SG10201505284QA - Polishing apparatus - Google Patents

Polishing apparatus

Info

Publication number
SG10201505284QA
SG10201505284QA SG10201505284QA SG10201505284QA SG10201505284QA SG 10201505284Q A SG10201505284Q A SG 10201505284QA SG 10201505284Q A SG10201505284Q A SG 10201505284QA SG 10201505284Q A SG10201505284Q A SG 10201505284QA SG 10201505284Q A SG10201505284Q A SG 10201505284QA
Authority
SG
Singapore
Prior art keywords
polishing apparatus
polishing
Prior art date
Application number
SG10201505284QA
Other languages
English (en)
Inventor
Hideo Aizawa
Masao Umemoto
Tadakazu Sone
Ryuichi Kosuge
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201505284QA publication Critical patent/SG10201505284QA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG10201505284QA 2014-07-09 2015-07-03 Polishing apparatus SG10201505284QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014141732A JP6259366B2 (ja) 2014-07-09 2014-07-09 研磨装置

Publications (1)

Publication Number Publication Date
SG10201505284QA true SG10201505284QA (en) 2016-02-26

Family

ID=55066894

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201505284QA SG10201505284QA (en) 2014-07-09 2015-07-03 Polishing apparatus

Country Status (4)

Country Link
US (1) US9522453B2 (cg-RX-API-DMAC7.html)
JP (1) JP6259366B2 (cg-RX-API-DMAC7.html)
KR (1) KR102314416B1 (cg-RX-API-DMAC7.html)
SG (1) SG10201505284QA (cg-RX-API-DMAC7.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190299360A1 (en) * 2018-04-02 2019-10-03 Ebara Corporation Polishing apparatus and substrate processing apparatus
JP7050560B2 (ja) * 2018-04-18 2022-04-08 株式会社荏原製作所 研磨装置及び基板処理装置
DE102018121626A1 (de) * 2018-09-05 2020-03-05 Rud. Starcke Gmbh & Co. Kg Poliervorrichtung
US12251785B2 (en) * 2018-09-07 2025-03-18 Hangzhou Sizone Electronic Technology Inc. Chemical mechanical planarization equipment, wafer transfer method, and wafer planarization unit
CN109015314A (zh) * 2018-09-07 2018-12-18 杭州众硅电子科技有限公司 一种化学机械平坦化设备
WO2023042547A1 (ja) * 2021-09-14 2023-03-23 株式会社荏原製作所 基板処理装置、および基板処理方法
CN119368489A (zh) * 2024-11-28 2025-01-28 江苏科沛达半导体科技有限公司 一种晶圆底面清洗装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3002300B2 (ja) * 1991-07-12 2000-01-24 日本トムソン株式会社 球面滑り軸受及びその製造方法
US5303959A (en) * 1993-02-01 1994-04-19 The Johnson Corporation High speed rotary joint
JP3663728B2 (ja) * 1996-03-28 2005-06-22 信越半導体株式会社 薄板の研磨機
US6021695A (en) * 1996-11-11 2000-02-08 Hitachi Seiki Co., Ltd. Lathe and a machining system of a lathe
JPH10235552A (ja) * 1997-02-24 1998-09-08 Ebara Corp ポリッシング装置
JP3192396B2 (ja) * 1997-11-07 2001-07-23 日本ピラー工業株式会社 流体用ロータリジョイント
GB9726981D0 (en) * 1997-12-22 1998-02-18 Rolls Royce Plc Method and apparatus for grinding
JP2000000730A (ja) * 1998-06-12 2000-01-07 Yamato Kikai Kigu Kk 冷凍チャック
JP2000177984A (ja) * 1998-12-16 2000-06-27 Tadano Ltd 油圧作業機のロータリージョイント取付構造
JP2000205469A (ja) * 1999-01-13 2000-07-25 Surpass Kogyo Kk ロ―タリ―ジョイント
US6126207A (en) * 1999-03-08 2000-10-03 The Johnson Corporation Rotary joint with shear pins
JP2000254356A (ja) * 1999-03-12 2000-09-19 Kinki Sharyo Co Ltd 揺動装置
EP1092504B1 (en) * 1999-10-15 2005-12-07 Ebara Corporation Apparatus and method for polishing workpiece
JP3797861B2 (ja) * 2000-09-27 2006-07-19 株式会社荏原製作所 ポリッシング装置
US6402602B1 (en) * 2001-01-04 2002-06-11 Speedfam-Ipec Corporation Rotary union for semiconductor wafer applications
JP2004042163A (ja) * 2002-07-09 2004-02-12 Ebara Corp 研磨装置及びその消耗・交換部品の貼付け剥がし方法
JP2004181586A (ja) * 2002-12-04 2004-07-02 Koyo Seiko Co Ltd 油圧ロータリージョイント及びこれを用いた超仕上機
JP2007222965A (ja) 2006-02-21 2007-09-06 Ebara Corp 研磨テーブルの定盤製造方法、研磨テーブル、及び研磨装置
KR101358645B1 (ko) * 2007-09-04 2014-02-05 삼성전자주식회사 웨이퍼 연마 캐리어 장치 및 그가 채용되는 화학적 기계적연마 설비
JP2009079652A (ja) * 2007-09-26 2009-04-16 Minebea Co Ltd 樹脂ライナ付き球面すべり軸受およびロッドエンド軸受
TWI607499B (zh) * 2013-01-31 2017-12-01 Ebara Corp Polishing device, polishing pad attachment method, and polishing pad replacement method
US20150017889A1 (en) * 2013-07-12 2015-01-15 Ebara Corporation Polishing apparatus
JP6362390B2 (ja) * 2014-04-10 2018-07-25 株式会社荏原製作所 ロータリージョイント、及び、研磨装置

Also Published As

Publication number Publication date
US9522453B2 (en) 2016-12-20
US20160008948A1 (en) 2016-01-14
JP2016016491A (ja) 2016-02-01
KR20160006611A (ko) 2016-01-19
KR102314416B1 (ko) 2021-10-19
JP6259366B2 (ja) 2018-01-10

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