SE516011C2 - Tätpackade elektriska kontaktdon - Google Patents
Tätpackade elektriska kontaktdonInfo
- Publication number
- SE516011C2 SE516011C2 SE9604677A SE9604677A SE516011C2 SE 516011 C2 SE516011 C2 SE 516011C2 SE 9604677 A SE9604677 A SE 9604677A SE 9604677 A SE9604677 A SE 9604677A SE 516011 C2 SE516011 C2 SE 516011C2
- Authority
- SE
- Sweden
- Prior art keywords
- path
- groove
- bulge
- metal
- contact
- Prior art date
Links
- 239000002184 metal Substances 0.000 claims abstract description 50
- 229910052751 metal Inorganic materials 0.000 claims abstract description 50
- 239000004020 conductor Substances 0.000 claims description 19
- 238000006073 displacement reaction Methods 0.000 abstract description 3
- 238000004377 microelectronic Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 21
- 238000000034 method Methods 0.000 description 19
- 239000000463 material Substances 0.000 description 13
- 238000005266 casting Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 238000005530 etching Methods 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 239000003989 dielectric material Substances 0.000 description 5
- 239000013013 elastic material Substances 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000001459 lithography Methods 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 230000008685 targeting Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010960 commercial process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007736 thin film deposition technique Methods 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
- H01L2224/16147—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked the bump connector connecting to a bonding area disposed in a recess of the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16237—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
- H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
- H01L2224/81141—Guiding structures both on and outside the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8136—Bonding interfaces of the semiconductor or solid state body
- H01L2224/81365—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01024—Chromium [Cr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9604677A SE516011C2 (sv) | 1996-12-19 | 1996-12-19 | Tätpackade elektriska kontaktdon |
TW086100959A TW315518B (en) | 1996-12-19 | 1997-01-29 | High density electrical connectors |
JP52763098A JP3954111B2 (ja) | 1996-12-19 | 1997-12-19 | 高密度電気コネクタ |
DE69736488T DE69736488T2 (de) | 1996-12-19 | 1997-12-19 | Elektrische verbinder mit hoher dichte |
EP97951404A EP0951739B1 (de) | 1996-12-19 | 1997-12-19 | Elektrische verbinder mit hoher dichte |
US08/994,985 US6042391A (en) | 1996-12-19 | 1997-12-19 | High density electrical connectors |
AU55055/98A AU5505598A (en) | 1996-12-19 | 1997-12-19 | High density electrical connectors |
PCT/SE1997/002178 WO1998027596A1 (en) | 1996-12-19 | 1997-12-19 | High density electrical connectors |
CA002275632A CA2275632A1 (en) | 1996-12-19 | 1997-12-19 | High density electrical connectors |
KR1019997005197A KR20000069419A (ko) | 1996-12-19 | 1997-12-19 | 고밀도 전기 커넥터 |
CNB971808694A CN1145216C (zh) | 1996-12-19 | 1997-12-19 | 高密度电连接器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9604677A SE516011C2 (sv) | 1996-12-19 | 1996-12-19 | Tätpackade elektriska kontaktdon |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9604677D0 SE9604677D0 (sv) | 1996-12-19 |
SE9604677L SE9604677L (sv) | 1998-06-20 |
SE516011C2 true SE516011C2 (sv) | 2001-11-05 |
Family
ID=20405043
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9604677A SE516011C2 (sv) | 1996-12-19 | 1996-12-19 | Tätpackade elektriska kontaktdon |
Country Status (11)
Country | Link |
---|---|
US (1) | US6042391A (de) |
EP (1) | EP0951739B1 (de) |
JP (1) | JP3954111B2 (de) |
KR (1) | KR20000069419A (de) |
CN (1) | CN1145216C (de) |
AU (1) | AU5505598A (de) |
CA (1) | CA2275632A1 (de) |
DE (1) | DE69736488T2 (de) |
SE (1) | SE516011C2 (de) |
TW (1) | TW315518B (de) |
WO (1) | WO1998027596A1 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6166437A (en) * | 1999-04-12 | 2000-12-26 | International Business Machines Corporation | Silicon on silicon package with precision align macro |
US6411754B1 (en) | 2000-08-25 | 2002-06-25 | Corning Incorporated | Micromechanical optical switch and method of manufacture |
US6495396B1 (en) * | 2001-08-29 | 2002-12-17 | Sun Microsystems, Inc. | Method of coupling and aligning semiconductor devices including multi-chip semiconductor devices |
CN102305896B (zh) * | 2004-06-21 | 2015-05-13 | 卡普雷斯股份有限公司 | 一种用于提供探头对准的方法 |
US7618844B2 (en) * | 2005-08-18 | 2009-11-17 | Intelleflex Corporation | Method of packaging and interconnection of integrated circuits |
DE102007027434A1 (de) * | 2007-06-14 | 2008-12-18 | X-Fab Semiconductor Foundries Ag | Verfahren zur Herstellung von Justagestrukturen für eine strukturierte Schichtabscheidung auf einem Mikrosystemtechnikwafer mittels einer Beschichtungsmaske |
KR100951456B1 (ko) * | 2007-12-26 | 2010-04-28 | 아이볼타(주) | 전기 접속 시스템 |
US7741652B2 (en) * | 2008-03-07 | 2010-06-22 | Visera Technologies Company Limited | Alignment device and application thereof |
US9136259B2 (en) | 2008-04-11 | 2015-09-15 | Micron Technology, Inc. | Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking |
US9786584B2 (en) | 2012-09-04 | 2017-10-10 | Infineon Technologies Ag | Lateral element isolation device |
US9017092B1 (en) | 2014-05-07 | 2015-04-28 | Microsoft Technology Licensing, Llc | Electronic connector |
US9728915B2 (en) | 2015-05-19 | 2017-08-08 | Microsoft Technology Licensing, Llc | Tapered-fang electronic connector |
US11495560B2 (en) * | 2015-08-10 | 2022-11-08 | X Display Company Technology Limited | Chiplets with connection posts |
US10468363B2 (en) | 2015-08-10 | 2019-11-05 | X-Celeprint Limited | Chiplets with connection posts |
US9660380B1 (en) | 2016-01-22 | 2017-05-23 | Microsoft Technology Licensing, Llc | Alignment tolerant electronic connector |
US9705243B1 (en) | 2016-02-12 | 2017-07-11 | Microsoft Technology Licensing, Llc | Electronic connector with C-shaped tapered extension |
US10750614B2 (en) * | 2017-06-12 | 2020-08-18 | Invensas Corporation | Deformable electrical contacts with conformable target pads |
US10511127B2 (en) | 2018-03-20 | 2019-12-17 | Microsoft Technology Licensing, Llc | High-speed electronic connector |
CN110634828B (zh) * | 2018-06-21 | 2021-11-16 | 矽创电子股份有限公司 | 凸块结构 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3553633A (en) * | 1966-02-28 | 1971-01-05 | Albert A Ondrejka | Multi-contact separable electrical connector |
US3465435A (en) * | 1967-05-08 | 1969-09-09 | Ibm | Method of forming an interconnecting multilayer circuitry |
US4813129A (en) * | 1987-06-19 | 1989-03-21 | Hewlett-Packard Company | Interconnect structure for PC boards and integrated circuits |
US5121299A (en) * | 1989-12-29 | 1992-06-09 | International Business Machines Corporation | Multi-level circuit structure utilizing conductive cores having conductive protrusions and cavities therein |
AU645283B2 (en) * | 1990-01-23 | 1994-01-13 | Sumitomo Electric Industries, Ltd. | Substrate for packaging a semiconductor device |
US5071363A (en) * | 1990-04-18 | 1991-12-10 | Minnesota Mining And Manufacturing Company | Miniature multiple conductor electrical connector |
US5118299A (en) * | 1990-05-07 | 1992-06-02 | International Business Machines Corporation | Cone electrical contact |
US5180311A (en) * | 1991-01-22 | 1993-01-19 | Hughes Aircraft Company | Resilient interconnection bridge |
US5097101A (en) * | 1991-02-05 | 1992-03-17 | Tektronix, Inc. | Method of forming a conductive contact bump on a flexible substrate and a flexible substrate |
CA2135241C (en) * | 1993-12-17 | 1998-08-04 | Mohi Sobhani | Cavity and bump interconnection structure for electronic packages |
DE4438053C2 (de) * | 1994-10-25 | 2002-05-02 | Harting Elektrooptische Bauteile Gmbh & Co Kg | Verfahren zum Herstellen einer elektrisch leitfähigen Struktur |
US5743747A (en) * | 1997-01-13 | 1998-04-28 | Hughes Electronics | Dimpled connector |
-
1996
- 1996-12-19 SE SE9604677A patent/SE516011C2/sv not_active IP Right Cessation
-
1997
- 1997-01-29 TW TW086100959A patent/TW315518B/zh active
- 1997-12-19 EP EP97951404A patent/EP0951739B1/de not_active Expired - Lifetime
- 1997-12-19 JP JP52763098A patent/JP3954111B2/ja not_active Expired - Fee Related
- 1997-12-19 WO PCT/SE1997/002178 patent/WO1998027596A1/en active IP Right Grant
- 1997-12-19 CA CA002275632A patent/CA2275632A1/en not_active Abandoned
- 1997-12-19 DE DE69736488T patent/DE69736488T2/de not_active Expired - Fee Related
- 1997-12-19 AU AU55055/98A patent/AU5505598A/en not_active Abandoned
- 1997-12-19 KR KR1019997005197A patent/KR20000069419A/ko not_active Application Discontinuation
- 1997-12-19 US US08/994,985 patent/US6042391A/en not_active Expired - Fee Related
- 1997-12-19 CN CNB971808694A patent/CN1145216C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0951739B1 (de) | 2006-08-09 |
US6042391A (en) | 2000-03-28 |
SE9604677L (sv) | 1998-06-20 |
CN1241297A (zh) | 2000-01-12 |
EP0951739A1 (de) | 1999-10-27 |
JP3954111B2 (ja) | 2007-08-08 |
DE69736488T2 (de) | 2007-03-15 |
TW315518B (en) | 1997-09-11 |
AU5505598A (en) | 1998-07-15 |
DE69736488D1 (de) | 2006-09-21 |
CN1145216C (zh) | 2004-04-07 |
CA2275632A1 (en) | 1998-06-25 |
WO1998027596A1 (en) | 1998-06-25 |
KR20000069419A (ko) | 2000-11-25 |
SE9604677D0 (sv) | 1996-12-19 |
JP2001506414A (ja) | 2001-05-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SE516011C2 (sv) | Tätpackade elektriska kontaktdon | |
US5262351A (en) | Process for manufacturing a multilayer integrated circuit interconnection | |
US5373627A (en) | Method of forming multi-chip module with high density interconnections | |
US5998875A (en) | Flip-chip type connection with elastic contacts | |
US6310484B1 (en) | Semiconductor test interconnect with variable flexure contacts | |
US6285203B1 (en) | Test system having alignment member for aligning semiconductor components | |
US8218334B2 (en) | Multi-chip module with multi-level interposer | |
US20070023923A1 (en) | Flip chip interface including a mixed array of heat bumps and signal bumps | |
KR20030010549A (ko) | 웨이퍼로부터 반도체 다이를 분리하는 방법 | |
KR980012296A (ko) | 반도체 소자 실장 보드, 그 보드용 제조 방법, 반도체 장치 및 그 장치용 제조 방법 | |
JP2006189430A (ja) | マイクロマシンプローブを搭載した薄膜回路及びその製造法と応用 | |
JP2001506417A (ja) | 集積回路用パッケージ構造 | |
JP2004282072A (ja) | インタポーザ、インタポーザパッケージ、及びそれらを使用したデバイス組立体 | |
EP2493273A1 (de) | Montageträger und montageverfahren für eine vorrichtung | |
KR20010022894A (ko) | 절연 분리를 갖는 실리콘 세그먼트용 수직 인터커넥트 프로세스 | |
EP1187211A2 (de) | Halbleiterstapel | |
EP2006911B1 (de) | Verdrahtungssubstrat | |
SE516748C2 (sv) | Sammansättningsstruktur innefattande minst ett flip-chip och ett substrat | |
JP3450417B2 (ja) | 高密度積層形のコネクタ及びその製造方法 | |
JP3625314B2 (ja) | 超小型電子部品実装用基板の製造方法 | |
EP0607656A1 (de) | Verrichtung mit Dünnschichtüberlagerung um Bandflächen einer Halbleitervorrichtung mit einem Leiterrahmen oder einer flexiblen Leiterplatte zu verbinden und angehörige Herstellungsmethode | |
EP0306890A1 (de) | Halbleitermodul mit aktiven Vorrichtungen, die in Substrathöhlungen angeordnet sind | |
CN115527871A (zh) | 多芯片封装方法及封装结构 | |
CA1228179A (en) | Packaging microminiature devices | |
JP2024516083A (ja) | 極低温プローブカード |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |