SE511139C2 - Plasmabearbetningsapparat med vridbara magneter - Google Patents
Plasmabearbetningsapparat med vridbara magneterInfo
- Publication number
- SE511139C2 SE511139C2 SE9704260A SE9704260A SE511139C2 SE 511139 C2 SE511139 C2 SE 511139C2 SE 9704260 A SE9704260 A SE 9704260A SE 9704260 A SE9704260 A SE 9704260A SE 511139 C2 SE511139 C2 SE 511139C2
- Authority
- SE
- Sweden
- Prior art keywords
- permanent magnet
- rotatable
- plasma processing
- magnetic
- plasma
- Prior art date
Links
- 230000005291 magnetic effect Effects 0.000 claims abstract description 92
- 230000033001 locomotion Effects 0.000 claims abstract description 27
- 230000006698 induction Effects 0.000 claims abstract description 24
- 230000004907 flux Effects 0.000 claims abstract description 7
- 230000036962 time dependent Effects 0.000 claims description 36
- 239000013077 target material Substances 0.000 claims description 22
- 238000010891 electric arc Methods 0.000 claims description 8
- 238000009826 distribution Methods 0.000 description 15
- 230000003628 erosive effect Effects 0.000 description 9
- 230000008859 change Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 238000010849 ion bombardment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910001172 neodymium magnet Inorganic materials 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 239000010406 cathode material Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000010584 magnetic trap Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 230000010349 pulsation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32055—Arc discharge
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9704260A SE511139C2 (sv) | 1997-11-20 | 1997-11-20 | Plasmabearbetningsapparat med vridbara magneter |
| CZ20001853A CZ298474B6 (cs) | 1997-11-20 | 1998-11-03 | Zarízení na zpracování plazmatem |
| DE69828904T DE69828904T3 (de) | 1997-11-20 | 1998-11-03 | Plasmabehandlungsgerät mit rotierenden magneten |
| JP2000522766A JP4491132B2 (ja) | 1997-11-20 | 1998-11-03 | プラズマ処理装置 |
| AU11820/99A AU1182099A (en) | 1997-11-20 | 1998-11-03 | Plasma processing apparatus having rotating magnets |
| PCT/SE1998/001983 WO1999027758A1 (en) | 1997-11-20 | 1998-11-03 | Plasma processing apparatus having rotating magnets |
| US09/554,666 US6351075B1 (en) | 1997-11-20 | 1998-11-03 | Plasma processing apparatus having rotating magnets |
| EP98954885A EP1033068B2 (en) | 1997-11-20 | 1998-11-03 | Plasma processing apparatus having rotating magnets |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9704260A SE511139C2 (sv) | 1997-11-20 | 1997-11-20 | Plasmabearbetningsapparat med vridbara magneter |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| SE9704260D0 SE9704260D0 (sv) | 1997-11-20 |
| SE9704260L SE9704260L (sv) | 1999-05-21 |
| SE511139C2 true SE511139C2 (sv) | 1999-08-09 |
Family
ID=20409052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE9704260A SE511139C2 (sv) | 1997-11-20 | 1997-11-20 | Plasmabearbetningsapparat med vridbara magneter |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6351075B1 (cs) |
| EP (1) | EP1033068B2 (cs) |
| JP (1) | JP4491132B2 (cs) |
| AU (1) | AU1182099A (cs) |
| CZ (1) | CZ298474B6 (cs) |
| DE (1) | DE69828904T3 (cs) |
| SE (1) | SE511139C2 (cs) |
| WO (1) | WO1999027758A1 (cs) |
Families Citing this family (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7067034B2 (en) * | 2000-03-27 | 2006-06-27 | Lam Research Corporation | Method and apparatus for plasma forming inner magnetic bucket to control a volume of a plasma |
| CZ296094B6 (cs) * | 2000-12-18 | 2006-01-11 | Shm, S. R. O. | Zarízení pro odparování materiálu k povlakování predmetu |
| SE525231C2 (sv) * | 2001-06-14 | 2005-01-11 | Chemfilt R & D Ab | Förfarande och anordning för att alstra plasma |
| US6777885B2 (en) | 2001-10-12 | 2004-08-17 | Semiconductor Energy Laboratory Co., Ltd. | Drive circuit, display device using the drive circuit and electronic apparatus using the display device |
| US6811657B2 (en) * | 2003-01-27 | 2004-11-02 | Micron Technology, Inc. | Device for measuring the profile of a metal film sputter deposition target, and system and method employing same |
| US6864773B2 (en) * | 2003-04-04 | 2005-03-08 | Applied Materials, Inc. | Variable field magnet apparatus |
| JP3508110B1 (ja) * | 2003-04-25 | 2004-03-22 | 卓三 岩田 | イオン化可能物質の活性化装置 |
| JP2006024775A (ja) * | 2004-07-08 | 2006-01-26 | Tokyo Electron Ltd | プラズマ処理装置、該装置の制御方法及び該方法を実行するプログラム |
| WO2006006637A1 (ja) | 2004-07-09 | 2006-01-19 | National Institute For Materials Science | 磁束配置(バランス型/アンバランス型)を切換可能としたマグネトロンスパッタリング装置とこの装置を用いた無機質薄膜体材料の成膜方法、及びデユアル形式のマグネトロンスパッタリング装置とこの装置による低温成膜を可能とした無機質薄膜体材料の成膜方法 |
| DE102005019101A1 (de) * | 2005-04-25 | 2006-10-26 | Steag Hama Tech Ag | Verfahren und Vorrichtung zum Beschichten von Substraten |
| CN100460557C (zh) * | 2005-09-28 | 2009-02-11 | 中芯国际集成电路制造(上海)有限公司 | 操作物理气相沉积工艺的方法与系统 |
| US20100126848A1 (en) * | 2005-10-07 | 2010-05-27 | Tohoku University | Magnetron sputtering apparatus |
| WO2007071719A1 (en) * | 2005-12-22 | 2007-06-28 | Oc Oerlikon Balzers Ag | Method of manufacturing at least one sputter-coated substrate and sputter source |
| CN101466862A (zh) * | 2006-06-08 | 2009-06-24 | 芝浦机械电子株式会社 | 磁控溅射磁体部件、磁控溅射装置和方法 |
| US10043642B2 (en) * | 2008-02-01 | 2018-08-07 | Oerlikon Surface Solutions Ag, Pfäffikon | Magnetron sputtering source and arrangement with adjustable secondary magnet arrangement |
| KR101009642B1 (ko) * | 2008-07-09 | 2011-01-19 | 삼성모바일디스플레이주식회사 | 자화 방지용 마그네트론 부 이송 장치 및 이를 갖는마그네트론 스퍼터링 설비 |
| US8698400B2 (en) * | 2009-04-28 | 2014-04-15 | Leybold Optics Gmbh | Method for producing a plasma beam and plasma source |
| EP2674513B1 (en) | 2009-05-13 | 2018-11-14 | SiO2 Medical Products, Inc. | Vessel coating and inspection |
| US9458536B2 (en) | 2009-07-02 | 2016-10-04 | Sio2 Medical Products, Inc. | PECVD coating methods for capped syringes, cartridges and other articles |
| KR20120085254A (ko) * | 2009-09-05 | 2012-07-31 | 제너럴 플라즈마, 인크. | 플라스마 증강 화학적 기상 증착 장치 |
| US11624115B2 (en) | 2010-05-12 | 2023-04-11 | Sio2 Medical Products, Inc. | Syringe with PECVD lubrication |
| DE112010005668T5 (de) | 2010-06-18 | 2013-05-02 | Mahle International Gmbh | Plasma-Verarbeitungsvorrichtung |
| WO2011156876A1 (en) * | 2010-06-18 | 2011-12-22 | Mahle Metal Leve S/A | Plasma processing device |
| US9878101B2 (en) | 2010-11-12 | 2018-01-30 | Sio2 Medical Products, Inc. | Cyclic olefin polymer vessels and vessel coating methods |
| US9272095B2 (en) | 2011-04-01 | 2016-03-01 | Sio2 Medical Products, Inc. | Vessels, contact surfaces, and coating and inspection apparatus and methods |
| US9378934B2 (en) * | 2011-05-30 | 2016-06-28 | Hitachi Metals, Ltd. | Racetrack-shaped magnetic-field-generating apparatus for magnetron sputtering |
| KR101241049B1 (ko) | 2011-08-01 | 2013-03-15 | 주식회사 플라즈마트 | 플라즈마 발생 장치 및 플라즈마 발생 방법 |
| KR101246191B1 (ko) * | 2011-10-13 | 2013-03-21 | 주식회사 윈텔 | 플라즈마 장치 및 기판 처리 장치 |
| US11116695B2 (en) | 2011-11-11 | 2021-09-14 | Sio2 Medical Products, Inc. | Blood sample collection tube |
| EP2776603B1 (en) | 2011-11-11 | 2019-03-06 | SiO2 Medical Products, Inc. | PASSIVATION, pH PROTECTIVE OR LUBRICITY COATING FOR PHARMACEUTICAL PACKAGE, COATING PROCESS AND APPARATUS |
| CA2887352A1 (en) | 2012-05-09 | 2013-11-14 | Sio2 Medical Products, Inc. | Saccharide protective coating for pharmaceutical package |
| US20150297800A1 (en) | 2012-07-03 | 2015-10-22 | Sio2 Medical Products, Inc. | SiOx BARRIER FOR PHARMACEUTICAL PACKAGE AND COATING PROCESS |
| JP6509734B2 (ja) | 2012-11-01 | 2019-05-08 | エスアイオーツー・メディカル・プロダクツ・インコーポレイテッド | 皮膜検査方法 |
| US9903782B2 (en) | 2012-11-16 | 2018-02-27 | Sio2 Medical Products, Inc. | Method and apparatus for detecting rapid barrier coating integrity characteristics |
| US9764093B2 (en) | 2012-11-30 | 2017-09-19 | Sio2 Medical Products, Inc. | Controlling the uniformity of PECVD deposition |
| BR112015012470B1 (pt) | 2012-11-30 | 2022-08-02 | Sio2 Medical Products, Inc | Método de produção de um tambor médico para um cartucho ou seringa médica |
| EP2778253B1 (de) * | 2013-02-26 | 2018-10-24 | Oerlikon Surface Solutions AG, Pfäffikon | Zylinderförmige Verdampfungsquelle |
| EP2961858B1 (en) | 2013-03-01 | 2022-09-07 | Si02 Medical Products, Inc. | Coated syringe. |
| KR102211788B1 (ko) | 2013-03-11 | 2021-02-04 | 에스아이오2 메디컬 프로덕츠, 인크. | 코팅된 패키징 |
| US9937099B2 (en) | 2013-03-11 | 2018-04-10 | Sio2 Medical Products, Inc. | Trilayer coated pharmaceutical packaging with low oxygen transmission rate |
| US9508532B2 (en) * | 2013-03-13 | 2016-11-29 | Bb Plasma Design Ab | Magnetron plasma apparatus |
| US20160017490A1 (en) | 2013-03-15 | 2016-01-21 | Sio2 Medical Products, Inc. | Coating method |
| CN103269555B (zh) * | 2013-04-28 | 2016-07-06 | 哈尔滨工业大学 | 用具零磁场区的磁场位形约束高温等离子体的系统和方法 |
| RU2554085C2 (ru) * | 2013-09-20 | 2015-06-27 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский государственный университет имени М.В. Ломоносова" (МГУ) | Способ нагрева электродов и создания самостоятельного дугового разряда с поджигом от тонкой металлической проволочки в свободном пространстве в магнитном поле |
| US11066745B2 (en) | 2014-03-28 | 2021-07-20 | Sio2 Medical Products, Inc. | Antistatic coatings for plastic vessels |
| US9550694B2 (en) * | 2014-03-31 | 2017-01-24 | Corning Incorporated | Methods and apparatus for material processing using plasma thermal source |
| US9533909B2 (en) | 2014-03-31 | 2017-01-03 | Corning Incorporated | Methods and apparatus for material processing using atmospheric thermal plasma reactor |
| US10410889B2 (en) | 2014-07-25 | 2019-09-10 | Applied Materials, Inc. | Systems and methods for electrical and magnetic uniformity and skew tuning in plasma processing reactors |
| RU2577040C2 (ru) * | 2014-07-29 | 2016-03-10 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский государственный университет имени М.В. Ломоносова" (МГУ) | Магнитный гаситель самостоятельного дугового разряда |
| JP6403269B2 (ja) * | 2014-07-30 | 2018-10-10 | 株式会社神戸製鋼所 | アーク蒸発源 |
| US20160200618A1 (en) | 2015-01-08 | 2016-07-14 | Corning Incorporated | Method and apparatus for adding thermal energy to a glass melt |
| CA3204930A1 (en) | 2015-08-18 | 2017-02-23 | Sio2 Medical Products, Inc. | Pharmaceutical and other packaging with low oxygen transmission rate |
| RU2614526C2 (ru) * | 2015-08-31 | 2017-03-28 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский государственный университет имени М.В. Ломоносова" (МГУ) | Способ отклонения тепловой кумулятивной струи расплавленного металла и образованного ей канала на металлической поверхности катода в дуговом импульсном разряде при взрыве проволочки между электродами действием поперечного магнитного поля |
| CA3027669A1 (en) * | 2016-06-21 | 2017-12-28 | Medident Technologies Inc. | Plasmaclave device |
| FR3079775B1 (fr) * | 2018-04-06 | 2021-11-26 | Addup | Dispositif de chauffage a confinement magnetique pour appareil de fabrication additive selective |
| CN111411338B (zh) * | 2020-04-07 | 2023-04-14 | 北京北方华创微电子装备有限公司 | 半导体设备中的磁力件结构以及半导体磁控溅射设备 |
| US11784033B2 (en) | 2021-05-28 | 2023-10-10 | Applied Materials, Inc. | Methods and apparatus for processing a substrate |
| CN118480675A (zh) * | 2024-07-09 | 2024-08-13 | 河南通达电缆股份有限公司 | 一种防止铜线氧化的退火系统及方法 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5143371A (en) * | 1974-10-12 | 1976-04-14 | Daido Steel Co Ltd | Netsushorihohooyobi netsushorisochi |
| US4588490A (en) * | 1985-05-22 | 1986-05-13 | International Business Machines Corporation | Hollow cathode enhanced magnetron sputter device |
| JPH02243762A (ja) † | 1989-03-17 | 1990-09-27 | Hitachi Ltd | スパッタ装置 |
| JPH02246216A (ja) | 1989-03-20 | 1990-10-02 | Hitachi Ltd | プラズマ装置 |
| JPH0688229A (ja) * | 1991-01-29 | 1994-03-29 | Boc Group Inc:The | 二重円筒マグネトロンに於けるスパッタリングターゲットの磁場ゾーン回転の電気制御 |
| JPH04346662A (ja) * | 1991-05-22 | 1992-12-02 | Ube Ind Ltd | スパッタリング方法およびその装置 |
| US5411624A (en) * | 1991-07-23 | 1995-05-02 | Tokyo Electron Limited | Magnetron plasma processing apparatus |
| JPH05148642A (ja) † | 1991-11-28 | 1993-06-15 | Hitachi Ltd | マグネトロンスパツタ装置 |
| NO174450C (no) * | 1991-12-12 | 1994-05-04 | Kvaerner Eng | Anordning ved plasmabrenner for kjemiske prosesser |
| JP3311064B2 (ja) * | 1992-03-26 | 2002-08-05 | 株式会社東芝 | プラズマ生成装置、表面処理装置および表面処理方法 |
| KR0127663B1 (ko) * | 1992-04-17 | 1998-04-01 | 모리시타 요이찌 | 플라즈마발생장치 및 플라즈마발생방법 |
| JPH06181187A (ja) * | 1992-12-11 | 1994-06-28 | Hitachi Ltd | スパッタリング装置 |
| US5399253A (en) * | 1992-12-23 | 1995-03-21 | Balzers Aktiengesellschaft | Plasma generating device |
| JPH06212420A (ja) | 1993-01-13 | 1994-08-02 | Shin Etsu Chem Co Ltd | スパッタ及びエッチング方法 |
| JP2704352B2 (ja) | 1993-01-22 | 1998-01-26 | 信越化学工業株式会社 | 磁場発生装置 |
| JP3174982B2 (ja) | 1993-03-27 | 2001-06-11 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP2970317B2 (ja) * | 1993-06-24 | 1999-11-02 | 松下電器産業株式会社 | スパッタリング装置及びスパッタリング方法 |
| US5518547A (en) * | 1993-12-23 | 1996-05-21 | International Business Machines Corporation | Method and apparatus for reducing particulates in a plasma tool through steady state flows |
| JP3124204B2 (ja) * | 1994-02-28 | 2001-01-15 | 株式会社東芝 | プラズマ処理装置 |
| ZA956811B (en) † | 1994-09-06 | 1996-05-14 | Boc Group Inc | Dual cylindrical target magnetron with multiple anodes |
| SE503141C2 (sv) * | 1994-11-18 | 1996-04-01 | Ladislav Bardos | Apparat för alstring av linjär ljusbågsurladdning för plasmabearbetning |
| JPH08319552A (ja) * | 1995-05-22 | 1996-12-03 | Nagata Tekko Kk | プラズマトーチおよびプラズマ溶射装置 |
-
1997
- 1997-11-20 SE SE9704260A patent/SE511139C2/sv not_active IP Right Cessation
-
1998
- 1998-11-03 JP JP2000522766A patent/JP4491132B2/ja not_active Expired - Fee Related
- 1998-11-03 WO PCT/SE1998/001983 patent/WO1999027758A1/en active IP Right Grant
- 1998-11-03 DE DE69828904T patent/DE69828904T3/de not_active Expired - Lifetime
- 1998-11-03 CZ CZ20001853A patent/CZ298474B6/cs not_active IP Right Cessation
- 1998-11-03 EP EP98954885A patent/EP1033068B2/en not_active Expired - Lifetime
- 1998-11-03 US US09/554,666 patent/US6351075B1/en not_active Expired - Lifetime
- 1998-11-03 AU AU11820/99A patent/AU1182099A/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| SE9704260D0 (sv) | 1997-11-20 |
| EP1033068A1 (en) | 2000-09-06 |
| DE69828904D1 (de) | 2005-03-10 |
| DE69828904T3 (de) | 2012-02-09 |
| WO1999027758A1 (en) | 1999-06-03 |
| US6351075B1 (en) | 2002-02-26 |
| DE69828904T2 (de) | 2006-01-12 |
| EP1033068B1 (en) | 2005-02-02 |
| JP2001524743A (ja) | 2001-12-04 |
| CZ298474B6 (cs) | 2007-10-10 |
| SE9704260L (sv) | 1999-05-21 |
| EP1033068B2 (en) | 2011-03-09 |
| AU1182099A (en) | 1999-06-15 |
| CZ20001853A3 (cs) | 2000-08-16 |
| JP4491132B2 (ja) | 2010-06-30 |
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