DK156670C - Fremgangsmaade til ikke elektrolytisk udfaeldning af guld ved autokatalytisk kemisk reduktion - Google Patents

Fremgangsmaade til ikke elektrolytisk udfaeldning af guld ved autokatalytisk kemisk reduktion

Info

Publication number
DK156670C
DK156670C DK485579A DK485579A DK156670C DK 156670 C DK156670 C DK 156670C DK 485579 A DK485579 A DK 485579A DK 485579 A DK485579 A DK 485579A DK 156670 C DK156670 C DK 156670C
Authority
DK
Denmark
Prior art keywords
gold
procedure
chemical reduction
electrolytic deposition
autocatalytic chemical
Prior art date
Application number
DK485579A
Other languages
English (en)
Other versions
DK156670B (da
DK485579A (da
Inventor
Patrick Prost-Tournier
Christiane Allemmoz
Original Assignee
Engelhard Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Corp filed Critical Engelhard Corp
Publication of DK485579A publication Critical patent/DK485579A/da
Publication of DK156670B publication Critical patent/DK156670B/da
Application granted granted Critical
Publication of DK156670C publication Critical patent/DK156670C/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Colloid Chemistry (AREA)
  • Catalysts (AREA)
DK485579A 1978-11-16 1979-11-15 Fremgangsmaade til ikke elektrolytisk udfaeldning af guld ved autokatalytisk kemisk reduktion DK156670C (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR7832875 1978-11-16
FR7832875A FR2441666A1 (fr) 1978-11-16 1978-11-16 Procede de depot chimique d'or par reduction autocatalytique

Publications (3)

Publication Number Publication Date
DK485579A DK485579A (da) 1980-05-17
DK156670B DK156670B (da) 1989-09-18
DK156670C true DK156670C (da) 1990-02-12

Family

ID=9215161

Family Applications (1)

Application Number Title Priority Date Filing Date
DK485579A DK156670C (da) 1978-11-16 1979-11-15 Fremgangsmaade til ikke elektrolytisk udfaeldning af guld ved autokatalytisk kemisk reduktion

Country Status (15)

Country Link
US (1) US4307136A (da)
JP (1) JPS5585641A (da)
AT (1) AT368193B (da)
AU (1) AU537003B2 (da)
BE (1) BE880030A (da)
CA (1) CA1126592A (da)
CH (1) CH643596A5 (da)
DE (1) DE2946165A1 (da)
DK (1) DK156670C (da)
ES (1) ES485980A1 (da)
FR (1) FR2441666A1 (da)
GB (1) GB2035380B (da)
IT (1) IT1165369B (da)
NL (1) NL190902C (da)
SE (1) SE447735B (da)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3029785A1 (de) * 1980-08-04 1982-03-25 Schering Ag, 1000 Berlin Und 4619 Bergkamen Saures goldbad zur stromlosen abscheidung von gold
US4337091A (en) * 1981-03-23 1982-06-29 Hooker Chemicals & Plastics Corp. Electroless gold plating
US4474838A (en) * 1982-12-01 1984-10-02 Omi International Corporation Electroless direct deposition of gold on metallized ceramics
JPS6299477A (ja) * 1985-10-25 1987-05-08 C Uyemura & Co Ltd 無電解金めつき液
US4863766A (en) * 1986-09-02 1989-09-05 General Electric Company Electroless gold plating composition and method for plating
US4832743A (en) * 1986-12-19 1989-05-23 Lamerie, N.V. Gold plating solutions, creams and baths
DE3707817A1 (de) * 1987-03-09 1988-09-22 Schering Ag Stabilisiertes alkalisches goldbad zur stromlosen abscheidung von gold
DE3930199A1 (de) * 1989-09-09 1991-03-14 Ptr Praezisionstech Gmbh Elektronenstrahlerzeuger, insbesondere fuer eine elektronenstrahlkanone
JP2866676B2 (ja) * 1989-09-18 1999-03-08 株式会社日立製作所 無電解金めっき液及びそれを用いた金めっき方法
JP2538461B2 (ja) * 1991-02-22 1996-09-25 奥野製薬工業株式会社 無電解金めっき方法
US5803957A (en) * 1993-03-26 1998-09-08 C. Uyemura & Co.,Ltd. Electroless gold plating bath
JP2927142B2 (ja) * 1993-03-26 1999-07-28 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP3302512B2 (ja) * 1994-08-19 2002-07-15 日本エレクトロプレイテイング・エンジニヤース株式会社 無電解金めっき液
JP3331261B2 (ja) * 1994-08-19 2002-10-07 日本エレクトロプレイテイング・エンジニヤース株式会社 無電解金めっき液
JP5526459B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5526458B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
CN113151814B (zh) * 2021-02-05 2022-02-01 深圳市联合蓝海黄金材料科技股份有限公司 无氰化学镀金液用组合物及其应用和无氰化学镀金液及其应用
JP7169020B1 (ja) * 2021-12-27 2022-11-10 石原ケミカル株式会社 還元型無電解インジウムメッキ浴

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3468676A (en) * 1963-09-09 1969-09-23 Photocircuits Corp Electroless gold plating
FR1369175A (fr) * 1963-09-12 1964-08-07 Western Electric Co Placage par de l'or de la surface d'un corps
US3589916A (en) * 1964-06-24 1971-06-29 Photocircuits Corp Autocatalytic gold plating solutions
DE1771258A1 (de) * 1968-04-26 1971-12-23 Ibm Deutschland Verfahren zum Aufbringen von Gold auf poroese nichtleitende Koerper oder Glas
DE1925648C3 (de) * 1969-05-20 1978-11-30 Electro Chemical Engineering Gmbh, Zug (Schweiz) Verfahren zum stromlosen Erzeugen von Metallüberzügen
US3700469A (en) * 1971-03-08 1972-10-24 Bell Telephone Labor Inc Electroless gold plating baths
JPS503743A (da) * 1973-05-16 1975-01-16
US3917885A (en) * 1974-04-26 1975-11-04 Engelhard Min & Chem Electroless gold plating process
US4019128A (en) * 1975-05-08 1977-04-19 Rees, Inc. Indicator light and testing circuit
US4005229A (en) * 1975-06-23 1977-01-25 Ppg Industries, Inc. Novel method for the rapid deposition of gold films onto non-metallic substrates at ambient temperatures
JPS5948951B2 (ja) * 1978-08-05 1984-11-29 日本特殊陶業株式会社 無電解金メッキ液

Also Published As

Publication number Publication date
SE447735B (sv) 1986-12-08
NL7908296A (nl) 1980-05-20
DE2946165C2 (da) 1989-09-07
IT1165369B (it) 1987-04-22
BE880030A (fr) 1980-03-03
AT368193B (de) 1982-09-27
CA1126592A (fr) 1982-06-29
US4307136A (en) 1981-12-22
DK156670B (da) 1989-09-18
DK485579A (da) 1980-05-17
DE2946165A1 (de) 1980-06-12
JPH0219190B2 (da) 1990-04-27
FR2441666A1 (fr) 1980-06-13
NL190902B (nl) 1994-05-16
AU5291379A (en) 1980-05-22
SE7909259L (sv) 1980-05-17
GB2035380B (en) 1983-02-09
ATA720879A (de) 1982-01-15
JPS5585641A (en) 1980-06-27
AU537003B2 (en) 1984-05-31
CH643596A5 (fr) 1984-06-15
ES485980A1 (es) 1980-05-16
NL190902C (nl) 1994-10-17
GB2035380A (en) 1980-06-18
IT7927258A0 (it) 1979-11-13
FR2441666B1 (da) 1981-05-08

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