JP2001506414A - 高密度電気コネクタ - Google Patents
高密度電気コネクタInfo
- Publication number
- JP2001506414A JP2001506414A JP52763098A JP52763098A JP2001506414A JP 2001506414 A JP2001506414 A JP 2001506414A JP 52763098 A JP52763098 A JP 52763098A JP 52763098 A JP52763098 A JP 52763098A JP 2001506414 A JP2001506414 A JP 2001506414A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- groove
- bump
- signal
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- 239000010931 gold Substances 0.000 description 1
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- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
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- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
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- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16237—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
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- H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
- H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
- H01L2224/81141—Guiding structures both on and outside the body
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- H01L2224/81801—Soldering or alloying
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. 少なくとも第1の部分と第2の部分を備え、前記第1、第2の各部分が少 なくとも1つの傾斜した壁をもっているコネクタにおいて、 第1の部分の傾斜した壁(228、616)と第2の部分の傾斜した壁(23 0、418)が同じ傾斜をもち、前記第1の部分が少なくとも1つの導通回路( 212、606)をもち、前記第2の部分が少なくとも1つの導通回路(224 、608)をもち、前記第1の部分と第2の部分が一緒に組み合わされたとき、 前記導通回路が互いに接触することを特徴とする、前記コネクタ。 2. 前記第1の部分がV溝をもち、前記第2の部分がバンプをもち、前記V溝 (202)が少なくとも1つの導通回路(212)をもち、前記バンプ構造(2 06)が少なくとも1つの導通回路(224)をもち、前記バンプが前記V溝の 中に適合し、前記第1の部分(204)が前記第2の部分(208)と一緒に組 み合わされたとき前記導通回路が互いに接触する、請求項1に記載のコネクタ。 3. 前記第1の部分(204)が金属2層構造、すなわち少なくとも1つの第 1の導通回路(212)と少なくとも1つの第1の接地面(210)をもち、前 記金属層が前記V溝(202)をカバーしていることを特徴とする、請求項2に 記載のコネクタ。 4. 前記第2の部分(208)が金属2層構造、すなわち少なくとも1つの第 2の信号回路(224)と少なくとも1つの第2の接地面(226)をもち、前 記信号回路が前記バンプ(206)を部分的にカバーしていることを特徴とする 、請求項2に記載のコネクタ。 5. 前記第2の部分(208)が、少なくとも1つの導通回路(706)、少 なくとも1つの接地面(702)および誘電体媒体(704)よりなる金属2層 構造をもち、前記接地面と導通回路がバンプ(206)の上部に形成され、前記 誘電体媒体が前記導通回路を前記接地面から分離していることを特徴とする、請 求項2に記載のコネクタ。 6. 前記導通回路が二重密度の金属層からなり、前記第1の部分(204)が 少なくとも1つの第1の信号回路(306)、少なくとも1つの第3の信号回路 (310)、および少なくとも1つの第1の接地面(302)をもち、前記金属 層が前記V溝(202)をカバーし、前記第2の部分(208)が少なくとも1 つの第2の信号回路(308)、少なくとも1つの第4の信号回路(312)、 および少なくとも1つの第2の接地面(304)をもち、前記信号回路は部分的 に前記バンプ(206)をカバーし、前記第1の部分と第2の部分が組み合わさ れたとき、前記第1、第3の信号回路(306、304)と前記第2、第4の信 号回路(310、312)が互いに接触する、ことを特徴とする請求項2に記載 のコネクタ。 7. 前記導通回路が2重密度の金属層からなり、前記第1の部分(204)が少 なくとも1つの第1の信号回路(402)と少なくとも1つの第1の接地面(4 06)をもち、前記第1の信号回路が部分的に前記V溝(202)をカバーし、 前記第2の部分(208)が少なくとも1つの第2の信号回路(408)と少な くとも1つの第2の接地面(408)をもち、前記金属層が前記バンプ(206 )をカバーし、前記第2の接地回路が前記溝をカバーし、前記第1の部分と第2 の部分が組み合わされたとき、前記第1、第2の信号回路と前記第1、第2の接 地回路が互いに接触する、ことを特徴とする請求項2に記載のコネクタ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9604677A SE516011C2 (sv) | 1996-12-19 | 1996-12-19 | Tätpackade elektriska kontaktdon |
SE9604677-6 | 1996-12-19 | ||
PCT/SE1997/002178 WO1998027596A1 (en) | 1996-12-19 | 1997-12-19 | High density electrical connectors |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001506414A true JP2001506414A (ja) | 2001-05-15 |
JP3954111B2 JP3954111B2 (ja) | 2007-08-08 |
Family
ID=20405043
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52763098A Expired - Fee Related JP3954111B2 (ja) | 1996-12-19 | 1997-12-19 | 高密度電気コネクタ |
Country Status (11)
Country | Link |
---|---|
US (1) | US6042391A (ja) |
EP (1) | EP0951739B1 (ja) |
JP (1) | JP3954111B2 (ja) |
KR (1) | KR20000069419A (ja) |
CN (1) | CN1145216C (ja) |
AU (1) | AU5505598A (ja) |
CA (1) | CA2275632A1 (ja) |
DE (1) | DE69736488T2 (ja) |
SE (1) | SE516011C2 (ja) |
TW (1) | TW315518B (ja) |
WO (1) | WO1998027596A1 (ja) |
Cited By (1)
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JP2008503734A (ja) * | 2004-06-21 | 2008-02-07 | カプレス・アクティーゼルスカブ | プローブの位置合せを行なう方法 |
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US6166437A (en) * | 1999-04-12 | 2000-12-26 | International Business Machines Corporation | Silicon on silicon package with precision align macro |
US6411754B1 (en) | 2000-08-25 | 2002-06-25 | Corning Incorporated | Micromechanical optical switch and method of manufacture |
US6495396B1 (en) * | 2001-08-29 | 2002-12-17 | Sun Microsystems, Inc. | Method of coupling and aligning semiconductor devices including multi-chip semiconductor devices |
US7618844B2 (en) * | 2005-08-18 | 2009-11-17 | Intelleflex Corporation | Method of packaging and interconnection of integrated circuits |
DE102007027434A1 (de) * | 2007-06-14 | 2008-12-18 | X-Fab Semiconductor Foundries Ag | Verfahren zur Herstellung von Justagestrukturen für eine strukturierte Schichtabscheidung auf einem Mikrosystemtechnikwafer mittels einer Beschichtungsmaske |
KR100951456B1 (ko) * | 2007-12-26 | 2010-04-28 | 아이볼타(주) | 전기 접속 시스템 |
US7741652B2 (en) * | 2008-03-07 | 2010-06-22 | Visera Technologies Company Limited | Alignment device and application thereof |
US9136259B2 (en) | 2008-04-11 | 2015-09-15 | Micron Technology, Inc. | Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking |
US9786584B2 (en) | 2012-09-04 | 2017-10-10 | Infineon Technologies Ag | Lateral element isolation device |
US9017092B1 (en) | 2014-05-07 | 2015-04-28 | Microsoft Technology Licensing, Llc | Electronic connector |
US9728915B2 (en) | 2015-05-19 | 2017-08-08 | Microsoft Technology Licensing, Llc | Tapered-fang electronic connector |
US10468363B2 (en) | 2015-08-10 | 2019-11-05 | X-Celeprint Limited | Chiplets with connection posts |
US11495560B2 (en) * | 2015-08-10 | 2022-11-08 | X Display Company Technology Limited | Chiplets with connection posts |
US9660380B1 (en) | 2016-01-22 | 2017-05-23 | Microsoft Technology Licensing, Llc | Alignment tolerant electronic connector |
US9705243B1 (en) | 2016-02-12 | 2017-07-11 | Microsoft Technology Licensing, Llc | Electronic connector with C-shaped tapered extension |
US10750614B2 (en) * | 2017-06-12 | 2020-08-18 | Invensas Corporation | Deformable electrical contacts with conformable target pads |
US10511127B2 (en) | 2018-03-20 | 2019-12-17 | Microsoft Technology Licensing, Llc | High-speed electronic connector |
TWI708333B (zh) * | 2018-06-21 | 2020-10-21 | 矽創電子股份有限公司 | 凸塊結構 |
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-
1996
- 1996-12-19 SE SE9604677A patent/SE516011C2/sv not_active IP Right Cessation
-
1997
- 1997-01-29 TW TW086100959A patent/TW315518B/zh active
- 1997-12-19 AU AU55055/98A patent/AU5505598A/en not_active Abandoned
- 1997-12-19 DE DE69736488T patent/DE69736488T2/de not_active Expired - Fee Related
- 1997-12-19 US US08/994,985 patent/US6042391A/en not_active Expired - Fee Related
- 1997-12-19 EP EP97951404A patent/EP0951739B1/en not_active Expired - Lifetime
- 1997-12-19 JP JP52763098A patent/JP3954111B2/ja not_active Expired - Fee Related
- 1997-12-19 CN CNB971808694A patent/CN1145216C/zh not_active Expired - Fee Related
- 1997-12-19 CA CA002275632A patent/CA2275632A1/en not_active Abandoned
- 1997-12-19 WO PCT/SE1997/002178 patent/WO1998027596A1/en active IP Right Grant
- 1997-12-19 KR KR1019997005197A patent/KR20000069419A/ko not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008503734A (ja) * | 2004-06-21 | 2008-02-07 | カプレス・アクティーゼルスカブ | プローブの位置合せを行なう方法 |
Also Published As
Publication number | Publication date |
---|---|
US6042391A (en) | 2000-03-28 |
CN1145216C (zh) | 2004-04-07 |
EP0951739A1 (en) | 1999-10-27 |
DE69736488D1 (de) | 2006-09-21 |
SE516011C2 (sv) | 2001-11-05 |
JP3954111B2 (ja) | 2007-08-08 |
SE9604677D0 (sv) | 1996-12-19 |
TW315518B (en) | 1997-09-11 |
DE69736488T2 (de) | 2007-03-15 |
CN1241297A (zh) | 2000-01-12 |
AU5505598A (en) | 1998-07-15 |
EP0951739B1 (en) | 2006-08-09 |
CA2275632A1 (en) | 1998-06-25 |
SE9604677L (sv) | 1998-06-20 |
WO1998027596A1 (en) | 1998-06-25 |
KR20000069419A (ko) | 2000-11-25 |
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