SG10201509475VA - Wafer producing method - Google Patents
Wafer producing methodInfo
- Publication number
- SG10201509475VA SG10201509475VA SG10201509475VA SG10201509475VA SG10201509475VA SG 10201509475V A SG10201509475V A SG 10201509475VA SG 10201509475V A SG10201509475V A SG 10201509475VA SG 10201509475V A SG10201509475V A SG 10201509475VA SG 10201509475V A SG10201509475V A SG 10201509475VA
- Authority
- SG
- Singapore
- Prior art keywords
- producing method
- wafer producing
- wafer
- producing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/55—Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/36—Carbides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/06—Joining of crystals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Crystallography & Structural Chemistry (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Laser Beam Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014246229A JP6358941B2 (en) | 2014-12-04 | 2014-12-04 | Wafer generation method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201509475VA true SG10201509475VA (en) | 2016-07-28 |
Family
ID=55974434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201509475VA SG10201509475VA (en) | 2014-12-04 | 2015-11-17 | Wafer producing method |
Country Status (8)
Country | Link |
---|---|
US (1) | US9789565B2 (en) |
JP (1) | JP6358941B2 (en) |
KR (1) | KR102341600B1 (en) |
CN (1) | CN105665949B (en) |
DE (1) | DE102015224318B4 (en) |
MY (1) | MY180538A (en) |
SG (1) | SG10201509475VA (en) |
TW (1) | TWI687560B (en) |
Families Citing this family (30)
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JP6358940B2 (en) * | 2014-12-04 | 2018-07-18 | 株式会社ディスコ | Wafer generation method |
JP6399914B2 (en) * | 2014-12-04 | 2018-10-03 | 株式会社ディスコ | Wafer generation method |
JP6358941B2 (en) | 2014-12-04 | 2018-07-18 | 株式会社ディスコ | Wafer generation method |
JP6399913B2 (en) * | 2014-12-04 | 2018-10-03 | 株式会社ディスコ | Wafer generation method |
JP6391471B2 (en) | 2015-01-06 | 2018-09-19 | 株式会社ディスコ | Wafer generation method |
JP6395633B2 (en) | 2015-02-09 | 2018-09-26 | 株式会社ディスコ | Wafer generation method |
JP6395632B2 (en) | 2015-02-09 | 2018-09-26 | 株式会社ディスコ | Wafer generation method |
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JP6425606B2 (en) * | 2015-04-06 | 2018-11-21 | 株式会社ディスコ | Wafer production method |
JP6429715B2 (en) * | 2015-04-06 | 2018-11-28 | 株式会社ディスコ | Wafer generation method |
JP6456228B2 (en) * | 2015-04-15 | 2019-01-23 | 株式会社ディスコ | Thin plate separation method |
JP6472333B2 (en) | 2015-06-02 | 2019-02-20 | 株式会社ディスコ | Wafer generation method |
JP6478821B2 (en) * | 2015-06-05 | 2019-03-06 | 株式会社ディスコ | Wafer generation method |
JP6482423B2 (en) | 2015-07-16 | 2019-03-13 | 株式会社ディスコ | Wafer generation method |
JP6482425B2 (en) | 2015-07-21 | 2019-03-13 | 株式会社ディスコ | Thinning method of wafer |
JP6472347B2 (en) | 2015-07-21 | 2019-02-20 | 株式会社ディスコ | Thinning method of wafer |
JP6604891B2 (en) * | 2016-04-06 | 2019-11-13 | 株式会社ディスコ | Wafer generation method |
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JP6773539B2 (en) * | 2016-12-06 | 2020-10-21 | 株式会社ディスコ | Wafer generation method |
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CN110102882A (en) * | 2018-02-01 | 2019-08-09 | 松下电器产业株式会社 | Dicing method and slicing device |
US11024501B2 (en) | 2018-12-29 | 2021-06-01 | Cree, Inc. | Carrier-assisted method for parting crystalline material along laser damage region |
US10562130B1 (en) * | 2018-12-29 | 2020-02-18 | Cree, Inc. | Laser-assisted method for parting crystalline material |
US10576585B1 (en) | 2018-12-29 | 2020-03-03 | Cree, Inc. | Laser-assisted method for parting crystalline material |
US10611052B1 (en) | 2019-05-17 | 2020-04-07 | Cree, Inc. | Silicon carbide wafers with relaxed positive bow and related methods |
CN110900015B (en) * | 2020-01-02 | 2022-02-01 | 北京理工大学重庆创新中心 | Multi-laser composite precision machining method for free-form surface optical lens |
CN110900016B (en) * | 2020-01-02 | 2022-02-01 | 北京理工大学重庆创新中心 | Complex micro-nano structure processing method based on laser separation |
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JP6390898B2 (en) | 2014-08-22 | 2018-09-19 | アイシン精機株式会社 | Substrate manufacturing method, workpiece cutting method, and laser processing apparatus |
JP6358941B2 (en) | 2014-12-04 | 2018-07-18 | 株式会社ディスコ | Wafer generation method |
JP6395613B2 (en) * | 2015-01-06 | 2018-09-26 | 株式会社ディスコ | Wafer generation method |
JP6395633B2 (en) | 2015-02-09 | 2018-09-26 | 株式会社ディスコ | Wafer generation method |
JP6395634B2 (en) | 2015-02-09 | 2018-09-26 | 株式会社ディスコ | Wafer generation method |
JP6425606B2 (en) | 2015-04-06 | 2018-11-21 | 株式会社ディスコ | Wafer production method |
JP6472333B2 (en) | 2015-06-02 | 2019-02-20 | 株式会社ディスコ | Wafer generation method |
JP6482389B2 (en) | 2015-06-02 | 2019-03-13 | 株式会社ディスコ | Wafer generation method |
JP6482423B2 (en) | 2015-07-16 | 2019-03-13 | 株式会社ディスコ | Wafer generation method |
JP6486240B2 (en) | 2015-08-18 | 2019-03-20 | 株式会社ディスコ | Wafer processing method |
JP6486239B2 (en) | 2015-08-18 | 2019-03-20 | 株式会社ディスコ | Wafer processing method |
-
2014
- 2014-12-04 JP JP2014246229A patent/JP6358941B2/en active Active
-
2015
- 2015-11-02 TW TW104136024A patent/TWI687560B/en active
- 2015-11-17 SG SG10201509475VA patent/SG10201509475VA/en unknown
- 2015-11-17 MY MYPI2015704149A patent/MY180538A/en unknown
- 2015-11-30 CN CN201510856866.7A patent/CN105665949B/en active Active
- 2015-11-30 US US14/953,718 patent/US9789565B2/en active Active
- 2015-12-03 KR KR1020150171724A patent/KR102341600B1/en active IP Right Grant
- 2015-12-04 DE DE102015224318.4A patent/DE102015224318B4/en active Active
Also Published As
Publication number | Publication date |
---|---|
DE102015224318A1 (en) | 2016-06-09 |
KR20160067783A (en) | 2016-06-14 |
JP2016111150A (en) | 2016-06-20 |
US9789565B2 (en) | 2017-10-17 |
DE102015224318B4 (en) | 2024-05-02 |
US20160158881A1 (en) | 2016-06-09 |
TWI687560B (en) | 2020-03-11 |
KR102341600B1 (en) | 2021-12-22 |
MY180538A (en) | 2020-12-01 |
TW201631228A (en) | 2016-09-01 |
CN105665949A (en) | 2016-06-15 |
JP6358941B2 (en) | 2018-07-18 |
CN105665949B (en) | 2019-04-19 |
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