SE447735B - Forfarande for icke elektrolytisk avsettning av guld genom autokatalytisk kemisk reduktion - Google Patents

Forfarande for icke elektrolytisk avsettning av guld genom autokatalytisk kemisk reduktion

Info

Publication number
SE447735B
SE447735B SE7909259A SE7909259A SE447735B SE 447735 B SE447735 B SE 447735B SE 7909259 A SE7909259 A SE 7909259A SE 7909259 A SE7909259 A SE 7909259A SE 447735 B SE447735 B SE 447735B
Authority
SE
Sweden
Prior art keywords
gold
bath
salt
soluble
metal
Prior art date
Application number
SE7909259A
Other languages
English (en)
Swedish (sv)
Other versions
SE7909259L (sv
Inventor
P Prost-Tournier
C Allemmoz
Original Assignee
Engelhard Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Corp filed Critical Engelhard Corp
Publication of SE7909259L publication Critical patent/SE7909259L/
Publication of SE447735B publication Critical patent/SE447735B/sv

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Catalysts (AREA)
  • Colloid Chemistry (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
SE7909259A 1978-11-16 1979-11-08 Forfarande for icke elektrolytisk avsettning av guld genom autokatalytisk kemisk reduktion SE447735B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7832875A FR2441666A1 (fr) 1978-11-16 1978-11-16 Procede de depot chimique d'or par reduction autocatalytique

Publications (2)

Publication Number Publication Date
SE7909259L SE7909259L (sv) 1980-05-17
SE447735B true SE447735B (sv) 1986-12-08

Family

ID=9215161

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7909259A SE447735B (sv) 1978-11-16 1979-11-08 Forfarande for icke elektrolytisk avsettning av guld genom autokatalytisk kemisk reduktion

Country Status (15)

Country Link
US (1) US4307136A (it)
JP (1) JPS5585641A (it)
AT (1) AT368193B (it)
AU (1) AU537003B2 (it)
BE (1) BE880030A (it)
CA (1) CA1126592A (it)
CH (1) CH643596A5 (it)
DE (1) DE2946165A1 (it)
DK (1) DK156670C (it)
ES (1) ES485980A1 (it)
FR (1) FR2441666A1 (it)
GB (1) GB2035380B (it)
IT (1) IT1165369B (it)
NL (1) NL190902C (it)
SE (1) SE447735B (it)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3029785A1 (de) * 1980-08-04 1982-03-25 Schering Ag, 1000 Berlin Und 4619 Bergkamen Saures goldbad zur stromlosen abscheidung von gold
US4337091A (en) * 1981-03-23 1982-06-29 Hooker Chemicals & Plastics Corp. Electroless gold plating
US4474838A (en) * 1982-12-01 1984-10-02 Omi International Corporation Electroless direct deposition of gold on metallized ceramics
JPS6299477A (ja) * 1985-10-25 1987-05-08 C Uyemura & Co Ltd 無電解金めつき液
US4863766A (en) * 1986-09-02 1989-09-05 General Electric Company Electroless gold plating composition and method for plating
US4832743A (en) * 1986-12-19 1989-05-23 Lamerie, N.V. Gold plating solutions, creams and baths
DE3707817A1 (de) * 1987-03-09 1988-09-22 Schering Ag Stabilisiertes alkalisches goldbad zur stromlosen abscheidung von gold
DE3930199A1 (de) * 1989-09-09 1991-03-14 Ptr Praezisionstech Gmbh Elektronenstrahlerzeuger, insbesondere fuer eine elektronenstrahlkanone
JP2866676B2 (ja) * 1989-09-18 1999-03-08 株式会社日立製作所 無電解金めっき液及びそれを用いた金めっき方法
JP2538461B2 (ja) * 1991-02-22 1996-09-25 奥野製薬工業株式会社 無電解金めっき方法
JP2927142B2 (ja) * 1993-03-26 1999-07-28 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
US5803957A (en) * 1993-03-26 1998-09-08 C. Uyemura & Co.,Ltd. Electroless gold plating bath
JP3331261B2 (ja) * 1994-08-19 2002-10-07 日本エレクトロプレイテイング・エンジニヤース株式会社 無電解金めっき液
JP3302512B2 (ja) * 1994-08-19 2002-07-15 日本エレクトロプレイテイング・エンジニヤース株式会社 無電解金めっき液
JP5526459B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5526458B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
CN113151814B (zh) * 2021-02-05 2022-02-01 深圳市联合蓝海黄金材料科技股份有限公司 无氰化学镀金液用组合物及其应用和无氰化学镀金液及其应用
JP7169020B1 (ja) * 2021-12-27 2022-11-10 石原ケミカル株式会社 還元型無電解インジウムメッキ浴

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3468676A (en) * 1963-09-09 1969-09-23 Photocircuits Corp Electroless gold plating
FR1369175A (fr) * 1963-09-12 1964-08-07 Western Electric Co Placage par de l'or de la surface d'un corps
US3589916A (en) * 1964-06-24 1971-06-29 Photocircuits Corp Autocatalytic gold plating solutions
DE1771258A1 (de) * 1968-04-26 1971-12-23 Ibm Deutschland Verfahren zum Aufbringen von Gold auf poroese nichtleitende Koerper oder Glas
DE1925648C3 (de) * 1969-05-20 1978-11-30 Electro Chemical Engineering Gmbh, Zug (Schweiz) Verfahren zum stromlosen Erzeugen von Metallüberzügen
US3700469A (en) * 1971-03-08 1972-10-24 Bell Telephone Labor Inc Electroless gold plating baths
JPS503743A (it) * 1973-05-16 1975-01-16
US3917885A (en) * 1974-04-26 1975-11-04 Engelhard Min & Chem Electroless gold plating process
US4019128A (en) * 1975-05-08 1977-04-19 Rees, Inc. Indicator light and testing circuit
US4005229A (en) * 1975-06-23 1977-01-25 Ppg Industries, Inc. Novel method for the rapid deposition of gold films onto non-metallic substrates at ambient temperatures
JPS5948951B2 (ja) * 1978-08-05 1984-11-29 日本特殊陶業株式会社 無電解金メッキ液

Also Published As

Publication number Publication date
BE880030A (fr) 1980-03-03
DK156670C (da) 1990-02-12
JPH0219190B2 (it) 1990-04-27
DK485579A (da) 1980-05-17
ES485980A1 (es) 1980-05-16
US4307136A (en) 1981-12-22
FR2441666A1 (fr) 1980-06-13
IT1165369B (it) 1987-04-22
ATA720879A (de) 1982-01-15
IT7927258A0 (it) 1979-11-13
AU537003B2 (en) 1984-05-31
AU5291379A (en) 1980-05-22
NL7908296A (nl) 1980-05-20
GB2035380B (en) 1983-02-09
AT368193B (de) 1982-09-27
GB2035380A (en) 1980-06-18
FR2441666B1 (it) 1981-05-08
NL190902C (nl) 1994-10-17
DK156670B (da) 1989-09-18
CA1126592A (fr) 1982-06-29
SE7909259L (sv) 1980-05-17
NL190902B (nl) 1994-05-16
DE2946165C2 (it) 1989-09-07
JPS5585641A (en) 1980-06-27
CH643596A5 (fr) 1984-06-15
DE2946165A1 (de) 1980-06-12

Similar Documents

Publication Publication Date Title
SE447735B (sv) Forfarande for icke elektrolytisk avsettning av guld genom autokatalytisk kemisk reduktion
US4337091A (en) Electroless gold plating
US3338726A (en) Chemical reduction plating process and bath
DE2049061C3 (de) Alkalisches wäßriges Bad und dessen Verwendung zur stromlosen Verkupferung
CN101260549B (zh) 一种无预镀型无氰镀银电镀液
US3983266A (en) Method for applying metallic silver to a substrate
KR101821852B1 (ko) 코발트 합금의 무전해 석출을 위한 알칼리성 도금조
JPH0160550B2 (it)
JP2002180259A (ja) めっき液における金属析出促進化合物および該化合物を含むめっき液
DE3320308A1 (de) Waessriges bad zur stromlosen abscheidung von gold und ein verfahren zur stromlosen abscheidung von gold unter verwendung dieses bades
GB1286941A (en) Chemical reduction copper plating
US4838937A (en) Stabilized alkaline gold bath for the electro-less deposition of gold
US3915718A (en) Chemical silver bath
DE2346616B2 (de) Bad zum stromlosen abscheiden von duktilem kupfer
EP1198623B1 (de) Verfahren zur herstellung einer cyanidfreien, für galvanische gold-bäder geeigneten goldverbindungslösung
JPS60125379A (ja) 無電解金めっき液
GB842826A (en) Improvements in or relating to chemical plating
JP2635026B2 (ja) 無電解金めつき液
JP2967106B2 (ja) 電子部品の製造方法
JPS60121274A (ja) 自己触媒型無電解金めっき液
US3677776A (en) Electroless plating solutions for cadmium and cadmium copper alloys
DE2057756A1 (de) Schemisches Silberbad
JPS58133367A (ja) 無電解金メツキ用水溶液と無電解金メツキ法
US4124399A (en) Stabilized electroless plating solutions
US3639484A (en) Preparation of 1-thioalditols 1-thioalditol disulfides and related hydroxy thiols

Legal Events

Date Code Title Description
NAL Patent in force

Ref document number: 7909259-9

Format of ref document f/p: F

NUG Patent has lapsed

Ref document number: 7909259-9

Format of ref document f/p: F