RU2502154C1 - Поперечное рассеивание тепла 3-d интегральной схемы - Google Patents

Поперечное рассеивание тепла 3-d интегральной схемы Download PDF

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Publication number
RU2502154C1
RU2502154C1 RU2012118036/28A RU2012118036A RU2502154C1 RU 2502154 C1 RU2502154 C1 RU 2502154C1 RU 2012118036/28 A RU2012118036/28 A RU 2012118036/28A RU 2012118036 A RU2012118036 A RU 2012118036A RU 2502154 C1 RU2502154 C1 RU 2502154C1
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Russia
Prior art keywords
heat
crystal
crystals
conducting material
layers
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RU2012118036/28A
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English (en)
Russian (ru)
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RU2012118036A (ru
Inventor
Кеннет КАСКУН
Шицюнь ГУ
Мэттью М. НОВАК
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Квэлкомм Инкорпорейтед
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Publication of RU2012118036A publication Critical patent/RU2012118036A/ru
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/288—Configurations of stacked chips characterised by arrangements for thermal management of the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
RU2012118036/28A 2008-05-05 2009-04-27 Поперечное рассеивание тепла 3-d интегральной схемы RU2502154C1 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/115,076 2008-05-05
US12/115,076 US8502373B2 (en) 2008-05-05 2008-05-05 3-D integrated circuit lateral heat dissipation

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
RU2010149596/28A Division RU2459315C1 (ru) 2008-05-05 2009-04-27 Поперечное рассеивание тепла 3-d интегральной схемы

Publications (2)

Publication Number Publication Date
RU2012118036A RU2012118036A (ru) 2013-11-10
RU2502154C1 true RU2502154C1 (ru) 2013-12-20

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RU2012118036/28A RU2502154C1 (ru) 2008-05-05 2009-04-27 Поперечное рассеивание тепла 3-d интегральной схемы
RU2010149596/28A RU2459315C1 (ru) 2008-05-05 2009-04-27 Поперечное рассеивание тепла 3-d интегральной схемы

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Country Status (11)

Country Link
US (1) US8502373B2 (https=)
EP (1) EP2286452A1 (https=)
JP (3) JP2011520286A (https=)
KR (1) KR101255675B1 (https=)
CN (2) CN102017139B (https=)
BR (1) BRPI0912376A2 (https=)
CA (1) CA2720966C (https=)
MX (1) MX2010011848A (https=)
RU (2) RU2502154C1 (https=)
TW (1) TWI496269B (https=)
WO (1) WO2009137286A1 (https=)

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US11211364B1 (en) * 2020-06-24 2021-12-28 Micron Technology, Inc. Semiconductor device assemblies and systems with improved thermal performance and methods for making the same
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Also Published As

Publication number Publication date
CN102017139B (zh) 2013-05-08
US20090273068A1 (en) 2009-11-05
KR20110004475A (ko) 2011-01-13
CA2720966A1 (en) 2009-11-12
JP5788379B2 (ja) 2015-09-30
MX2010011848A (es) 2010-11-30
RU2459315C1 (ru) 2012-08-20
JP2015167259A (ja) 2015-09-24
BRPI0912376A2 (en) 2018-02-27
JP2013077837A (ja) 2013-04-25
RU2012118036A (ru) 2013-11-10
US8502373B2 (en) 2013-08-06
EP2286452A1 (en) 2011-02-23
CN103219328A (zh) 2013-07-24
CA2720966C (en) 2015-06-30
TW201005917A (en) 2010-02-01
TWI496269B (zh) 2015-08-11
RU2010149596A (ru) 2012-06-20
JP2011520286A (ja) 2011-07-14
CN102017139A (zh) 2011-04-13
KR101255675B1 (ko) 2013-04-17
CN103219328B (zh) 2017-04-12
WO2009137286A1 (en) 2009-11-12

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