SG10201509836PA - Method of dividing wafer into dies - Google Patents

Method of dividing wafer into dies

Info

Publication number
SG10201509836PA
SG10201509836PA SG10201509836PA SG10201509836PA SG10201509836PA SG 10201509836P A SG10201509836P A SG 10201509836PA SG 10201509836P A SG10201509836P A SG 10201509836PA SG 10201509836P A SG10201509836P A SG 10201509836PA SG 10201509836P A SG10201509836P A SG 10201509836PA
Authority
SG
Singapore
Prior art keywords
dies
dividing wafer
wafer
dividing
Prior art date
Application number
SG10201509836PA
Other languages
English (en)
Inventor
Heinz Priewasser Karl
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201509836PA publication Critical patent/SG10201509836PA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02013—Grinding, lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Laser Beam Processing (AREA)
SG10201509836PA 2014-12-29 2015-11-30 Method of dividing wafer into dies SG10201509836PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102014227005.7A DE102014227005B4 (de) 2014-12-29 2014-12-29 Verfahren zum Aufteilen eines Wafers in Chips

Publications (1)

Publication Number Publication Date
SG10201509836PA true SG10201509836PA (en) 2016-07-28

Family

ID=56116737

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201509836PA SG10201509836PA (en) 2014-12-29 2015-11-30 Method of dividing wafer into dies

Country Status (8)

Country Link
US (1) US9704749B2 (zh)
JP (1) JP6233936B2 (zh)
KR (1) KR101747561B1 (zh)
CN (1) CN105742212B (zh)
DE (1) DE102014227005B4 (zh)
MY (1) MY175846A (zh)
SG (1) SG10201509836PA (zh)
TW (1) TWI607486B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016112976A1 (de) 2016-07-14 2018-01-18 Infineon Technologies Ag Verfahren zum Bearbeiten eines Wafers und Schichtstapel
KR102030398B1 (ko) * 2017-07-28 2019-10-10 (주) 예스티 웨이퍼 다이싱 방법 및 웨이퍼를 다이싱하기 위한 시스템
KR102030409B1 (ko) * 2017-07-28 2019-10-10 (주) 예스티 웨이퍼 다이싱 방법 및 웨이퍼를 다이싱하기 위한 시스템

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6294439B1 (en) * 1997-07-23 2001-09-25 Kabushiki Kaisha Toshiba Method of dividing a wafer and method of manufacturing a semiconductor device
US6184109B1 (en) * 1997-07-23 2001-02-06 Kabushiki Kaisha Toshiba Method of dividing a wafer and method of manufacturing a semiconductor device
JP2001035817A (ja) * 1999-07-22 2001-02-09 Toshiba Corp ウェーハの分割方法及び半導体装置の製造方法
TWI241674B (en) * 2001-11-30 2005-10-11 Disco Corp Manufacturing method of semiconductor chip
JP3612317B2 (ja) * 2001-11-30 2005-01-19 株式会社東芝 半導体装置の製造方法
JP2003234455A (ja) * 2002-02-07 2003-08-22 Matsushita Electric Ind Co Ltd 電子デバイスの製造方法、電子デバイスおよび電子デバイス装置
JP2004014956A (ja) * 2002-06-11 2004-01-15 Shinko Electric Ind Co Ltd 微小半導体素子の加工処理方法
JP4462997B2 (ja) * 2003-09-26 2010-05-12 株式会社ディスコ ウェーハの加工方法
DE20318462U1 (de) * 2003-11-26 2004-03-11 Infineon Technologies Ag Anordnung elektronischer Halbleiterbauelemente auf einem Trägersystem zur Behandlung der Halbleiterbauelemente mit einem flüssigen Medium
KR20110122869A (ko) * 2004-07-09 2011-11-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Ｉｃ칩 및 그 제조방법
JP2008135446A (ja) 2006-11-27 2008-06-12 Philtech Inc Ｒｆパウダーの製造方法
JP2008258282A (ja) * 2007-04-02 2008-10-23 Toshiba Corp 半導体ウェハのチップ化方法
KR20100118558A (ko) * 2007-12-20 2010-11-05 다테야마 머신 가부시키가이샤 부착재의 부착방법과 부착장치
US8043940B2 (en) * 2008-06-02 2011-10-25 Renesas Electronics Corporation Method for manufacturing semiconductor chip and semiconductor device
JP5308213B2 (ja) * 2009-03-31 2013-10-09 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 半導体装置の製造方法
JP5495647B2 (ja) 2009-07-17 2014-05-21 株式会社ディスコ ウェーハの加工方法
JP2010056562A (ja) * 2009-11-26 2010-03-11 Nitto Denko Corp 半導体チップの製造方法
JP2011159679A (ja) * 2010-01-29 2011-08-18 Furukawa Electric Co Ltd:The チップの製造方法
US9559004B2 (en) * 2011-05-12 2017-01-31 STATS ChipPAC Pte. Ltd. Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energy
JP2013135038A (ja) * 2011-12-26 2013-07-08 Elpida Memory Inc 半導体装置の製造方法
US8580655B2 (en) * 2012-03-02 2013-11-12 Disco Corporation Processing method for bump-included device wafer
JP2014017462A (ja) * 2012-03-02 2014-01-30 Fujifilm Corp 半導体装置の製造方法
JP2014135348A (ja) * 2013-01-09 2014-07-24 Disco Abrasive Syst Ltd ウエーハの加工方法
JP6078376B2 (ja) * 2013-02-22 2017-02-08 株式会社ディスコ ウエーハの加工方法
JP2014165388A (ja) * 2013-02-26 2014-09-08 Renesas Electronics Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
CN105742212A (zh) 2016-07-06
CN105742212B (zh) 2019-08-30
KR101747561B1 (ko) 2017-06-14
TWI607486B (zh) 2017-12-01
TW201635337A (zh) 2016-10-01
US20160190010A1 (en) 2016-06-30
KR20160080075A (ko) 2016-07-07
DE102014227005A1 (de) 2016-06-30
JP2016127273A (ja) 2016-07-11
JP6233936B2 (ja) 2017-11-22
DE102014227005B4 (de) 2023-09-07
MY175846A (en) 2020-07-13
US9704749B2 (en) 2017-07-11

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