SE516152C2 - Anordning för möjliggörande av trimning på ett substrat samt förfarande för framställning av ett substrat som möjliggör trimning - Google Patents

Anordning för möjliggörande av trimning på ett substrat samt förfarande för framställning av ett substrat som möjliggör trimning

Info

Publication number
SE516152C2
SE516152C2 SE9900960A SE9900960A SE516152C2 SE 516152 C2 SE516152 C2 SE 516152C2 SE 9900960 A SE9900960 A SE 9900960A SE 9900960 A SE9900960 A SE 9900960A SE 516152 C2 SE516152 C2 SE 516152C2
Authority
SE
Sweden
Prior art keywords
substrate
capacitor
trimmable
integrated
trimming
Prior art date
Application number
SE9900960A
Other languages
English (en)
Swedish (sv)
Other versions
SE9900960D0 (sv
SE9900960L (sv
Inventor
Lars-Anders Olofsson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=20414881&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SE516152(C2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9900960A priority Critical patent/SE516152C2/sv
Publication of SE9900960D0 publication Critical patent/SE9900960D0/xx
Priority to TW088106850A priority patent/TW526604B/zh
Priority to CA002367384A priority patent/CA2367384A1/fr
Priority to JP2000606020A priority patent/JP2002539635A/ja
Priority to DE60038548T priority patent/DE60038548T2/de
Priority to EP00919192A priority patent/EP1169718B1/fr
Priority to CNB008050864A priority patent/CN1193381C/zh
Priority to KR1020017011647A priority patent/KR20020002479A/ko
Priority to AU39902/00A priority patent/AU3990200A/en
Priority to PCT/SE2000/000331 priority patent/WO2000055870A1/fr
Priority to AT00919192T priority patent/ATE391996T1/de
Priority to US09/526,534 priority patent/US6664481B1/en
Publication of SE9900960L publication Critical patent/SE9900960L/xx
Publication of SE516152C2 publication Critical patent/SE516152C2/sv
Priority to HK02107211.6A priority patent/HK1045756A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/171—Tuning, e.g. by trimming of printed components or high frequency circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49137—Different components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
SE9900960A 1999-03-17 1999-03-17 Anordning för möjliggörande av trimning på ett substrat samt förfarande för framställning av ett substrat som möjliggör trimning SE516152C2 (sv)

Priority Applications (13)

Application Number Priority Date Filing Date Title
SE9900960A SE516152C2 (sv) 1999-03-17 1999-03-17 Anordning för möjliggörande av trimning på ett substrat samt förfarande för framställning av ett substrat som möjliggör trimning
TW088106850A TW526604B (en) 1999-03-17 1999-04-28 An arrangement for enabling trimming on a substrate and a method of producing a substrate that enables trimming
AT00919192T ATE391996T1 (de) 1999-03-17 2000-02-18 Anordnung und verfahren zum trimmen von elektronischen komponenten auf einem substrat
PCT/SE2000/000331 WO2000055870A1 (fr) 1999-03-17 2000-02-18 Agencement permettant l'ajustage sur un substrat et procede de production d'un substrat permettant l'ajustage
EP00919192A EP1169718B1 (fr) 1999-03-17 2000-02-18 Agencement et methode permettant l'ajustage de composants electroniques sur un substrat
JP2000606020A JP2002539635A (ja) 1999-03-17 2000-02-18 基板上でのトリミングを可能にする装置およびトリミングを可能にする基板を製造する方法
DE60038548T DE60038548T2 (de) 1999-03-17 2000-02-18 Anordnung und verfahren zum trimmen von elektronischen komponenten auf einem substrat
CA002367384A CA2367384A1 (fr) 1999-03-17 2000-02-18 Agencement permettant l'ajustage sur un substrat et procede de production d'un substrat permettant l'ajustage
CNB008050864A CN1193381C (zh) 1999-03-17 2000-02-18 在衬底上允许微调的设备和允许微调衬底的制造方法
KR1020017011647A KR20020002479A (ko) 1999-03-17 2000-02-18 기판상에서 트리밍을 가능하게 하는 장치 및 트리밍을가능하게 하는 기판 제작 방법
AU39902/00A AU3990200A (en) 1999-03-17 2000-02-18 An arrangement for enabling trimming on a substrate and a method of producing a substrate that enables trimming
US09/526,534 US6664481B1 (en) 1999-03-17 2000-03-16 Arrangement for enabling trimming on a substrate and a method of producing a substrate that enables trimming
HK02107211.6A HK1045756A1 (zh) 1999-03-17 2002-09-30 在襯底上允許微調的設備和允許微調襯底的製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9900960A SE516152C2 (sv) 1999-03-17 1999-03-17 Anordning för möjliggörande av trimning på ett substrat samt förfarande för framställning av ett substrat som möjliggör trimning

Publications (3)

Publication Number Publication Date
SE9900960D0 SE9900960D0 (sv) 1999-03-17
SE9900960L SE9900960L (sv) 2000-09-18
SE516152C2 true SE516152C2 (sv) 2001-11-26

Family

ID=20414881

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9900960A SE516152C2 (sv) 1999-03-17 1999-03-17 Anordning för möjliggörande av trimning på ett substrat samt förfarande för framställning av ett substrat som möjliggör trimning

Country Status (13)

Country Link
US (1) US6664481B1 (fr)
EP (1) EP1169718B1 (fr)
JP (1) JP2002539635A (fr)
KR (1) KR20020002479A (fr)
CN (1) CN1193381C (fr)
AT (1) ATE391996T1 (fr)
AU (1) AU3990200A (fr)
CA (1) CA2367384A1 (fr)
DE (1) DE60038548T2 (fr)
HK (1) HK1045756A1 (fr)
SE (1) SE516152C2 (fr)
TW (1) TW526604B (fr)
WO (1) WO2000055870A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW483233B (en) * 2000-05-30 2002-04-11 Alps Electric Co Ltd Electronic circuit unit
FI20001384A (fi) * 2000-06-09 2001-12-10 Nokia Networks Oy Upotetun rakenteen virittäminen
DE10310434A1 (de) 2003-03-11 2004-09-30 Krone Gmbh Verfahren zum HF-Abstimmen einer elektrischen Anordnung sowie eine hierzu geeignete Leiterplatte
CN101336461B (zh) * 2006-01-30 2011-07-20 株式会社村田制作所 多层陶瓷基板的内置电容器的电容值调整方法以及多层陶瓷基板及其制造方法
US8202128B2 (en) 2008-11-25 2012-06-19 Adc Gmbh Telecommunications jack with adjustable crosstalk compensation

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3875479A (en) * 1973-05-07 1975-04-01 Gilbert R Jaggar Electrical apparatus
US4470096A (en) * 1982-06-18 1984-09-04 Motorola Inc. Multilayer, fully-trimmable, film-type capacitor and method of adjustment
DE3301673A1 (de) * 1983-01-20 1984-07-26 Brown, Boveri & Cie Ag, 6800 Mannheim Elektrisches bzw. elektronisches mehrschichtbauelement
JPS60194556A (ja) 1984-03-16 1985-10-03 Nec Corp 抵抗多層印刷基板
JPH0252494A (ja) 1988-08-17 1990-02-22 Nippon Mining Co Ltd 立体プリント配線板の製造方法
DE4340594C2 (de) * 1992-12-01 1998-04-09 Murata Manufacturing Co Verfahren zur Herstellung und zum Einstellen der Charakteristik eines oberflächenmontierbaren chipförmigen LC-Filters
JP3265669B2 (ja) * 1993-01-19 2002-03-11 株式会社デンソー プリント基板
US6728113B1 (en) * 1993-06-24 2004-04-27 Polychip, Inc. Method and apparatus for non-conductively interconnecting integrated circuits
JPH10150308A (ja) * 1996-11-20 1998-06-02 Alps Electric Co Ltd 積層型電子部品
JPH10270496A (ja) * 1997-03-27 1998-10-09 Hitachi Ltd 電子装置、情報処理装置、半導体装置並びに半導体チップの実装方法
WO1999000958A1 (fr) 1997-06-26 1999-01-07 British Telecommunications Plc Transmission de donnees
US6252177B1 (en) * 1998-02-18 2001-06-26 Compaq Computer Corporation Low inductance capacitor mounting structure for capacitors of a printed circuit board
US6134117A (en) * 1999-04-16 2000-10-17 Delphi Technologies, Inc. Method for high resolution trimming of PCB components

Also Published As

Publication number Publication date
DE60038548D1 (de) 2008-05-21
KR20020002479A (ko) 2002-01-09
JP2002539635A (ja) 2002-11-19
WO2000055870A1 (fr) 2000-09-21
SE9900960D0 (sv) 1999-03-17
EP1169718B1 (fr) 2008-04-09
EP1169718A1 (fr) 2002-01-09
CA2367384A1 (fr) 2000-09-21
DE60038548T2 (de) 2008-07-31
TW526604B (en) 2003-04-01
ATE391996T1 (de) 2008-04-15
SE9900960L (sv) 2000-09-18
CN1193381C (zh) 2005-03-16
HK1045756A1 (zh) 2002-12-06
AU3990200A (en) 2000-10-04
CN1343365A (zh) 2002-04-03
US6664481B1 (en) 2003-12-16

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