-08 | 富士通株式会社 | Semiconductor test circuit, semiconductor test jig, semiconductor test apparatus, and semiconductor test method |
-
2014
- 2014-08-01 JP JP2014157753A patent/JP2016035957A/en active Pending
-
2015
- 2015-06-10 KR KR1020177005706A patent/KR20170038050A/en not_active Application Discontinuation
- 2015-06-10 WO PCT/JP2015/066660 patent/WO2016017292A1/en active Application Filing
- 2015-06-10 SG SG11201700713QA patent/SG11201700713QA/en unknown
- 2015-06-10 US US15/501,151 patent/US20170256324A1/en not_active Abandoned
- 2015-06-10 CN CN201580040295.8A patent/CN106662613A/en active Pending
- 2015-07-23 TW TW104123874A patent/TWI660183B/en active
Also Published As
Publication number | Publication date |
---|---|
US20170256324A1 (en) | 2017-09-07 |
WO2016017292A1 (en) | 2016-02-04 |
KR20170038050A (en) | 2017-04-05 |
CN106662613A (en) | 2017-05-10 |
TW201617633A (en) | 2016-05-16 |
TWI660183B (en) | 2019-05-21 |
JP2016035957A (en) | 2016-03-17 |
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