SG10201510145YA - Liquid processing method, liquid processing apparatus and recording medium - Google Patents

Liquid processing method, liquid processing apparatus and recording medium

Info

Publication number
SG10201510145YA
SG10201510145YA SG10201510145YA SG10201510145YA SG10201510145YA SG 10201510145Y A SG10201510145Y A SG 10201510145YA SG 10201510145Y A SG10201510145Y A SG 10201510145YA SG 10201510145Y A SG10201510145Y A SG 10201510145YA SG 10201510145Y A SG10201510145Y A SG 10201510145YA
Authority
SG
Singapore
Prior art keywords
liquid processing
recording medium
processing apparatus
processing method
liquid
Prior art date
Application number
SG10201510145YA
Other languages
English (en)
Inventor
Hasimoto Takafumi
Hatakeyama Shinichi
Shibata Naoki
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG10201510145YA publication Critical patent/SG10201510145YA/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/162Coating on a rotating support, e.g. using a whirler or a spinner
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Materials For Photolithography (AREA)
SG10201510145YA 2015-01-15 2015-12-10 Liquid processing method, liquid processing apparatus and recording medium SG10201510145YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015006032A JP5931230B1 (ja) 2015-01-15 2015-01-15 液処理方法、液処理装置、及び記録媒体。

Publications (1)

Publication Number Publication Date
SG10201510145YA true SG10201510145YA (en) 2016-08-30

Family

ID=56102974

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201510145YA SG10201510145YA (en) 2015-01-15 2015-12-10 Liquid processing method, liquid processing apparatus and recording medium

Country Status (6)

Country Link
US (1) US9791778B2 (zh)
JP (1) JP5931230B1 (zh)
KR (1) KR102436781B1 (zh)
CN (1) CN105810558B (zh)
SG (1) SG10201510145YA (zh)
TW (1) TWI624308B (zh)

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JP6764713B2 (ja) * 2016-07-05 2020-10-07 株式会社Screenホールディングス 塗布方法
JP6865008B2 (ja) * 2016-09-30 2021-04-28 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
KR102414893B1 (ko) 2016-12-02 2022-06-30 도쿄엘렉트론가부시키가이샤 기판 처리 장치, 기판 처리 방법 및 기억 매체
JP7025872B2 (ja) * 2016-12-02 2022-02-25 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6921605B2 (ja) 2017-04-24 2021-08-18 株式会社Screenホールディングス 塗布方法
JP6899265B2 (ja) * 2017-06-27 2021-07-07 東京エレクトロン株式会社 塗布処理方法、塗布処理装置及び記憶媒体
JP6980457B2 (ja) * 2017-08-23 2021-12-15 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
KR102204885B1 (ko) * 2017-09-14 2021-01-19 세메스 주식회사 기판 처리 방법
JP6994346B2 (ja) * 2017-10-11 2022-01-14 東京エレクトロン株式会社 現像処理装置、現像処理方法及び記憶媒体
JP7092508B2 (ja) * 2018-01-26 2022-06-28 株式会社Screenホールディングス 塗布方法
CN110052366B (zh) * 2019-05-13 2024-04-30 成都金士力科技有限公司 一种用于高低温真空步进电机旋转灌胶设备及灌胶方法
TW202406634A (zh) * 2022-04-28 2024-02-16 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法

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JP2715775B2 (ja) * 1992-01-10 1998-02-18 三菱電機株式会社 半導体製造装置
JP3276449B2 (ja) * 1993-05-13 2002-04-22 富士通株式会社 回転塗布方法
JPH06333807A (ja) * 1993-05-25 1994-12-02 Sony Corp レジスト塗布装置とレジスト塗布方法
JPH0778741A (ja) * 1993-09-06 1995-03-20 Dainippon Screen Mfg Co Ltd 処理液塗布装置及び方法
JPH07235479A (ja) * 1994-02-25 1995-09-05 Fuji Electric Co Ltd 半導体素子の製造方法
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JPH11207250A (ja) * 1998-01-23 1999-08-03 Tokyo Electron Ltd 膜形成方法
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JP2006108433A (ja) * 2004-10-06 2006-04-20 Sharp Corp 半導体装置の製造方法
JP2006135006A (ja) * 2004-11-04 2006-05-25 Sanyo Electric Co Ltd 発光素子
JP2007058200A (ja) * 2005-07-28 2007-03-08 Hoya Corp マスクブランクの製造方法及び露光用マスクの製造方法
JP4868404B2 (ja) * 2007-01-19 2012-02-01 次世代半導体材料技術研究組合 処理方法および処理装置
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JP2011222542A (ja) * 2008-08-21 2011-11-04 Masayoshi Hoshino 発光素子およびその発光色制御システム
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KR101447759B1 (ko) * 2008-12-16 2014-10-06 도쿄엘렉트론가부시키가이샤 도포 처리 방법 및 도포 처리 장치
JP2011023479A (ja) * 2009-07-14 2011-02-03 Sanyo Electric Co Ltd 発光ダイオード装置
US20120187856A1 (en) * 2010-07-23 2012-07-26 Hsien-Jung Huang Package structure of full-color led integrated with driving mechanism and current limiting elements

Also Published As

Publication number Publication date
KR102436781B1 (ko) 2022-08-26
KR20160088225A (ko) 2016-07-25
CN105810558A (zh) 2016-07-27
JP2016134393A (ja) 2016-07-25
US20160209748A1 (en) 2016-07-21
US9791778B2 (en) 2017-10-17
CN105810558B (zh) 2020-03-27
JP5931230B1 (ja) 2016-06-08
TW201639635A (zh) 2016-11-16
TWI624308B (zh) 2018-05-21

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